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    • 2. 发明公开
    • 포토마스크의 제조방법
    • 制造光电子的方法
    • KR1020120007571A
    • 2012-01-25
    • KR1020100065593
    • 2010-07-07
    • 에스케이하이닉스 주식회사
    • 박의상
    • H01L21/027G03F1/68G03F7/20
    • H01L21/0337G03F1/50G03F1/68G03F7/2063H01L21/0273H01L21/0274
    • PURPOSE: A method for manufacturing a photo mask is provided to accurately implement a mask pattern by preventing an exposure position error. CONSTITUTION: A mask material film(205) and a resist film(210) are formed on a substrate. A ground layer(215) is connected to the mask material film and covers the upper side and the lateral side of the resist film. An exposure process is performed by radiating electron beams to the substrate. The resist film is hardened. The ground layer is removed. A resist pattern is formed by selectively removing the reactive part of the resist film. A mask pattern is formed by etching the exposed part of the mask material film using the resist pattern as a mask.
    • 目的:提供一种用于制造光掩模的方法,以通过防止曝光位置误差来精确地实现掩模图案。 构成:在基板上形成掩模材料膜(205)和抗蚀剂膜(210)。 接地层(215)连接到掩模材料膜并覆盖抗蚀剂膜的上侧和外侧。 通过向基板辐射电子束来进行曝光处理。 抗蚀剂膜硬化。 地层被去除。 通过选择性地除去抗蚀剂膜的反应性部分形成抗蚀剂图案。 通过使用抗蚀剂图案作为掩模蚀刻掩模材料膜的暴露部分来形成掩模图案。
    • 3. 发明公开
    • 위상반전 마스크 및 그 제조방법
    • 相移片及其制造方法
    • KR1020100134448A
    • 2010-12-23
    • KR1020090053072
    • 2009-06-15
    • 에스케이하이닉스 주식회사
    • 박의상
    • G03F1/26H01L21/027
    • G03F1/26G03F1/0046G03F1/54G03F1/76
    • PURPOSE: A method for fabricating a phase shift mask is provided to shorten processing time by simplifying a manufacturing process and to suppress defects caused by contamination. CONSTITUTION: A method for fabricating a phase shift mask comprises the steps of: successively forming a phase shift layer, a first resist layer, a light-blocking layer and a second resist layer on a transparent substrate(200); patterning the second resist film in order to define a region in which the phase shift layer pattern is formed; patterning the light-blocking layer, the first resist layer, and the shift layer as the patterned second resist layer; exposing the first resist film formed on a region excluding the light-blocking region; and removing the exposed first resist layer and the light-blocking layer formed on the region excluding the light-blocking region.
    • 目的:提供一种制造相移掩模的方法,通过简化制造工艺并抑制由污染引起的缺陷来缩短处理时间。 构成:制造相移掩模的方法包括以下步骤:在透明基板(200)上依次形成相移层,第一抗蚀剂层,遮光层和第二抗蚀剂层; 图案化第二抗蚀剂膜以限定其中形成相移层图案的区域; 图案化阻光层,第一抗蚀剂层和移位层作为图案化的第二抗蚀剂层; 曝光形成在除了遮光区域之外的区域上的第一抗蚀膜; 以及除去形成在除了遮光区域之外的区域上的暴露的第一抗蚀剂层和遮光层。
    • 4. 发明公开
    • 바이너리 포토마스크 및 그 제조방법
    • 二进制照片掩模及其制造方法
    • KR1020110077982A
    • 2011-07-07
    • KR1020090134685
    • 2009-12-30
    • 에스케이하이닉스 주식회사
    • 박의상
    • G03F1/08H01L21/027
    • G03F1/54G03F1/80H01L21/0332H01L21/0337
    • PURPOSE: A binary photo-mask and a method for manufacturing the same are provided to obtain the desired resolution and line-width by protecting a light transmitting substrate from an etching process. CONSTITUTION: A first light shielding film, an auxiliary light shielding film, and a second light shielding film are formed on a light transmitting substrate(100). The second light shielding film is patterned to form a second light shielding pattern(132) using a resist film pattern as an etching mask. The auxiliary light shielding film exposed through the second light shielding pattern is etched to form an auxiliary light shielding pattern(122). The first light shielding film exposed through the auxiliary light shielding pattern is eliminated.
    • 目的:提供二元照相掩模及其制造方法,以通过保护透光基板免受蚀刻处理而获得期望的分辨率和线宽。 构成:在透光基板(100)上形成第一遮光膜,辅助遮光膜和第二遮光膜。 图案化第二遮光膜以形成使用抗蚀剂膜图案作为蚀刻掩模的第二遮光图案(132)。 通过第二遮光图案曝光的辅助遮光膜被蚀刻以形成辅助遮光图案(122)。 消除了通过辅助光屏蔽图案曝光的第一遮光膜。
    • 5. 发明公开
    • 포토마스크의 선폭 균일도 보정 방법
    • 用于校正光子中关键均匀性的方法
    • KR1020100127666A
    • 2010-12-06
    • KR1020090046196
    • 2009-05-26
    • 에스케이하이닉스 주식회사
    • 박의상
    • H01L21/027G03F7/20
    • G03F1/72G03F1/70G03F1/84G03F7/70433H01J37/3174
    • PURPOSE: A method for correcting the critical dimension(CD) uniformity of a photo-mask is provided to improve the CD uniformity by forming a correcting map using an energy strength distribution model and reflecting the correcting map to an exposure process. CONSTITUTION: The CD uniformity of a mask pattern is measured(S100). A CD defect part on the CD uniformity is detected(S110). The CD defect part is converted into a measuring unit for electric beam lithography in order to form a CD map(S120). A CD value is extracted based on the CD map(S130). The extracted CD value is converted to dose(S140). A dose map is generated(S150). An exposure process is performed using the dose map(S160).
    • 目的:提供一种用于校正光掩模的临界尺寸(CD)均匀性的方法,以通过使用能量强度分布模型形成校正图并将校正图反映到曝光处理来提高CD均匀性。 构成:测量掩模图案的CD均匀性(S100)。 检测到CD均匀性的CD缺陷部分(S110)。 将CD缺陷部分转换成用于电子束光刻的测量单元以形成CD映射(S120)。 基于CD映射提取CD值(S130)。 将提取的CD值转换为剂量(S140)。 生成剂量图(S150)。 使用剂量图进行曝光处理(S160)。