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1. 发明公开

KR1020080086263A 반도체 칩 패키징 장치 无效
标题翻译：半导体芯片包装设备
公开(公告)号：KR1020080086263A
公开(公告)日：2008-09-25
申请号：KR1020070028238
申请日：2007-03-22
申请人： 삼성전자주식회사
发明人： 한상훈 , 나병도 , 서희주
IPC分类号： H01L21/56
摘要： A semiconductor chip packaging apparatus is provided to remove a leaked molding material, which is excessively sealed in a sprocket hole of a substrate, by lowering a cutting member. A semiconductor chip packaging apparatus comprises an upper body(100), a lower body(200), and a position guider(300). The upper body includes a cutting member(110). The lower body is installed opposite to the upper body and includes a loading unit(210). The loading unit is configured to load a package carrier(500) having a leaked molding material(520) to be removed by the cutting member. The position guider adjusts the distance between the upper body and the lower body, guiding the movement of the cutting member. The cutting member is a strip knife or a strip wire.
摘要翻译：提供一种半导体芯片封装装置，通过降低切割构件来去除过度密封在基板的链轮孔中的泄漏的模制材料。半导体芯片封装装置包括上主体（100），下体（200）和位置导向器（300）。上身包括切割构件（110）。下体与上体相对设置并包括加载单元（210）。装载单元被配置为装载具有泄漏的模制材料（520）的包装载体（500），以被切割构件去除。位置导向器调节上身和下身之间的距离，引导切割构件的移动。切割构件是带状刀或带状线。

2. 发明公开

KR1020040054080A 자동성형 장치 无效
标题翻译：自动成型设备
公开(公告)号：KR1020040054080A
公开(公告)日：2004-06-25
申请号：KR1020020080729
申请日：2002-12-17
申请人： 삼성전자주식회사
发明人： 이대성 , 박경수 , 서희주 , 이성수
IPC分类号： H01L21/56
摘要： PURPOSE: An automatic molding apparatus is provided to easily replace a unit part according to the kind of a semiconductor device for a short time. CONSTITUTION: An automatic molding apparatus is provided with a lead frame shifter(110) for transferring a lead frame to the operation position of a loader part, a tablet lift for transferring a tablet to a mold press, and a tablet shutter. And, the lead frame shifter includes a screw thread formed at its one end portion, and a coupler(17) for connecting the screw thread to a frame(11). The coupler includes a coupler body(13) spaced apart from the screw thread, a protrusion(14) protruded from the coupler body by elastic force, and a fixing cover(15). The fixing cover has a groove corresponding to the protrusion.
摘要翻译：目的：提供一种自动模制装置，用于在短时间内根据半导体装置的种类容易地更换单元部件。构成：一种自动成型装置设有引线框移动器（110），用于将引线框架传送到装载部件的操作位置，用于将平板电脑传送到模压机的平板电梯和平板闸板。并且，引线框架移位器包括在其一个端部处形成的螺纹，以及用于将螺纹连接到框架（11）的联接器（17）。耦合器包括与螺纹间隔开的耦合器主体（13），通过弹力从联接器主体突出的突出部（14）和固定盖（15）。固定盖具有对应于突起的凹槽。

3. 发明公开

KR1020040019533A 하형 금형 보조판을 구비한 반도체 성형 금형 无效
标题翻译：具有空间板的半导体模具
公开(公告)号：KR1020040019533A
公开(公告)日：2004-03-06
申请号：KR1020020051106
申请日：2002-08-28
申请人： 삼성전자주식회사
发明人： 이대성 , 박경수 , 서희주 , 이성수
IPC分类号： H01L21/56
摘要： PURPOSE: A semiconductor mold die having a space plate is provided to be capable of reducing replacement time and preventing the loss of energy due to a re-heating process of the frame. CONSTITUTION: A semiconductor molding frame is provided with a chase housing(103), and a space plate(107) and a cavity block(108) installed at the upper portion of the chase housing. The semiconductor molding frame further includes an ejector pin plate(102) located at the lower portion of the chase housing for supporting an ejector pin(109) in moving downward and a drive plate(101) located at the lower portion of the ejector pin plate for supporting the ejector pin in moving upward. Preferably, the space plate is fixed to the cavity block by using a space fixing screw(401).
摘要翻译：目的：提供具有间隔板的半导体模具，以能够减少更换时间并防止由于框架的再加热过程而导致的能量损失。构成：半导体模制框架设置有追逐壳体（103）和安装在追逐壳体的上部的空间板（107）和空腔块（108）。所述半导体模制框架还包括位于所述追逐壳体的下部的推顶销板（102），用于支撑向下移动的顶针（109）和位于所述顶针板的下部的驱动板（101）用于支撑顶针向上移动。优选地，空间板通过使用空间固定螺钉（401）固定到空腔块。

4. 发明公开

KR1020000001534A 성형 수지 태블릿 이송 장치 无效
标题翻译：模塑树脂纸转印装置
公开(公告)号：KR1020000001534A
公开(公告)日：2000-01-15
申请号：KR1019980021857
申请日：1998-06-12
申请人： 삼성전자주식회사
发明人： 서희주 , 마영환 , 이성수 , 정인효
IPC分类号： H01L21/56
摘要： PURPOSE: A molded resin tablet transfer apparatus is provided to have a collection unit for recycling a molded resin tablet which is set in a discharge box. CONSTITUTION: The molded resin tablet transfer apparatus comprises: a unit for arranging the predetermined number of molded resin tablets(111) to supply the arranged tablets; a transfer unit(114) for shifting the molded resin tablets thus supplied to a predetermined place; a storage unit(120) for collecting molded resin tablets not shifted to the predetermined place; and a collection unit(130) connected to the storage unit, for sucking the molded resin tablet in the storage unit by use of a vacuum to transmit the sucked molded resin tablet to the supplying unit.
摘要翻译：目的：提供一种成型树脂片剂输送装置，其具有用于再循环设置在放电箱中的模制树脂片的收集单元。构成：成型树脂片转移装置包括：用于布置预定数量的模制树脂片（111）以供应布置的片剂的单元; 转移单元（114），用于将如此提供的模制树脂片移动到预定位置; 存储单元（120），用于收集未移动到所述预定位置的模制树脂片; 以及收集单元（130），其连接到所述存储单元，用于通过使用真空将所述模制树脂片吸收到所述存储单元中，以将所吸收的模制树脂片材传送到所述供应单元。

5. 发明公开

KR1020070105138A 반도체 패키지의 싱귤레이션 장치 및 방법 无效
标题翻译：用于半导体芯片封装的单机设备和方法
公开(公告)号：KR1020070105138A
公开(公告)日：2007-10-30
申请号：KR1020060037220
申请日：2006-04-25
申请人： 삼성전자주식회사
发明人： 장상호 , 이도우 , 강희철 , 정옥선 , 김용환 , 서희주
IPC分类号： H01L23/12
CPC分类号： H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L21/78 , H01L21/67121 , H01L23/29
摘要： A singulation apparatus and method for a semiconductor package is provided to prevent crack from being generated on a circuit board by guiding the crack towards a notch when a circuit board is cut in the other axial direction. A singulation includes a first axis cutting part for cutting a circuit board in a first axial direction and a second axis cutting part for cutting the circuit board in a second axial direction perpendicular to the first axis. A notch punch is mounted on the first axis cutting part to form a notch(71) on the circuit board in the second axial direction. When the circuit board is cut in the first axial direction, the notch is simultaneously formed on the circuit board in the second axial direction.
摘要翻译：提供一种用于半导体封装的分割装置和方法，以在电路板在另一个轴向方向上切割时，通过将裂纹引向凹口来防止在电路板上产生裂纹。分割单元包括用于沿第一轴向切割电路板的第一轴线切割部分和用于在垂直于第一轴线的第二轴向上切割电路板的第二轴线切割部分。在第一轴切削部上安装有切口冲头，以在第二轴向上在电路板上形成切口（71）。当电路板沿第一轴向切割时，在电路板上沿第二轴向方向同时形成凹口。

6. 发明公开

KR1020060070141A 클리닝 핀을 갖는 반도체 칩 패키지 몰딩 장치 无效
标题翻译：具有清洁针的半导体芯片包装模具
公开(公告)号：KR1020060070141A
公开(公告)日：2006-06-23
申请号：KR1020040108784
申请日：2004-12-20
申请人： 삼성전자주식회사
发明人： 서희주 , 이도우 , 강희철 , 정은영
IPC分类号： H01L21/56
摘要： 본 발명은 반도체 칩이 기판에 실장되어 와이어본딩이 완료된 패키지 반제품이 사이에 개재되며, 에폭시 몰딩 컴파운드가 유입되는 복수의 캐버티가 형성되어 있고, 상기 캐버티에 진공 흡입력을 인가시키는 진공 구멍이 형성되어 있으며, 상기 패키지 반제품을 상기 캐버티로부터 분리시키는 이젝트 핀을 포함하는 상부 금형 어셈블리와 하부 금형 어셈블리를 포함하는 반도체 칩 패키지 몰딩 장치에 있어서, 각각의 상기 진공 구멍에 대응되는 위치에서 수직으로 운동되는 클리닝 핀을 갖는 것을 특징으로 한다. 본 발명에 따른 반도체 칩 패키지 몰딩 장치에 구조에 의하면, 몰딩이 완료된 패키지 반제품을 분리하기 위하여 이젝트 핀이 상승될 때 클리닝 핀이 상승되어 진공 구멍의 오염 물질 제거가 이루어지며, 클리닝 공정 후에 클리닝 핀이 상승되면서 진공 구멍 내의 이물질 제거가 이루어진다. 이와 같이 패키지 반제품을 흡착 고정시키는 진공 구멍에 대한 클리닝이 자동으로 그리고 지속적으로 이루어짐으로써 정상적인 진공 흡입력이 패키지 반제품에 가해질 수 있어 생산성 향상 및 몰딩 품질이 향상되는 효과를 얻을 수 있다.
반도체, 몰딩, 패키지, 금형, 클리닝, 진공 흡착

7. 发明公开

KR1020030008618A 성형 장치용 리드 프레임 이송 장치 无效
标题翻译：用于成型设备的导框传送装置
公开(公告)号：KR1020030008618A
公开(公告)日：2003-01-29
申请号：KR1020010043448
申请日：2001-07-19
申请人： 삼성전자주식회사
发明人： 서희주 , 이성수 , 김병호 , 박현우
IPC分类号： H01L21/60
摘要： PURPOSE: A lead frame transferring apparatus for a molding apparatus is provided to prevent a damage of a lead frame of a transferring portion due to a clamp by using a contact sensor for detecting a position of the transferring portion. CONSTITUTION: A load unit(60) is used for transferring a lead frame to a molding apparatus. The load unit(60) is formed with a load block(61), a guide block(64), and a clamp. The guide block(64) is installed at a lower portion of the load block(61). A plurality of guide grooves(63) are formed on the guide block(61). The clamp is installed at the both sides of the lower portion of the load block(61) in order to catch the lead frame. A lead frame shift(70) is used for shifting the lead frame to the load unit(60). The lead frame shift(70) is formed with a shift block(71), a transferring portion(72), a cylinder, and a plurality of guide pins(74). A contact sensor(79) is installed between the guide pins(74) in order to detect a contacting state of the guide block(61) of the load unit(60).
摘要翻译：目的：提供一种用于模制设备的引线框架传送装置，以通过使用用于检测传送部分的位置的接触传感器来防止由于夹具而导致的传送部分的引线框架的损坏。构成：负载单元（60）用于将引线框架传送到成型设备。负载单元（60）形成有负载块（61），引导块（64）和夹具。引导块（64）安装在装载块（61）的下部。在引导块（61）上形成有多个引导槽（63）。夹具安装在装载块（61）的下部的两侧，以便抓住引线框架。引线框移动（70）用于将引线框移动到负载单元（60）。引导框移动（70）由移位块（71），转移部分（72），圆柱体和多个引导销（74）形成。接触传感器（79）安装在引导销（74）之间，以便检测负载单元（60）的引导块（61）的接触状态。

8. 发明公开

KR1020070102800A 매거진 자동 배출 장치 无效
标题翻译：杂志自动放电装置
公开(公告)号：KR1020070102800A
公开(公告)日：2007-10-22
申请号：KR1020060034456
申请日：2006-04-17
申请人： 삼성전자주식회사
发明人： 나병도 , 강희철 , 임효신 , 정옥선 , 김용환 , 서희주 , 길영민
IPC分类号： H01L21/02 , H01L21/68
摘要： An automatic discharging device of a magazine is provided to improve the yield thereof by minimizing the delay of a process caused by not smoothly discharging the magazine. An automatic discharging device(10) of a magazine includes a supporting plate(30), two carrying paths, first and second detecting units(62,64), a pusher, and a carrying unit(40). The supporting plate(30) is rectangular and has a size capable of receiving a plurality of magazines lengthwise. The two carrying paths are formed lengthwise on the supporting plate(30) in parallel to each other and includes a receiving groove and a carrying groove. The receiving groove runs from an end of the supporting plate(30) through the supporting plate(30) having a length similar to a width of the magazine and a width for easily moving a compressor of the pusher. The carrying groove runs from an other end of the receiving groove and is used as a place where the carrying unit(40) is installed. The first and second detecting units(62,64) are installed on the supporting plate(30) for detecting the magazine.
摘要翻译：提供了一种盒的自动排料装置，通过最小化由于不能平滑地排出料盒而导致的加工过程的延迟，来提高成品率。盒的自动排出装置（10）包括支撑板（30），两个承载路径，第一和第二检测单元（62,64），推动器和承载单元（40）。支撑板（30）是矩形的并且具有能够纵向地容纳多个杂志的尺寸。两个承载路径彼此平行地在支撑板（30）上纵向地形成，并且包括接收槽和承载槽。接收槽从支撑板（30）的一端延伸通过支撑板（30），支撑板（30）的长度类似于料仓的宽度，宽度用于容易地移动推动器的压缩机。承载槽从容纳槽的另一端延伸并用作安装承载单元（40）的位置。第一和第二检测单元（62,64）安装在支撑板（30）上，用于检测料盒。

9. 发明授权

KR100615904B1 타블렛 무게 측정부를 구비하는 몰딩수지 타블렛 공급 장치 有权
标题翻译：模制树脂片剂供给装置，其具有片剂重量测定部
公开(公告)号：KR100615904B1
公开(公告)日：2006-08-28
申请号：KR1020050068420
申请日：2005-07-27
申请人： 삼성전자주식회사
发明人： 정옥선 , 이도우 , 강희철 , 나병도 , 황영진 , 김용환 , 서희주
IPC分类号： H01L21/56 , H01L23/02
摘要： 본 발명은 타블렛 무게 측정부를 구비하는 몰딩수지 타블렛 공급 장치에 관한 것으로, 손상되거나 규격에 미치지 못하는 몰딩수지 타블렛에 의하여 초래되는 불완전 몰딩 불량을 방지하기 위하여, 몰딩 설비로 공급되는 타블렛의 무게를 자동으로 측정함으로써 불량 타블렛을 미리 검출하여 제거할 수 있다. 무게 측정부는 예컨대 타블렛의 무게에 따라 탄성 변형을 일으키고 전기적 변화량을 출력하는 스트레인 게이지이며, 타블렛을 수용하는 공급부의 수용구멍 하부에서 타블렛의 무게를 측정한다. 무게 측정부로부터 타블렛 무게 신호를 전송받은 설비 제어부는 타블렛의 규격 적합 여부를 판정하고, 불량 타블렛의 경우에 수용구멍 하부를 여닫는 지지부 또는 무게 측정부를 구동시켜 수용구멍으로부터 타블렛을 배출시킨다.
반도체 패키지, 몰딩 공정, 몰딩수지 타블렛, 타블렛 공급 장치, 불완전 몰딩, 무게 측정
摘要翻译：本发明是为了防止因模制树脂片不完全成形不良不满足损坏或说明书涉及一种模制树脂药片供给装置包括一个称重片剂，所述片剂的自动重要被馈送到模制设备可以预先检测并移除有缺陷的药片。重量测定单元，例如应变计，这将导致弹性变形输出的电变化根据片剂的重量，并在较低的电源的接收孔用于接收所述片剂称重片剂。植物接受片剂重量信号从权重控制单元测量单元确定该片剂与合规性的大小，致动打开和关闭支撑部分接收或称重孔底用于从所述片剂收容孔排出有缺陷的片剂的情况下。

10. 发明公开

KR1020040022310A 분할부를 갖는 반도체 칩 패키지용 성형 금형 无效
标题翻译：具有制造半导体芯片封装的部件的模具
公开(公告)号：KR1020040022310A
公开(公告)日：2004-03-12
申请号：KR1020020053474
申请日：2002-09-05
申请人： 삼성전자주식회사
发明人： 이성수 , 박정규 , 서희주
IPC分类号： H01L21/56
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PURPOSE: A mold die having partition part for manufacturing semiconductor chip package is provided to prevent a process error caused by package warpage in a subsequent process by remarkably reducing the package warpage caused by thermal reduction after a molding process. CONSTITUTION: The mold die(100) include upper and lower mold die(101,111) with a plurality of cavities into which molding compound is induced wherein a substrate that is mounted with a semiconductor chip and wire-bonded to the semiconductor chip is interposed between the upper and lower mold die. The mold die include the division part(105) that protrudes from the bottom surface of the cavity by a predetermined height.
摘要翻译：目的：提供一种具有用于制造半导体芯片封装的分隔部分的模具，以防止在后续工艺中由于封装翘曲引起的工艺误差，显着降低了在模制工艺之后由热还原引起的封装翘曲。构成：模具（100）包括具有多个空腔的上模和下模具（101,111），其中引入模塑料，其中安装有半导体芯片并引线键合到半导体芯片的基板插入在上下模模具。模具包括从空腔的底面突出预定高度的分割部分（105）。

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