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    • 6. 发明公开
    • 반도체 장치의 제조 방법
    • 半导体器件及其制造方法和包括其的电子设备
    • KR1020090102194A
    • 2009-09-30
    • KR1020080027482
    • 2008-03-25
    • 삼성전자주식회사
    • 김영호
    • H01L21/78
    • H01L21/78
    • PURPOSE: A semiconductor device, a manufacturing method thereof, and an electronic device are provided to prevent the lowering of the performance of the semiconductor chip by minimizing a chipping phenomenon and a crack phenomenon. CONSTITUTION: A wafer(100) is provided. The wafer includes a chip area(110) with a semiconductor chip and a scribe area surrounding each chip area between chip areas. The wafer has the first surface. The penetration extending holes(130) and scribe connection parts(140) are formed along a scribe lane area. The scribe connection parts connect the chip areas between the penetration extension holes. The penetration extending holes pass through the wafer. The chip areas are separated by cutting the scribe connection parts.
    • 目的:提供一种半导体器件及其制造方法和电子器件,以通过使切削现象和裂纹现象最小化来防止半导体芯片的性能下降。 构成:提供晶片(100)。 晶片包括具有半导体芯片的芯片区域(110)和围绕芯片区域之间的每个芯片区域的划线区域。 晶片具有第一表面。 穿过延伸孔(130)和划线连接部分(140)沿着划线路区域形成。 划线连接部分连接穿透延伸孔之间的芯片区域。 穿透延伸孔穿过晶片。 通过切割划线连接部分来分离芯片区域。
    • 9. 发明公开
    • 자기정렬된 이중 패터닝을 채택하는 미세 패턴 형성 방법
    • 形成采用自对准双重图案的精细图案的方法
    • KR1020080107557A
    • 2008-12-11
    • KR1020070055456
    • 2007-06-07
    • 삼성전자주식회사
    • 김경미김재호김영호김명선왕윤경박미라
    • H01L21/027
    • H01L21/0337H01L21/02282H01L21/308
    • A fine pattern forming method for adopting the self-aligned double patterning is provided to reduce the pitch size less than the limit resolution of the photo lithography process by forming the second mask pattern between the sacrificing layers along the exterior wall of the first mask patterns. A fine pattern forming method comprises the following processes. The substrate(100) is provided. A first mask pattern(110) is formed on the top of the substrate. A reaction film(120) is formed on the top of the substrate having the first mask patterns. A sacrificing layer(120a) is formed along the exterior walls of the first mask patterns by reacting the reaction film adjacent to first mast patterns according to the chemical attachment process. The sacrificing film is exposed by removing the reaction film which is not reacted. The second mask patterns are formed between the sacrificing layers which are adjacent to the side walls facing the first mask patterns. The first and second mask patterns are exposed by removing the sacrificing layers. The substrate is etched by using the first and second mask patterns as the etching mask.
    • 提供了采用自对准双重图案化的精细图案形成方法,通过沿着第一掩模图案的外壁在牺牲层之间形成第二掩模图案,以减小小于光刻工艺的极限分辨率的间距尺寸。 精细图案形成方法包括以下处理。 提供基板(100)。 第一掩模图案(110)形成在基板的顶部。 在具有第一掩模图案的基板的顶部上形成反应膜(120)。 通过根据化学附着过程使与第一桅杆图案相邻的反应膜反应,沿着第一掩模图案的外壁形成牺牲层(120a)。 通过除去未反应的反应膜来暴露牺牲膜。 在与面向第一掩模图案的侧壁相邻的牺牲层之间形成第二掩模图案。 通过去除牺牲层来暴露第一和第二掩模图案。 通过使用第一和第二掩模图案作为蚀刻掩模蚀刻衬底。