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1. 发明公开

KR1020100080481A 무납 주석 합금 전기도금 조성물 및 방법 有权
标题翻译：无铅钛合金电镀组合物及方法
公开(公告)号：KR1020100080481A
公开(公告)日：2010-07-08
申请号：KR1020090134621
申请日：2009-12-30
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 뤄위 , 브라운네일디. , 토벤마이클피.
IPC分类号： C25D3/34
CPC分类号： C23C18/54 , C25D3/60 , C25D3/34
摘要： PURPOSE: A lead-free tin alloy electroplating composition and a method thereof are provided to create tin alloying composition having little bubbling by plating tin alloy at high current density and plating rate. CONSTITUTION: A lead-free tin alloy electroplating composition comprises one or more tin ion supply sources, one or more alloy metal supply sources, one or more flavone compounds, and one or more compositions having chemical formula HOR(R")SR'SR(R")OH. The alloy metal ion supply source is selected from a group consisting of silver ion, copper ion and bismuth ion. R, R' and R" are the same or different in the chemical formula. The composition additionally includes one or more grain refiners/stabilizer compounds.
摘要翻译：目的：提供一种无铅锡合金电镀组合物及其制备方法，通过以高电流密度和电镀速率镀锡锡合金，制造出具有很少鼓泡性的锡合金组合物。构成：无铅锡合金电镀组合物包含一种或多种锡离子供应源，一种或多种合金金属供应源，一种或多种黄酮化合物和一种或多种化学式为HOR（R“）SR'SR（R” R“）OH。合金金属离子供体源选自银离子，铜离子和铋离子。 R，R'和R“在化学式中相同或不同。组合物另外包括一种或多种晶粒细化剂/稳定剂化合物。

2. 发明授权

KR101651920B1 무납 주석 합금 전기도금 조성물 및 방법 有权
标题翻译：无铅钛合金电镀组合物及方法
公开(公告)号：KR101651920B1
公开(公告)日：2016-08-29
申请号：KR1020090134621
申请日：2009-12-30
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 뤄위 , 브라운네일디. , 토벤마이클피.
IPC分类号： C25D3/34
CPC分类号： C23C18/54 , C25D3/60
摘要： 기판상에주석합금을침착시키기위한전해질조성물이개시된다. 전해질조성물은주석이온, 하나이상의합금금속의이온, 플라본화합물및 디하이드록시비스-설파이드를함유한다. 전해질조성물은납 및시아나이드를함유하지않는다. 기판상에주석합금을침착시키는방법및 반도체장치상에인터커넥트범프를형성하는방법이또한개시된다.

3. 发明公开

KR1020100044131A 전해질 용액에 주석 및 그의 합금 금속을 보충하는 방법 无效
标题翻译：在电解液中补充金及其合金金属的方法
公开(公告)号：KR1020100044131A
公开(公告)日：2010-04-29
申请号：KR1020090100139
申请日：2009-10-21
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 뤄위 , 브라운네일디. , 토벤마이클피.
IPC分类号： C25D21/14 , C25D3/30
CPC分类号： C25D3/30 , C25D3/60 , C25D21/18
摘要： PURPOSE: A method for supplementing tin and their alloying metals into an electrolyte solution is provided to maintain an electroplating process in a steady- state, and control a successive increase of the acid concentration. CONSTITUTION: A method for supplementing tin and their alloying metals into an electrolyte solution comprises the following steps: supplying electrolytic cell including an insoluble anode and cathode; applying a composition to the electrolytic cell; electrically connecting the anode and cathode, and generating the electricity to deposit tin on the cathode; removing the constant amount of composition by flowing the composition to a storage; and forming a mixture by adding oxidizer 1 tin to the composition.
摘要翻译：目的：提供将锡及其合金金属补充到电解质溶液中的方法，以将电镀过程保持在稳定状态，并控制酸浓度的连续增加。构成：将锡及其合金金属添加到电解质溶液中的方法包括以下步骤：供应包括不溶性阳极和阴极的电解池; 将组合物施加到电解槽; 电连接阳极和阴极，并产生电以将锡沉积在阴极上; 通过将组合物流动到储存器中来除去恒定量的组合物; 并通过向组合物中加入氧化剂1而形成混合物。

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