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    • 9. 发明公开
    • 세정 방법, 반도체 장치의 제조 방법 및 액티브매트릭스형 표시 장치의 제조 방법
    • 超声波清洗方法,制造半导体器件的方法以及用于制造有源矩阵型显示装置的方法,涉及执行超声波清洗过程
    • KR1020040032129A
    • 2004-04-14
    • KR1020040018754
    • 2004-03-19
    • 가부시끼가이샤 도시바
    • 하야미즈나오야
    • H01L21/304
    • H01L21/02071B08B3/02B08B3/12B08B2203/0288G02F1/1333G02F2001/1316H01L21/02052
    • PURPOSE: An ultrasonic cleaning method, a method for manufacturing a semiconductor device, and a method for manufacturing an active matrix type display device are provided to perform safely the ultrasonic cleaning process without generating damage of a target-object. CONSTITUTION: An ultrasonic cleaning method includes the first ultrasonic cleaning process and the second ultrasonic process. The first ultrasonic cleaning process is performed to clean a target by applying the first ultrasonic wave to an object, that is, the target to be cleaned. The second ultrasonic cleaning process is performed to clean the target by applying the second ultrasonic wave to the object. The first and the second ultrasonic cleaning processes are performed continuously and repeatedly. At this time, one of phase, wavelength and amplitude of the first and the second ultrasonic waves is different from each other.
    • 目的:提供一种超声波清洗方法,半导体装置的制造方法以及有源矩阵型显示装置的制造方法,能够安全地进行超声波清洗处理而不产生目标物的损伤。 构成:超声波清洗方法包括第一超声波清洗处理和第二超声波处理。 执行第一超声波清洗处理以通过将第一超声波施加到对象即待清洁的目标来清洁目标。 执行第二超声波清洗处理以通过向对象施加第二超声波来清洁目标。 第一和第二超声波清洗过程连续而重复进行。 此时,第一和第二超声波的相位,波长和振幅之一彼此不同。