会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 81. 发明公开
    • 식각액 및 이를 이용한 액정 표시 장치의 제조 방법
    • 用于制造使用该液晶显示器的液晶显示器的蚀刻和方法
    • KR1020070008258A
    • 2007-01-17
    • KR1020050063345
    • 2005-07-13
    • 삼성디스플레이 주식회사
    • 박홍식김시열정종현신원석
    • C23F1/16C23F1/44
    • G02F1/13439H01L31/022466H01L31/1884
    • An etchant for a transparent conductive oxide film, an etchant of which applications according to types of transparent conductive oxide films are less limited, an etchant for improving etching performance of a transparent conductive oxide film, an etchant which has less damage on a film formed below a transparent conductive oxide film, and a method for fabricating a liquid crystal display using the etchant for the transparent conductive oxide film are provided. An etchant for a transparent conductive oxide film comprises: 2 to 15 wt.% of sulfuric acid; 0.02 to 10 wt.% of alkali metal hydrogen sulfate; and the balance of deionized water. The alkali metal hydrogen sulfate includes KHSO4. The etchant further comprises 0.02 to 10 wt.% of subsidiary oxidizing agent. The subsidiary oxidizing agent is at least one selected from the group consisting of H3PO4, HNO3, CH3COOH, HClO4, H2O2, and oxone. The etchant further comprises 0.01 to 5 wt.% of a subsidiary inhibitor. The subsidiary inhibitor is at least one selected from the group consisting of VH3COONH4, NH4SO3NH2, NH4C6H5O2, NH4COONH4, NH4Cl, NH4H2PO4, NH4OOCH, NH4HCO3, H4NO2CCH2C(OH)(CO2NH4)CH2CO2NH4, NH4PF6, HOC(CO2H)(CH2CO2NH4)2, NH4NO3, (NH4)2S2O8, H2NSO3NH4, and (NH4)2SO4. The transparent conductive oxide film is indium tin oxide or indium zinc oxide. The indium tin oxide is amorphous indium tin oxide.
    • 用于透明导电氧化物膜的蚀刻剂,根据透明导电氧化物膜的类型的应用的蚀刻剂较少受限制,用于改善透明导电氧化物膜的蚀刻性能的蚀刻剂,对下面形成的膜具有较小损伤的蚀刻剂 透明导电氧化物膜,以及使用该透明导电氧化物膜用蚀刻剂制造液晶显示器的方法。 用于透明导电氧化物膜的蚀刻剂包括:2至15重量%的硫酸; 0.02〜10重量%的碱金属硫酸氢盐; 和去离子水的平衡。 碱金属硫酸氢盐包括KHSO 4。 蚀刻剂还包含0.02〜10重量%的辅助氧化剂。 辅助氧化剂是选自H 3 PO 4,HNO 3,CH 3 COOH,HClO 4,H 2 O 2和氧化物中的至少一种。 蚀刻剂还包含0.01至5重量%的辅助抑制剂。 辅助抑制剂是选自VH 3 COONH 4,NH 4 SO 3 NH 2,NH 4 C 6 H 5 O 2,NH 4 COONH 4,NH 4 Cl,NH 4 H 2 PO 4,NH 4 OCH,NH 4 HCO 3,H 4 NO 2 CCH 2 C(OH)(CO 2 NH 4)CH 2 CO 2 NH 4,NH 4 PF 6,HOC(CO 2 H)(CH 2 CO 2 NH 4)2,NH 4 NO 3 ,(NH4)2S2O8,H2NSO3NH4和(NH4)2SO4。 透明导电氧化物膜是氧化铟锡或氧化铟锌。 氧化铟锡是非晶态氧化铟锡。
    • 87. 发明公开
    • 액정 표시 장치 및 그 제조 방법
    • 液晶显示器及其制造方法
    • KR1020160090948A
    • 2016-08-02
    • KR1020150010587
    • 2015-01-22
    • 삼성디스플레이 주식회사
    • 정종현박홍식
    • G02F1/1362G02F1/1368
    • H01L27/1244G02F1/133512G02F1/133514G02F1/136227G02F1/136259G02F1/136286G02F2001/136295H01L21/77H01L27/1296H01L29/41733H01L29/45H01L2021/775
    • 본발명의일 실시예에따른액정표시장치는제1 기판, 상기제1 기판위에배치되어있고, 제1 방향으로뻗어있으며, 게이트전극을포함하는게이트선, 상기게이트선위에배치되어있는게이트절연막, 상기게이트절연막위에배치되어있고, 상기제1 방향과교차하는방향인제2 방향으로뻗어있으며, 상기게이트선과중첩하지않는선형반도체층, 상기게이트절연막위에배치되어있고, 상기선형반도체층과분리되어있으며, 상기게이트전극과중첩되어있는섬형반도체층, 상기선형반도체층위에배치되어있으며, 상기게이트선과중첩하지않는데이터선, 상기섬형반도체층위에배치되어있으며, 서로분리되어있는소스전극및 드레인전극, 상기데이터선및 상기게이트절연막위에배치되어있으며, 상기데이터선의일부를노출하는데이터선노출구를포함하는층간절연막, 상기층간절연막위에배치되어있으며, 상기데이터선노출구를통하여평면상상기게이트선의상부및 하부에배치되어있는상기데이터선에서로연결되어있는연결부재, 그리고상기층간절연막위에배치되어있으며, 상기연결부재와분리되어있는화소전극을포함하고, 상기연결부재는상기소스전극과직접연결되어있고, 상기화소전극은상기드레인전극과직접연결되어있다.
    • 本发明提供一种液晶显示器及其制造方法,其能够实现在包括铜布线的LCD中设置在TFT的通道中的电极的微小图案。 根据本发明的一个实施例的液晶显示器包括:第一基板; 设置在第一基板上的栅极线沿第一方向延伸,并且包括栅电极; 设置在栅极线上的栅极绝缘层; 设置在栅极绝缘层上的半导体条纹层沿与第一方向垂直的第二方向延伸并与栅极线分离; 设置在栅绝缘层上的半导体岛层与半导体条纹层分离,与栅电极重叠; 设置在与栅极线分离的半导体条纹层上的数据线; 源极电极和漏极电极,其设置在所述半导体岛层上以彼此分离; 设置在数据线和栅极绝缘层上并且限定暴露数据线的一部分的数据线曝光孔的层间绝缘层; 连接构件,其设置在所述层间绝缘层上,并且连接到在所述平面图中通过所述数据线曝光孔设置在所述栅极线上和下方的数据线; 以及像素电极,其设置在所述层间绝缘层上并与所述连接构件分离,其中所述连接构件直接连接到所述源电极,并且所述像素电极直接连接到所述漏电极。
    • 89. 发明公开
    • 금속 배선 식각액 및 이를 이용한 금속 배선 형성 방법
    • 用于金属线的蚀刻和使用该金属线制造金属线的方法
    • KR1020140005411A
    • 2014-01-15
    • KR1020120072295
    • 2012-07-03
    • 삼성디스플레이 주식회사주식회사 동진쎄미켐
    • 정종현김인배김선일박홍식정재우김규포서원국신현철이기범조삼영한승연
    • C23F1/16H05K3/06
    • C23F1/18C23F1/26H01L21/4814
    • The present invention relates to an etchant for a metal wire and a method for manufacturing a metal wire using the same. According to an embodiment of the present invention, copper is etched at an efficient speed without using hydrogen peroxide and causing problems, such as strong exothermic reactions, a decline in the stability of an etchant, and the addition of expensive stabilizers; the performance of the etchant is lasted for a long time as the stability of the etchant is secured; a process yield is improved as a failed short circuit caused by residues and a failed disconnection caused by erosion are prevented; and costs for etching processes are lowered and a sufficient margin for the etching processes is ensured as exothermic reactions in the treatment of waste fluids can be controlled. [Reference numerals] (AA) Example 1; (BB) Example 2; (CC) Example 3; (DD) Example 4; (EE) Example 5; (FF) Example 6; (GG) Example 7; (HH) Example 8; (II) Example 9
    • 本发明涉及一种用于金属线的蚀刻剂及其制造方法。 根据本发明的一个实施方案,在不使用过氧化氢的情况下以有效速度蚀刻铜,并引起诸如强放热反应,蚀刻剂的稳定性下降以及昂贵的稳定剂的添加等问题。 蚀刻剂的性能持续很长时间,因为蚀刻剂的稳定性得到保证; 由于残留物引起的故障短路和防止由于侵蚀引起的断线失败,工艺产量得到改善。 并且降低了蚀刻工艺的成本,并且确保了用于蚀刻工艺的足够的余量,因为可以控制废流体处理中的放热反应。 (标号)(AA)实施例1; (BB)实施例2; (CC)实施例3; (DD)实施例4 (EE)实施例5; (FF)实施例6; (GG)实施例7 (HH)实施例8; (II)实施例9