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    • 72. 发明公开
    • 발광 소자 및 그 제조 방법
    • 发光剂及其制造方法
    • KR1020130064250A
    • 2013-06-18
    • KR1020110130778
    • 2011-12-08
    • 엘지이노텍 주식회사
    • 김설희임현철정명훈오정탁
    • H01L33/12H01L33/04
    • H01L33/12H01L33/0079H01L33/22H01L33/32H01L2933/0016
    • PURPOSE: A light emitting device and a method for fabricating the same are provided to reduce the damage of a light emitting structure due to a laser beam in a laser lift off process. CONSTITUTION: A buffer layer(115) of superlattice structure is formed on a substrate(110). A light emitting structure(120) is formed on the buffer layer. The light emitting structure includes a first conductive semiconductor layer(122), an active layer(124), and a second conductive semiconductor layer(126). A protection layer(130) is formed on the light emitting structure. An electrode layer(201) is formed on the protection layer and the light emitting structure. A substrate is removed from the buffer layer by a laser lifting off method.
    • 目的:提供一种发光器件及其制造方法,以减少由激光剥离过程中的激光束引起的发光结构的损伤。 构成:在基板(110)上形成超晶格结构的缓冲层(115)。 在缓冲层上形成发光结构(120)。 发光结构包括第一导电半导体层(122),有源层(124)和第二导电半导体层(126)。 在发光结构上形成保护层(130)。 在保护层和发光结构上形成电极层(201)。 通过激光剥离法从缓冲层中除去衬底。
    • 78. 发明公开
    • 전류 저지층 구조의 수직형 발광다이오드 소자 및 그 제조방법
    • 具有电流阻挡层的垂直结构发光二极管的制造方法
    • KR1020130010396A
    • 2013-01-28
    • KR1020110071164
    • 2011-07-18
    • (재)한국나노기술원
    • 김동현배성주주인찬최재혁김경태신찬수
    • H01L33/14
    • H01L33/145H01L33/0079H01L2933/0016
    • PURPOSE: A vertical light emitting diode device of a current stop layer structure and a manufacturing method thereof are provided to improve the productivity of the light emitting diode device and simplify a production process by forming a current stop layer without an additional photolithography process. CONSTITUTION: An n type nitride gallium layer(102) is formed on the lower side of an n type electrode(101). An active layer(103) is formed on the lower side of the n type nitride gallium layer. A p type nitride gallium layer(104) is formed on the lower side of the active layer. A current stop layer(104b) vertically corresponds to an n type electrode region in the p type nitride gallium layer. A metal layer(106) is formed on the lower side of the current stop layer and the lower side of a p type electrode(105).
    • 目的:提供一种电流停止层结构的垂直发光二极管器件及其制造方法,以提高发光二极管器件的生产率,并且通过在没有附加光刻工艺的情况下形成电流停止层来简化生产工艺。 构成:n型氮化镓层(102)形成在n型电极(101)的下侧。 在n型氮化镓层的下侧形成有源层(103)。 在有源层的下侧形成p型氮化镓层(104)。 电流停止层(104b)垂直对应于p型氮化镓层中的n型电极区域。 金属层(106)形成在电流停止层的下侧和p型电极(105)的下侧。