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51. 发明公开

KR1020140106196A 입체적 다층도금에 의한 복합 표면 처리 방법 및 그에 따른 입체적 복합 표면 처리 구조 无效
标题翻译：通过三维多层涂覆法和三维复合表面处理结构的复合表面处理方法
公开(公告)号：KR1020140106196A
公开(公告)日：2014-09-03
申请号：KR1020130020438
申请日：2013-02-26
申请人： 최경수
发明人： 최경수
IPC分类号： C23C28/00 , C25D5/10 , C25D5/34 , C25D5/02
摘要： The present invention relates to a method for treating a complex surface by three-dimensional multi-layer plating and a three-dimensional complex surface treated structure by the method for treating the complex surface. According to the present invention, the method for treating the complex surface by three-dimensional multi-layer plating includes: a metal texture step of adding a metal texture to a substrate surface by a mechanical process; a masking step of forming a masking layer on an uncoated area with a predetermined pattern; a substrate plating layer forming step of forming a substrate plating layer on an electrochemical plating layer; an intermediate plating layer forming step of forming an intermediate plating layer on the substrate plating layer; and a surface decoration forming step of forming a surface decoration coating layer on the intermediate plating layer. According to the present invention, the method and the structure can provide excellent three-dimensional decoration by adding beautiful three-dimensional visual, texture, touch, color, and gloss or matt finish to a surface of an external case, a cover, or a decorative component of a mobile device. Particularly, the method and the structure can form a decorative pattern with a sharp contour without delamination or detachment of a multilayer plating film, and can be efficiently applied to various substrates.
摘要翻译：本发明涉及一种通过三维多层电镀处理复合表面的方法和一种用于处理复合表面的方法的三维复合表面处理结构。根据本发明，通过三维多层电镀处理复合表面的方法包括：金属组织步骤，通过机械方法将金属组织加到衬底表面; 掩模步骤，在预定图案的未涂覆区域上形成掩模层; 在电化学镀层上形成基板镀层的基板镀层形成工序; 中间镀层形成步骤，在所述基板镀层上形成中间镀层; 以及在中间镀层上形成表面装饰涂层的表面装饰形成工序。根据本发明，该方法和结构可以通过在外壳，外壳或外壳的表面上添加美丽的三维视觉，纹理，触摸，颜色和光泽或无光泽的表面来提供优异的三维装饰移动设备的装饰组件。特别地，该方法和结构可以形成具有锐利轮廓的装饰图案，而不会使多层电镀膜分层或分离，并且可以有效地应用于各种基板。

52. 发明公开

KR1020140094755A 니켈 나노콘 패턴 형성방법 无效
标题翻译：硝化镍纳米粉体的制备方法
公开(公告)号：KR1020140094755A
公开(公告)日：2014-07-31
申请号：KR1020130007067
申请日：2013-01-22
申请人： 명지대학교 산학협력단
发明人： 최영진 , 이규왕 , 강치중 , 심이레
IPC分类号： C25D3/02 , C25D5/02 , C25D21/12
CPC分类号： C25D7/123 , B82B3/00 , C25D3/12 , C25D5/022
摘要： The present invention relates to a method for forming nickel nanocones to have a selected pattern, including the steps of: forming a seed layer, with the surface being exposed to have a specific shape, on a substrate; and forming nickel nanocones on the surface, which is exposed to have the specific shape, of the seed layer by performing an electroplating process in which a nickel electrode serves as an anode in an electrolyte, wherein the seed layer is made of a metal material of a face centered cubic (FCC) structure. Since the nickel nanocones are directly formed to have the specific pattern only by a quick and simple photolithographic process and the electroplating process, the costs required to form the nickel nano-structure is remarkably reduced. Also, since the nickel nanocones are formed in the pattern of the specific shape, the nanocone forming process of the present invention can be applied to a part of the conventional semiconductor process. The connection in the whole semiconductor process is increased, and the efficiency of the fabricated device is improved. In addition, since the process costs are not expensive, the nickel nanocone structure can be applied to a new field which is not used at present.
摘要翻译：本发明涉及一种用于形成具有选定图案的镍纳米酮的方法，包括以下步骤：在基材上形成表面暴露于具有特定形状的种子层; 以及通过进行电解工艺中的镍电极作为电解质中的阳极而形成种子层的暴露于特定形状的表面上的镍纳米酮，其中种子层由金属材料制成面心立方（FCC）结构。由于仅通过快速且简单的光刻工艺和电镀工艺直接形成具有特定图案的镍纳米骨，因此形成镍纳米结构所需的成本显着降低。此外，由于镍纳米酮以特定形状的图案形成，所以本发明的纳米骨形成方法可以应用于常规半导体工艺的一部分。整个半导体工艺中的连接增加，并且制造的器件的效率提高。此外，由于工艺成本不昂贵，镍纳米结构可以应用于目前未使用的新领域。

53. 发明授权

KR101421058B1 부분 도금 시스템 및 방법 有权
标题翻译：部分镀层系统及方法
公开(公告)号：KR101421058B1
公开(公告)日：2014-07-23
申请号：KR1020120133255
申请日：2012-11-22
申请人： 송일선
发明人： 송일선
IPC分类号： C25D5/02 , H05K3/18
摘要： 본 발명은 피도금재의 표면 중 필요한 부분에만 소정의 패턴으로 도금을 하는 부분 도금 시스템 및 방법에 관한 것이다.
본 발명에 의한 부분 도금 시스템은, 마스킹테이프에 타공 패턴을 형성하는 가공부와, 타공 패턴이 형성된 마스킹테이프를 피도금재의 표면에 부착하는 접착부와, 상기 마스킹테이프가 부착된 상기 피도금재의 표면을 도금하는 도금부를 포함한다.
상기 가공부는, 상기 마스킹테이프가 감긴 제1공급롤과, 상기 제1공급롤에서 이송된 상기 마스킹테이프에 타공 패턴을 형성하는 프레스와, 타공 패턴이 형성된 상기 마스킹테이프가 감기는 제1배출롤로 구성된다. 또한, 가공부는, 상기 프레스의 입력측과 출력측에 각각 설치된 제1고정롤러와 제2고정롤러, 상기 프레스와 상기 제2고정롤러 사이에 설치된 조정롤러를 더 포함하여 구성된다.
본 발명에 의한 부분 도금 방법은, 마스킹테이프에 타공 패턴을 형성하는 단계와, 타공 패턴이 형성된 마스킹테이프를 피도금재의 표면에 부착하는 단계와, 상기 마스킹테이프가 부착된 상기 피도금재의 표면을 도금하는 단계으로 이루어진다.

54. 发明公开

KR1020140064438A 드럼 회전방식을 이용한 커넥터핀의 도금회수용 박리액 분사장치 및 박리액 분사방법 有权
标题翻译：通过鼓轮转接头连接器接受镀层和剥离方法的时间消除装置
公开(公告)号：KR1020140064438A
公开(公告)日：2014-05-28
申请号：KR1020120131776
申请日：2012-11-20
申请人： 대성하이피(주)
发明人： 박용복
IPC分类号： C25D5/48 , C25F3/02 , C25D5/02
CPC分类号： C25F5/00 , C25F7/00
摘要： The present invention relates to a peeling method of a peeling apparatus for recovering plating of a connector pin by using a drum rotation method. According to an embodiment of the present invention, the peeling apparatus for recovering plating of a connector pin comprises: a cylindrical fixing body fixed to the upper side of a base, and having a stripping liquid supply pipe inside, and having a bearing in the upper side; a stripping liquid spraying block formed in the center of the fixing body as the form of a disk, and having a stripping liquid accommodating part connected to the stripping liquid supply pipe inside, and having stripping liquid spraying holes penetrated into the outside from the stripping liquid accommodating part in the outer circumference surface in a circumferential direction at regular intervals; a drum mask holder which rotates on the fixing body by fixing the inner circumference surface to the bearing installed in the upper side of the fixing body; a cover member located in the upper side of the drum mask holder and connected to the upper end of the fixing body to apply a cathode current to the stripping liquid accommodating part; and a drum mask formed in the lower side of the drum mask holder in the form of covering the stripping liquid spraying block, and having a stripping liquid nozzle hole to correspond with the stripping liquid spraying hole in the outer circumference surface, and having a position determining pin to insert a pin hole of a plating body into the lower side of the outer circumference surface. Therefore, a part of a plating layer in a plating body can be peeled as necessary, or the thickness of the plating layer can be controlled by spraying the stripping liquid to a plating part of the plating body.
摘要翻译：本发明涉及一种通过使用滚筒旋转方法来恢复连接器针的电镀的剥离装置的剥离方法。根据本发明的实施例，用于回收连接器针的电镀的剥离装置包括：固定到基座的上侧的圆柱形固定体，并且在内部具有剥离液体供给管，并且在上部具有轴承侧; 形成在固定体的中心的剥离液体喷射块作为盘的形式，并且具有与汽提液体供给管内部连接的剥离液容纳部，并且具有从剥离液渗透到外部的剥离液喷射孔以规定的间隔沿圆周方向容纳部分在外周面上; 鼓面罩座，其通过将内周面固定在安装在固定体的上侧的轴承上而在固定体上旋转; 盖体，位于鼓面罩座的上侧，与固定体的上端连接，将阴极电流施加到剥离液容纳部; 以及形成在鼓面罩支架的下侧的鼓面罩，其形式为覆盖剥离液体喷洒块，并且具有与外周表面中的剥离液体喷射孔对应的剥离液体喷嘴孔，并具有位置确定销将电镀体的针孔插入外周面的下侧。因此，电镀体中的镀层的一部分可以根据需要剥离，也可以通过将剥离液喷射到电镀体的电镀部来控制镀层的厚度。

55. 发明公开

KR1020140048327A 양극 산화 및 도금 표면 처리 有权
标题翻译：阳极氧化和表面处理
公开(公告)号：KR1020140048327A
公开(公告)日：2014-04-23
申请号：KR1020147006733
申请日：2012-08-01
申请人： 애플 인크.
发明人： 디머스,브라이언,피. , 탄,나프타닐,와이. , 손턴,존,엠.
IPC分类号： C25D5/02 , C25D11/02 , C23C18/54 , C23C18/16
CPC分类号： C25D11/022 , C23C18/1605 , C25D5/022 , C25D5/02 , C23C18/16 , C23C18/54 , C25D11/02
摘要： 양극 산화 및 도금 프로세스들을 이용하여 금속 부품을 표면 처리하여 금속 부품의 선택 영역들 상에 상이한 마무리들을 생성한다. 상이한 마무리들은 장식적 외관(컬러, 빛남 및 텍스처 등) 및 구조적 특성들(마모 저항 등)에서 대조적일 수 있다.
摘要翻译：使用阳极氧化和电镀工艺对金属部件进行表面处理，以在金属部件的选择区域上产生不同的表面处理。不同的表面处理可以在装饰外观（如颜色，光泽和质地）以及结构特性（如耐磨性）方面进行对比。

56. 发明公开

KR1020140029862A 지그 장치를 이용한 부분 금 도금 방법 有权
标题翻译：使用JIG加工点阵法的方法
公开(公告)号：KR1020140029862A
公开(公告)日：2014-03-11
申请号：KR1020120095820
申请日：2012-08-30
申请人： (주)제이케이씨코리아
发明人： 이종후 , 김용태 , 이수진 , 이선정 , 신민정
IPC分类号： C25D5/02 , C25D5/34 , C25D5/48 , C25D17/06
CPC分类号： C25D5/022 , C25D5/40 , C25D5/48 , C25D17/06
摘要： The present invention relates to a partial gold plating method using a jig apparatus and, especially, to a partial gold plating method using a jig apparatus for fixing to expose only the specific part (a part to be gold plated) of a partial plating object. Since electroplating is performed to gold plate only the specific part of the partial plating object, a part where gold plating is not necessary can be not electroplated, and a part where gold plating is necessary can be electroplated. As a result, costs can be reduced by preventing consumption of unnecessary gold plating solution. According to the present invention, the partial gold plating method comprises: a step for performing a preprocess in order to remove foreign substances on a partial plating object; a step for performing strike electroplating on the partial plating object; a step for performing a surface process about the partial plating object which is strike electroplated; and a step for performing partial gold plating only the specific part of the partial plating object after fixing the partial plating object to a zig apparatus. [Reference numerals] (AA) Start; (BB) End; (S10) Perform a preprocess in order to remove foreign substances; (S20) Perform strike electroplating on a partial plating object; (S30) Perform a surface process on the partial plating object; (S40) Perform gold plating only the specific part of the partial plating object after fixing the partial plating object to a zig apparatus
摘要翻译：本发明涉及使用夹具装置的部分镀金方法，特别涉及使用夹具装置进行部分镀金方法的局部镀金方法，该夹具装置用于只露出部分电镀对象的特定部分（镀金的一部分）。由于仅对镀金板进行电镀仅局部电镀对象的特定部分，因此不需要电镀镀金的部分，并且可以电镀需要镀金的部分。结果，可以通过防止不必要的镀金液的消耗来降低成本。根据本发明，部分镀金方法包括：为了去除部分电镀对象上的异物而进行预处理的步骤; 在部分电镀对象上进行电镀的步骤; 关于部分电镀对象进行电镀的表面处理的步骤; 以及在将部分电镀对象固定到Zig装置之后，仅对部分电镀对象的特定部分进行部分镀金的步骤。（附图标记）（AA）开始; （BB）结束; （S10）为了去除异物，进行预处理; （S20）对部分电镀对象进行电镀; （S30）对部分电镀对象进行表面处理; （S40）在将部分电镀对象固定到锯齿装置之后，仅对部分电镀对象的特定部分进行镀金

57. 发明授权

KR101362265B1 드럼 회전방식을 이용한 입체형 커넥터핀의 부분 전기 도금장치 有权
标题翻译：通过立体连接器引脚电极单元的旋转部分
公开(公告)号：KR101362265B1
公开(公告)日：2014-02-14
申请号：KR1020120131775
申请日：2012-11-20
申请人： 대성하이피(주)
发明人： 박용복
IPC分类号： C25D5/02 , C25D17/00
CPC分类号： C25D5/026 , C25D17/06 , C25D17/22
摘要： The present invention relates to a partial electroplating apparatus which can selectively plate a desired part on a three-dimensional (3D) object being plated such as a connector pin. According to an embodiment of the present invention, the partial electroplating apparatus comprises: a cylindrical fixating body wherein a plating solution supplying pipe is included and where a bearing is included on the upper outer circumference thereof; a plating solution injecting block which is formed in the fixating body, wherein a plating solution storage unit connected with the plating solution supplying pipe is included, and where a plating solution injection hole is formed on the outer circumference thereof; a drum mask holder which rotates on the fixating body and has a supporting unit; a cover member which is connected with the top of the fixating body in order to apply an anode current to the plating solution storage unit; and a drum mask which rotates along with the drum mask holder, where a concave groove unit and a plating solution nozzle hole are formed on the outer circumference thereof in order to store a protruding part on the 3D object being plated, and where a position determining pin is formed in the lower outer circumference thereof. Therefore, the partial electroplating apparatus can accurately and easily plate the 3D object being plated, and can effectively plate the 3D object being plated by selectively applying a drum mask corresponding to the 3D object, thereby significantly improving the efficiency of plating work.
摘要翻译：本发明涉及一种部分电镀装置，其可以选择性地对被镀的三维（3D）物体（例如连接器针）进行平板化。根据本发明的一个实施例，部分电镀装置包括：一个圆柱形固定体，其中包括一个电镀液供应管，并且其上外圆周上包括轴承; 形成在所述固定体中的电镀液注入块，其中，包括与所述电镀液供给管连接的电镀液存储单元，在其外周形成有电镀液注入孔; 鼓面罩座，其在固定体上旋转并具有支撑单元; 盖构件，其与固定体的顶部连接，以将阳极电流施加到电镀液存储单元; 以及鼓面罩，其与鼓面罩座一起旋转，其中在其外周上形成有凹槽单元和电镀液喷嘴孔，以将突出部分存储在被镀的3D物体上，并且其中位置确定销形成在其下外周。因此，部分电镀装置可以准确且容易地平板化被镀的3D物体，并且可以通过选择性地施加与3D物体相对应的鼓罩来有效地对被镀的3D物体进行平板化，从而显着提高电镀工作的效率。

58. 发明公开

KR1020140015438A 부분 전기도금을 위한 전기도금될 수 있는 투명 플라스틱 필름 审中-实审
标题翻译：透明塑料薄膜，可以电镀用于部分电镀
公开(公告)号：KR1020140015438A
公开(公告)日：2014-02-06
申请号：KR1020137026198
申请日：2012-03-06
申请人： 바이엘 인텔렉쳐 프로퍼티 게엠베하
发明人： 그뢰츠,마티아스 , 치오바라스,조지오스 , 푸드라이네르,하인츠 , 퀸첼,롤란트
IPC分类号： B32B27/08 , C25D5/02
CPC分类号： B32B27/08 , B32B15/08 , B32B27/30 , B32B27/302 , B32B27/365 , B32B2457/00 , B32B2605/00 , B44C1/10 , B44F1/06 , C25D5/02 , C25D5/56 , Y10T428/24355 , Y10T428/24967 , Y10T428/263 , Y10T428/264 , Y10T428/265
摘要： 본 발명은 금속화된 성분, 특히 부분 금속화된 성분을 제조하기 위한, 전기도금될 수 있고 50% 초과, 특히 바람직하게는 80% 초과의 광 투과율을 갖는 플라스틱 필름에 관한 것이다.
摘要翻译：要求保护包含含有聚碳酸酯的层A和含有乙烯基聚合物的层B的镀锌塑料膜的用途。层B的层厚度=100μm。该塑料膜具有50％的可见光波长范围内的透光率，总厚度=750μm。将含有聚碳酸酯的层A和含有乙烯基聚合物的层B共挤出。金属化部分地通过镀锌进行。包括用于生产塑料膜的方法的独立权利要求。

59. 发明授权

KR101334506B1 마스터 전극 및 이의 형성 방법 有权
标题翻译：主电极及其形成方法
公开(公告)号：KR101334506B1
公开(公告)日：2013-12-02
申请号：KR1020087014735
申请日：2006-11-20
申请人： 레플리서러스 그룹 에스에이에스
发明人： 프레덴베르그미카엘 , 뮐러패트릭 , 위웬-닐손피터 , 아론손세실리아 , 다이네세마테오
IPC分类号： C25D5/02 , C25D17/12 , C25D21/08 , C25D21/11
CPC分类号： C25D5/02 , B81C99/0085 , C23C14/34 , C23C14/3414 , C25D1/003 , C25D1/10 , C25D5/022 , C25D5/10 , C25D5/50 , C25D7/12 , C25D7/123 , C25F3/14 , H01L21/2885 , H01L21/32134 , H01L21/76838 , H01L21/76843 , H01L21/76852 , H01L21/76873 , H01L21/76877 , H01L21/76885 , H05K3/07 , H05K3/108 , H05K3/241 , H05K3/4647 , H05K2203/0117 , H05K2203/0733 , Y10T156/10
摘要： 기판 상에 배열된 마스터 전극을 포함하는 시스템 및 방법이 개시되며, 상기 마스터 전극은 도전성 재료가 배열되는 다수의 캐비티가 제공되는 제1 표면을 갖는 적어도 부분적으로 절연 재료의 패턴 층을 포함하며, 상기 전극 도전성 재료는 적어도 하나의 전극 전류 공급 콘택에 전기적으로 접속되고; 상기 기판은 상기 제1 표면과 콘택하거나 인접하게 배열되는 상부면을 포함하고 상부에 배열된 도전성 재료의 구조 및/또는 도전성 재료를 가지며, 상기 기판 도전성 재료는 적어도 하나의 전류 공급 콘택에 전기적으로 접속되며; 다수의 전기화학적 셀은 상기 캐비티, 상기 기판 도전성 재료 및 상기 전극 도전성 재료에 의해 범위가 정해지도록 형성되고, 상기 셀은 전해질을 포함하며; 상기 전극 도전성 재료와 상기 전극 전류 공급 콘택 사이의 전극 저항 및 상기 기판 도전성 재료와 상기 기판 전류 공급 콘택 사이의 기판 저항은 각각의 전기화학적 셀에서 소정의 전류 밀도를 제공하도록 적응된다.
기판, 마스터 전극, 전기화학적 셀, 캐비티, 도전성 재료.

60. 发明授权

KR101215859B1 A parts plating device of continuous manner 有权
标题翻译：连续铸造的部件镀层装置
公开(公告)号：KR101215859B1
公开(公告)日：2012-12-31
申请号：KR20120064208
申请日：2012-06-15
申请人： IK TECH CO LTD
发明人： PARK BUM HWAN
IPC分类号： C25D5/02 , C25D7/12 , C25D17/00 , H01L23/50
CPC分类号： C25D5/022 , C25D5/026 , C25D17/005 , C25D17/06 , C25D17/22
摘要： PURPOSE: A spot plating apparatus for a lead frame is provided to simply form a desired pattern and shape of plated surface by changing a masking chain block according to the shape of an object to be plated. CONSTITUTION: A spot plating apparatus for a lead frame comprises a base(100), a plating bath(200), a pressing unit, a masking chain, and a chain tensioner. The plating bath includes a chain mask supporter(220) with a guide groove(221) for guiding an object(20) to be plated, side plates, a rear plate(240), and a jet nozzle(210) which is connected to an eject hole(115) to eject a plating solution into a through hole(223) of the chain mask supporter. The pressing unit pushes the object to be plated against the chain mask supporter. The masking chain comprises masking plates(410) connected in a chain form, and a plurality of plating holes(411) are formed in a grid shape to plate only patterns of the object to be plated. The chain tensioner is arranged at the top of the base on both sides of the plating bath and consecutively supplies the masking chain along the guide groove.
摘要翻译：目的：提供一种用于引线框架的电镀装置，以通过根据被镀物体的形状改变遮蔽链条块来简单地形成所需的电镀表面形状和形状。构成：用于引线框架的点电镀装置包括基座（100），电镀槽（200），按压单元，遮蔽链条和链条张紧器。电镀槽包括具有导向槽（221）的链条掩模支撑件（220），用于引导要被电镀的物体（20），侧板，后板（240）和喷嘴（210），其连接到弹出孔（115），用于将电镀溶液喷射到所述链掩模支撑体的通孔（223）中。按压单元将待镀物体推向链条掩模支撑件。遮蔽链包括以链形连接的掩模板（410），并且形成格栅形状的多个电镀孔（411），以仅镀覆被镀物体的图案。链条张紧器布置在电镀槽两侧的基座顶部，并连续地沿导向槽供给掩蔽链条。

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