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1. 发明授权

KR101203488B1 The silver-carbon plating method of contacting part for a switch in contacting in the electricity and thereof device 有权
标题翻译：电镀接触部件的银 - 碳电镀方法及其装置
公开(公告)号：KR101203488B1
公开(公告)日：2012-11-21
申请号：KR20120019985
申请日：2012-02-28
IPC分类号： C25D3/46 , C25D17/00
CPC分类号： C25D3/46 , C25D17/22 , C25D21/16
摘要： PURPOSE: A silver carbon plating method for a contact unit for a switch in contact with electricity is provided to extend the life span of a silver-plated switch and improve the surface resistance and durability by plating a contact unit of the switch with carbon. CONSTITUTION: A silver carbon plating method for a contact unit for a switch in contact with electricity uses a chemical solution which is manufactured by mixing AgCN(Silver Cyanide) of 30-40g/l, NaCN(Sodium Cyanide) of 100-130g/l, NaCO(sodium Carbonate) of 5-10g/l, C of 40-80g/l, a hardening agent of 2-5ml/l, and a wetting agent of 40-60ml/l to improve surface resistance, durability, heat resistance, low-temperature resistance, and wear resistance. A hardening agent of 2-5m/l and an additive of 40-60m/l are added to maintain a current density of 0.2-0.4A/dm^2 and a temperature of 7-35°C. A degreasing process of 20-60 seconds, an AgC plating process of 10-15 minutes, a tarnishing process of 1-3 minutes, and a water separation process of 3 minutes and 40 seconds to 5 minutes. Each lot takes 8-15 minutes and a plating solution is supplemented one time everyday, thereby enhancing surface deterioration.
摘要翻译：目的：提供一种用于与电接触的开关的接触单元的银碳电镀方法，以延长镀银开关的寿命，并通过用碳镀接开关的接触单元来提高表面电阻和耐久性。构成：用于与电接触的开关的接触单元的银碳镀方法使用通过将30-40g / l的AgCN（氰化银），100-130g / l的NaCN（氰化钠）混合而制成的化学溶液，碳酸钙（NaCO）为5-10g / l，C为40-80g / l，硬化剂为2-5ml / l，润湿剂为40-60ml / l，以提高表面电阻，耐久性，耐热性耐低温，耐磨性好。加入2-5m / l的硬化剂和40-60m / l的添加剂以保持0.2-0.4A / dm 2的电流密度和7-35℃的温度。 20-60秒的脱脂处理，10-15分钟的AgC镀敷处理，1-3分钟的变色处理，以及3分40秒5分钟的水分离处理。每批需要8-15分钟，电镀液每天补充一次，从而增强表面变质。

2. 发明公开

KR1020090094094A 표면 처리 장치 有权
标题翻译：表面处理设备
公开(公告)号：KR1020090094094A
公开(公告)日：2009-09-03
申请号：KR1020097012471
申请日：2006-12-27
申请人： 우에무라 고교 가부시키가이샤
发明人： 스기우라유타카 , 하마다료스케 , 우에무라데츠로 , 나카다히데키
IPC分类号： B05C11/08 , B05C3/08 , B08B3/02 , C25D17/22
CPC分类号： C25D17/22 , B08B3/04 , C25D17/16 , C25D17/18 , C25D21/08
摘要： A surface treatment apparatus having, arranged in a single device body (100), a treatment container (11), a vertical rotating shaft (12), a mounting/dismounting mechanism, a receiving tank (15), a cover body (16), tanks (21), surface treatment liquid feeding mechanisms (22), a cleaning water feeding mechanism, a drain mechanism (3), and a first cleaning mechanism. A surface treatment is applied to small articles when surface treatment liquid feeding mechanisms are operated while the treatment container (11) containing the small articles is rotated by the vertical rotating shaft (12). The articles in the treatment container (11) are cleaned when a cleaning water feeding mechanism is operated. The inner surface of the cover body and/or the outer surface of the treatment container is cleaned when the first cleaning mechanism is operated. The surface treatment liquid in the tank is used by circulating it.
摘要翻译：一种表面处理装置，其具有布置在单个装置主体（100），处理容器（11），垂直旋转轴（12），安装/拆卸机构，接收罐（15），盖体（16），水箱（21），表面处理液体供给机构（22），清洁给水机构，排水机构（3）和第一清洁机构。当表面处理液体供给机构在通过竖直旋转轴（12）旋转的处理容器（11）被旋转时，对小物品进行表面处理。当操作清洁水进给机构时，处理容器（11）中的物品被清洁。当操作第一清洁机构时，清洁盖体的内表面和/或处理容器的外表面。罐中的表面处理液通过循环使用。

3. 发明公开

KR1020080005075A 소물 표면 처리 장치 有权
标题翻译：小物体表面处理装置
公开(公告)号：KR1020080005075A
公开(公告)日：2008-01-10
申请号：KR1020070062760
申请日：2007-06-26
申请人： 우에무라 고교 가부시키가이샤
发明人： 스기우라유타카 , 오쿠다도모지 , 나카다히데키
IPC分类号： C25D17/00
CPC分类号： C25D17/22 , C25D21/10
摘要： An apparatus for treating a surface of a small object is provided to plate the small object without losing the small object by forming a gap channel through thin plates spaced apart from each other in a circumference direction to exclusively discharge surface treatment liquid from a treatment cell. An apparatus(1) for treating a surface of a small object(100) comprises a treatment cell(2), and a vertical rotation shaft(3) for rotating the treatment cell on a horizontal surface. The treatment cell has a structure, in which a non-conductive bottom plate(24) overlaps with a non-conductive cover(25) to form an outflow unit for flowing surface treatment liquid(4) out of the treatment cell. The outflow cell is a gap channel that is formed based on thin plates that are spaced apart from each other in a circumference direction between the bottom plate and the cover.
摘要翻译：提供一种用于处理小物体表面的装置，以通过在圆周方向上彼此间隔开的薄板形成间隙通道而不损失小物体来平板化小物体，以从处理池排出表面处理液。用于处理小物体（100）的表面的装置（1）包括处理电池（2）和用于在水平表面上旋转处理电池的垂直旋转轴（3）。处理单元具有非导电底板（24）与非导电盖（25）重叠的结构，以形成用于使表面处理液（4）从处理室流出的流出单元。流出单元是基于在底板和盖之间沿圆周方向彼此间隔开的薄板形成的间隙通道。

4. 发明公开

KR1020050084538A 전자회로부품 有权
标题翻译：电子电路组件
公开(公告)号：KR1020050084538A
公开(公告)日：2005-08-26
申请号：KR1020057013775
申请日：1998-04-17
申请人： 세키스이가가쿠 고교가부시키가이샤
发明人： 다나까요시아끼 , 고데라요시아끼 , 마쓰바라마나부 , 간끼가즈히꼬 , 스즈끼다쓰오 , 우까이가스오
IPC分类号： C25D17/22 , C25D7/00 , H01L21/60 , H01B1/00
CPC分类号： C23C18/1619 , C23C18/1653 , C23C18/31 , C25D5/10 , C25D7/00 , C25D17/22 , H01L21/6715 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/0518 , H01L2224/05572 , H01L2224/05624 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/0568 , H01L2224/13099 , H01L2224/13561 , H01L2224/136 , H01L2224/13609 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12041 , H01L2924/12044 , H01L2924/13034 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , Y10T428/26 , Y10T428/2991 , Y10T428/2998 , H01L2924/00 , H01L2924/00014 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05164 , H01L2924/013
摘要： A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of all particles without aggregating the particles in a plating liquid. The conductive particle making apparatus comprises: a disk-shaped bottom plate secured to the top part of a vertical drive shaft; a porous body arranged on the upper surface of the outer periphery of the bottom plate and allowing only the plating liquid to pass there through; a contact ring arranged on the upper surface of the porous body to conduct electricity; a hollow cover including a truncated cone cover with an opening at its upper central portion and a hollow cylinder of the same diameter as that of the opening attached to the upper end of the truncated cone cover, the upper end portion of the hollow cylinder being folded back on the inner wall side thereof; a rotatable processing chamber formed so as to hold the porous body and the contact ring between the outer periphery of the hollow cover and the bottom plate; a supply pipe to supply the plating liquid from the opening into the processing chamber; a container to receive the plating liquid scattered from the pores of the porous body; a discharge pipe to discharge the plating liquid collected in the container; and an electrode inserted from the opening to contact the plating liquid.
摘要翻译：制造导电颗粒的方法，其有效地允许在每个所有颗粒上形成均匀厚度的镀层，而不会使电镀液体中的颗粒聚集。导电粒子制造装置包括：固定到垂直驱动轴的顶部的盘形底板; 多孔体，其设置在底板的外周的上表面上，仅允许电镀液通过; 接触环，布置在所述多孔体的上表面上以导电; 一个中空的盖子，它包括一个在其上部中心部分具有一个开口的截锥形盖子，以及一个中空圆柱体，该中空圆柱体的直径与安装在截头锥形盖子上端的开口直径相同，中空圆柱体的上端部分被折叠回到其内壁侧; 可旋转处理室，其形成为将多孔体和接触环保持在中空盖的外周与底板之间; 供给管，用于将电镀液体从开口供给到处理室中; 容纳从多孔体的孔隙散布的镀液的容器; 排出管，用于排出收集在容器中的电镀液; 以及从开口插入以接触电镀液体的电极。

5. 发明公开

KR1020050084537A 도전성 미립자의 제조장치 无效
标题翻译：制造导电颗粒的装置
公开(公告)号：KR1020050084537A
公开(公告)日：2005-08-26
申请号：KR1020057013774
申请日：1998-04-17
申请人： 세키스이가가쿠 고교가부시키가이샤
发明人： 다나까요시아끼 , 고데라요시아끼 , 마쓰바라마나부 , 간끼가즈히꼬 , 스즈끼다쓰오 , 우까이가스오
IPC分类号： C25D17/22
CPC分类号： C23C18/1619 , C23C18/1653 , C23C18/31 , C25D5/10 , C25D7/00 , C25D17/22 , H01L21/6715 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/0518 , H01L2224/05572 , H01L2224/05624 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/0568 , H01L2224/13099 , H01L2224/13561 , H01L2224/136 , H01L2224/13609 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12041 , H01L2924/12044 , H01L2924/13034 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , Y10T428/26 , Y10T428/2991 , Y10T428/2998 , H01L2924/00 , H01L2924/00014 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05164 , H01L2924/013
摘要： A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of all particles without aggregating the particles in a plating liquid. The conductive particle making apparatus comprises: a disk-shaped bottom plate secured to the top part of a vertical drive shaft; a porous body arranged on the upper surface of the outer periphery of the bottom plate and allowing only the plating liquid to pass there through; a contact ring arranged on the upper surface of the porous body to conduct electricity; a hollow cover including a truncated cone cover with an opening at its upper central portion and a hollow cylinder of the same diameter as that of the opening attached to the upper end of the truncated cone cover, the upper end portion of the hollow cylinder being folded back on the inner wall side thereof; a rotatable processing chamber formed so as to hold the porous body and the contact ring between the outer periphery of the hollow cover and the bottom plate; a supply pipe to supply the plating liquid from the opening into the processing chamber; a container to receive the plating liquid scattered from the pores of the porous body; a discharge pipe to discharge the plating liquid collected in the container; and an electrode inserted from the opening to contact the plating liquid.
摘要翻译：制造导电颗粒的方法，其有效地允许在每个所有颗粒上形成均匀厚度的镀层，而不会使电镀液体中的颗粒聚集。导电粒子制造装置包括：固定到垂直驱动轴的顶部的盘形底板; 多孔体，其设置在底板的外周的上表面上，仅允许电镀液通过; 接触环，布置在所述多孔体的上表面上以导电; 一个中空的盖子，它包括一个在其上部中心部分具有一个开口的截锥形盖子，以及一个中空圆柱体，该中空圆柱体的直径与安装在截头锥形盖子上端的开口直径相同，中空圆柱体的上端部分被折叠回到其内壁侧; 可旋转处理室，其形成为将多孔体和接触环保持在中空盖的外周与底板之间; 供给管，用于将电镀液体从开口供给到处理室中; 容纳从多孔体的孔隙散布的镀液的容器; 排出管，用于排出收集在容器中的电镀液; 以及从开口插入以接触电镀液体的电极。

6. 发明公开

KR20180046760A 도금 바스켓용 클램프 有权
公开(公告)号：KR20180046760A
公开(公告)日：2018-05-09
申请号：KR20160142324
申请日：2016-10-28
申请人： 박경이
发明人： 박경이
IPC分类号： C25D17/16 , C25D17/06 , C25D17/22
CPC分类号： C25D17/16 , C25D17/06 , C25D17/22
摘要： 도금바스켓용클램프를개시한다. 이러한도금바스켓용클램프는, 도금용바스켓측에담겨지는기판의가장자리부분을집어서고정하기위한클램프로서, 도금용바스켓측에고정되는브래킷과, 상기브래킷측에서서로간격을띄우고배치되는가압구및 지지구를구비한클램핑부그리고, 캠축(CAM SHAFT)을구비하고, 이캠축의캠 접촉력으로상기클램핑부의가압구를지지구측을향하여누름또는누름해제동작이가능하게조작할수 있도록형성되는조작부를포함한다.

7. 发明公开

KR1020140114631A 내부에 홀이 형성된 도금대상물용 거치대 분리형 도금프레임 无效
标题翻译：用于物体的可拆卸的支架保持在铸造框架内形成的孔中
公开(公告)号：KR1020140114631A
公开(公告)日：2014-09-29
申请号：KR1020130029161
申请日：2013-03-19
申请人： 성신공업(주)
发明人： 박윤배
IPC分类号： C25D17/06 , C25D17/08
CPC分类号： C25D17/06 , C25D7/04 , C25D17/22
摘要： The present invention relates to a plating frame for plating objects to be plated, and more particularly, to a holder which prevents an object to be plated having a hole from being shaken and a plating frame which can be separated from the holder. The plating frame used for holding the objects to be plated used in a plating process includes a main frame; multiple holding means being inserted to the cylindrical object to be plated having a hole and gradually increasing the volume or the width toward the lower part of the holding means in order to be spaced apart from the lower part at a predetermined distance; a holding frame formed of a connection frame connected to the multiple holding means; and a main holding frame fixed to the main frame and formed with holding grooves to mount and to demount the holding frame.
摘要翻译：本发明涉及一种用于镀覆被镀物体的电镀框架，更具体地，涉及一种防止被电镀物体被摇动的保持件和可与保持器分离的电镀框架。用于保持电镀过程中使用的被镀物体的电镀框架包括主框架; 多个保持装置被插入到具有孔的待镀的圆柱形物体中，并且朝向保持装置的下部逐渐增加容积或宽度，以便以预定距离与下部分开; 由与多个保持装置连接的连接框架形成的保持框架; 以及固定在主框架上并形成有用于安装和拆卸保持框架的保持槽的主保持框架。

8. 发明公开

KR1020140064437A 드럼 회전방식을 이용한 커넥터핀의 부분 전기 도금장치 有权
标题翻译：通过连接器引脚电镀单元的旋转部分的方式
公开(公告)号：KR1020140064437A
公开(公告)日：2014-05-28
申请号：KR1020120131773
申请日：2012-11-20
申请人： 대성하이피(주)
发明人： 박용복
IPC分类号： C25D5/48 , C25D5/02 , C25F3/02
CPC分类号： C25D5/026 , C25D17/06 , C25D17/22
摘要： The present invention relates to a partial electro-plating device which is capable of plating selectively a desired part of a plated body such as a connector pin. According to an embodiment of the present invention, the partial electro-plating device comprises: a cylindrical fixing body having a plating solution supply pipe inside, and having a bearing in the outer circumference surface of the upper part; a plating solution spraying block formed in the fixing body, and having a plating solution accommodating part connected to the plating solution supply pipe inside, and having a plating solution spraying hole in the outer circumference surface; a drum mask holder rotating on the fixing body, and having a supporting part; a cover member connected to the upper end of the fixing body to apply an anode current to the plating solution accommodating part; and a drum mask rotating with the drum mask holder, and having a plating solution nozzle hole in the outer circumference surface, and having a position determining pin in the lower part of the outer circumference surface. Therefore, the plating work is efficiently and diversely performed since the partial electro-plating device is capable of plating stably, rapidly, and accurately the desired part of a plated body continuously transferred, and plating one side or both sides of the plated body in order, and plating both sides of the plated body to be different from each other.
摘要翻译：本发明涉及能够选择性地镀覆诸如连接器针的电镀体的期望部分的部分电镀装置。根据本发明的一个实施例，部分电镀装置包括：圆筒形固定体，其内部具有电镀液供给管，并且在上部的外周表面具有轴承; 形成在所述固定体中的电镀液喷射块，并且具有与所述电镀液供给管内部连接的电镀液容纳部，并且在所述外周面具有电镀液喷射孔; 鼓面罩座，其在所述固定体上旋转，并具有支撑部; 连接到所述固定体的上端的盖构件，以向所述电镀液容纳部施加阳极电流; 以及鼓面罩，其与鼓面罩座一体地旋转，并且在外周面具有电镀液喷嘴孔，并且在外周面的下部具有定位销。因此，由于部分电镀装置能够稳定，快速，准确地平铺电镀体的所需部分连续转印，并且依次镀覆镀层的一面或两面，因此能够有效且多样化地进行电镀作业并且将镀覆体的两侧彼此不同。

9. 发明公开

KR1020130030835A 병렬 구조의 엘리베이터식 자동 휠 너트 도금 장치 无效
标题翻译：一种用于自动切割轮胎的装置
公开(公告)号：KR1020130030835A
公开(公告)日：2013-03-28
申请号：KR1020110094355
申请日：2011-09-20
申请人： 전태원
发明人： 전태원
IPC分类号： C25D17/06 , C25D17/10 , C25D7/00
CPC分类号： C25D17/007 , B65G49/04 , C25D7/003 , C25D17/06 , C25D17/22
摘要： PURPOSE: An apparatus for automatically plating wheel nuts is provided to plate a large amount of wheel nuts with an increasing plating speed, and to reduce a distance between electrodes by adjusting the arrangement of the electrodes in order to supply a high current. CONSTITUTION: An apparatus for automatically plating wheel nuts comprises a plating device(10) and electrode lines(200,210,220). The plating device comprises a body plate, a support line, and an electrode plate. The support line is coupled to one side of the body plate and is extended to a predetermined length. The electrode plate is separately coupled to the support line so that an electrode locker can be hung. The plating device supplies current by an electrode connection rod and the electrode plate. The electrode line is formed in a vertical direction to the support line along the longitudinal direction of a plating bath, and supplies current to the plating solution of the plating bath.
摘要翻译：目的：提供一种用于自动电镀车轮螺母的装置，以增加电镀速度对大量的车轮螺母进行打板，并通过调节电极的布置来减小电极之间的距离，以便提供高电流。构成：用于自动电镀车轮螺母的装置包括电镀装置（10）和电极线（200,210,220）。电镀装置包括主体板，支撑线和电极板。支撑线连接到主体板的一侧并延伸到预定长度。电极板分别耦合到支撑线，使得电极锁可以悬挂。电镀装置通过电极连接杆和电极板供电。电极线沿着镀浴的长度方向与支撑线垂直的方向形成，向电镀液的电镀液供给电流。

10. 发明公开

KR1020110135252A 접속단자 부분 도금장치 有权
标题翻译：连接端子部分涂层设备
公开(公告)号：KR1020110135252A
公开(公告)日：2011-12-16
申请号：KR1020100055056
申请日：2010-06-10
申请人： 박해병
发明人： 박해병
IPC分类号： C25D5/02 , C25D17/00 , C25D17/12
CPC分类号： C25D5/022 , C25D5/026 , C25D5/48 , C25D17/06 , C25D17/22
摘要： PURPOSE: A device for partially coating a connection terminal is provided to efficiently coat the surface of connection terminal of a terminal module with gold or silver. CONSTITUTION: A device for partially coating a connection terminal comprises a terminal module(40), a pair of shield panels(50), and a coating liquid jetting unit. The shield panels are arranged on both surfaces of the terminal module and support the terminal module. The shield panels have coating holes(52). Connection terminals are exposed to the outside through the coating holes. The coating liquid jetting unit jets a coating liquid to the coating holes of the shield panels. The exposed surfaces of the connection terminals are coated with the jet coating liquid.
摘要翻译：目的：提供一种用于部分涂覆连接端子的装置，以有效地用金或银涂覆终端模块的连接端子的表面。构成：用于部分地涂覆连接端子的装置包括端子模块（40），一对屏蔽板（50）和涂布液喷射单元。屏蔽板布置在端子模块的两个表面上并支撑端子模块。屏蔽板具有涂层孔（52）。连接端子通过涂层孔暴露于外部。涂布液喷射单元将涂布液喷射到屏蔽板的涂布孔。连接端子的暴露表面涂覆有喷射涂布液体。

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