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    • 33. 发明公开
    • 연마 완료 시점의 예측 방법과 그 장치
    • 用于预测抛光端点的方法和装置
    • KR1020090024072A
    • 2009-03-06
    • KR1020080083970
    • 2008-08-27
    • 가부시키가이샤 토쿄 세이미쯔
    • 후지타타카시
    • H01L21/304
    • G01B7/06B24B37/013B24B49/105
    • A method and device for forecasting the polishing end point is provided to perform the polishing for the polishing time which is calculated after detecting the critical change and to polish the conductive film. The polishing device(1) is comprised of the platen(2) and polishing head(3). The axis of rotation(4) is connected to the center of lower face of platen. The polishing pad(6) is adhered in the upper side of platen. The device(33) for forecasting the polishing end point is formed on the top of platen. The slip ring(32) outputs the detection signal of the critical change from the device for forecasting the polishing end point to outside. The inductor(36) is comprised of the meander type.
    • 提供了一种用于预测抛光终点的方法和装置,用于对在检测到临界变化后计算的抛光时间进行抛光,并抛光导电膜。 抛光装置(1)由压板(2)和抛光头(3)构成。 旋转轴(4)连接到压板下表面的中心。 抛光垫(6)粘附在台板的上侧。 用于预测抛光终点的装置(33)形成在压板的顶部。 滑环(32)将用于预测抛光终点的装置的临界变化的检测信号输出到外部。 电感器(36)由曲折型构成。
    • 34. 发明公开
    • 시편 두께측정장치 및 이를 갖는 시편 그라인딩 설비,시편의 그라인딩방법
    • 用于测量样品厚度的装置和具有该样品的样品研磨装置和研磨样品的方法
    • KR1020080079050A
    • 2008-08-29
    • KR1020070019084
    • 2007-02-26
    • 삼성전자주식회사
    • 박복경김승범
    • G01B21/08B24B1/00
    • G01B17/02B24B1/00G01B7/06G01B11/0616
    • An apparatus for measuring thickness of a sample, sample grinding equipment therewith and a grinding method of the sample are provided to reduce the time for a grinding process by grinding the sample until the sample has a predetermined thickness. Sample grinding equipment with an apparatus for measuring thickness of a sample(91) includes a hole(110), a holder(100), a mount(90), a wheel(200), and a thickness measurement unit(400). The holder has the hole in center thereof and an elastic member(120). The mount is inserted in the hole, is supported by the elastic member, and mounts the sample thereon. The wheel is arranged below the mount and grinds the sample. The thickness measurement unit includes a first sensor(410), a motor(220), and a controller(440). The first sensor measures the thickness of the sample. The motor is connected to the wheel and provides the wheel with torque. The controller is electrically connected to the first sensor and the motor, determines a reference thickness of the sample, and controls the motor for realizing the reference thickness of the sample.
    • 提供了用于测量样品厚度的装置,其中的样品研磨设备和样品的研磨方法,以通过研磨样品来减少研磨过程的时间,直到样品具有预定厚度。 具有用于测量样品(91)的厚度的装置的样品研磨设备包括孔(110),保持器(100),安装件(90),轮(200)和厚度测量单元(400)。 保持器在其中心具有孔和弹性构件(120)。 安装件插入孔中,由弹性构件支撑,并将样品安装在其上。 车轮布置在安装座下面并研磨样品。 厚度测量单元包括第一传感器(410),电机(220)和控制器(440)。 第一个传感器测量样品的厚度。 电机连接到车轮上,为车轮提供扭矩。 控制器电连接到第一传感器和电动机,确定样品的参考厚度,并控制电动机以实现样品的参考厚度。
    • 35. 发明公开
    • 유전체 두께 결정 방법 및 장치와 전기 소자 제조 방법
    • 用于确定介质层厚度的方法和装置
    • KR1020060007020A
    • 2006-01-23
    • KR1020057019552
    • 2004-04-14
    • 엔엑스피 비 브이
    • 마즈히프라샨트
    • H01L21/66
    • G01B7/06
    • The method for determining the thickness of a dielectric layer according to the invention comprises the step of providing an electrically conductive body (11) having a dielectric layer (13) which is separated from the electrically conductive body (11) by at least a further dielectric layer (3) and a surface (15) of which is exposed. Onto the exposed surface (15) an electric charge is deposited, thereby inducing an electric potential difference between the exposed surface (15) and the electrically conductive body (11). An electrical parameter relating to the electric potential difference is determined and a measurement is performed to obtain additional measurement data relating to the thickness of the dielectric layer (13) and/or to the thickness of the further dielectric layer (3). In this way the thickness of the dielectric layer (13) and/or of the further dielectric layer (3) is determined. The method of manufacturing an electric device (100) comprises this method for determining the thickness of a dielectric layer. The apparatus (10) for determining the thickness of a dielectric layer is arranged to execute this method.
    • 根据本发明的用于确定电介质层的厚度的方法包括提供具有电介质层(13)的导电体(11)的步骤,所述电介质层通过至少另外的电介质(13)与导电体(11)分离, 层(3)和其表面(15)暴露。 在暴露表面(15)上沉积电荷,从而在暴露表面(15)和导电体(11)之间产生电位差。 确定与电位差有关的电参数,并进行测量以获得与介电层(13)的厚度和/或另外的电介质层(3)的厚度有关的附加测量数据。 以这种方式确定电介质层(13)和/或另外的电介质层(3)的厚度。 制造电气设备(100)的方法包括用于确定电介质层的厚度的方法。 用于确定电介质层的厚度的装置(10)被布置成执行该方法。
    • 39. 发明公开
    • 변위 검출 장치 및 방법
    • 位移检测装置和方法
    • KR1020160107530A
    • 2016-09-19
    • KR1020150030386
    • 2015-03-04
    • 알엠에스테크놀러지(주)
    • 이홍기
    • G01B7/00G01B7/16G01B7/02G01B7/06
    • G01B7/16G01B7/023G01B7/06
    • 본발명은변위검출장치및 방법에관한것으로, 보다상세하게는, 와전류(Eddy Current) 방식의센서를이용하여임피던스변화를내장회로에의해주파수변화로변환하여검출하는변위검출장치및 방법에관한것이다. 본발명에따른변위검출장치및 방법은, 환경노이즈에도강하고, 변위검출의정밀도를확보하므로사용자가원하는요구성능에부합하는제품을제공할수 있으며, 아날로그신호보정시부담되는비용도절감되므로경제성을확보하는데도효과가있다.
    • 位移检测装置和方法技术领域本发明涉及一种位移检测装置和方法,更具体地涉及一种位移检测装置和方法,其中通过具有传感器的嵌入式电路转换为频率变化来检测阻抗的变化,所述传感器具有 涡流法。 根据本发明,位移检测装置和方法对于环境噪声是强大的,并且可以确保位移检测的精度,以提供适合用户想要的所需性能的产品。 此外,当校正模拟信号时,可以降低费用以确保经济可行性。