基本信息:
- 专利标题: 연마 완료 시점의 예측 방법과 그 장치
- 专利标题(英):Method and device for forecasting polishing end point
- 专利标题(中):用于预测抛光端点的方法和装置
- 申请号:KR1020080083970 申请日:2008-08-27
- 公开(公告)号:KR1020090024072A 公开(公告)日:2009-03-06
- 发明人: 후지타타카시
- 申请人: 가부시키가이샤 토쿄 세이미쯔
- 申请人地址: ****-*, Ishikawa-machi, Hachioji-shi, Tokyo, Japan
- 专利权人: 가부시키가이샤 토쿄 세이미쯔
- 当前专利权人: 가부시키가이샤 토쿄 세이미쯔
- 当前专利权人地址: ****-*, Ishikawa-machi, Hachioji-shi, Tokyo, Japan
- 代理人: 황의만
- 优先权: JPJP-P-2007-00228145 2007-09-03
- 主分类号: H01L21/304
- IPC分类号: H01L21/304
摘要:
A method and device for forecasting the polishing end point is provided to perform the polishing for the polishing time which is calculated after detecting the critical change and to polish the conductive film. The polishing device(1) is comprised of the platen(2) and polishing head(3). The axis of rotation(4) is connected to the center of lower face of platen. The polishing pad(6) is adhered in the upper side of platen. The device(33) for forecasting the polishing end point is formed on the top of platen. The slip ring(32) outputs the detection signal of the critical change from the device for forecasting the polishing end point to outside. The inductor(36) is comprised of the meander type.
摘要(中):
提供了一种用于预测抛光终点的方法和装置,用于对在检测到临界变化后计算的抛光时间进行抛光,并抛光导电膜。 抛光装置(1)由压板(2)和抛光头(3)构成。 旋转轴(4)连接到压板下表面的中心。 抛光垫(6)粘附在台板的上侧。 用于预测抛光终点的装置(33)形成在压板的顶部。 滑环(32)将用于预测抛光终点的装置的临界变化的检测信号输出到外部。 电感器(36)由曲折型构成。
公开/授权文献:
- KR101543663B1 연마 완료 시점의 예측 방법과 그 장치 公开/授权日:2015-08-11
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料 |
--------------H01L21/26 | ....用波或粒子辐射轰击的 |
----------------H01L21/302 | .....改变半导体材料的表面物理特性或形状的,例如腐蚀、抛光、切割 |
------------------H01L21/304 | ......机械处理,例如研磨、抛光、切割 |