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21. 发明授权

KR100969441B1 반도체칩이 실장된 인쇄회로기판 및 그 제조방법 有权
标题翻译：包含半导体芯片的印刷电路板及其制造方法
公开(公告)号：KR100969441B1
公开(公告)日：2010-07-14
申请号：KR1020080053041
申请日：2008-06-05
申请人： 삼성전기주식회사
发明人： 백종환 , 이성 , 권영도 , 이종윤 , 전형진 , 강준석
IPC分类号： H05K3/18 , H05K3/34
CPC分类号： H05K3/3436 , H01L23/3114 , H01L24/11 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05647 , H01L2224/13022 , H01L2224/131 , H01L2224/16 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H05K3/3463 , H05K2201/10992 , Y02P70/613 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2924/00014
摘要： 본 발명에 따른 반도체칩이 실장된 인쇄회로기판은, 상면에 노출된 접속패드를 구비하는 반도체칩, 상기 접속패드 상에 형성된 제1 융점을 가지는 제1 솔더볼, 최외각 회로층에 형성된 외부접속단자를 구비하는 인쇄회로기판 및 상기 외부접속단자 상에 형성되고 상기 제1 솔더볼과 접속되며, 상기 제1 융점보다 높은 제2 융점을 갖는 제2 솔더볼을 포함하는 구성된다. 본 발명에 따른 반도체칩이 실장된 인쇄회로기판은, 인쇄회로기판과 반도체칩 사이의 거리가 늘어나기 때문에 인쇄회로기판과 반도체칩 사이의 열팽창계수 차이에 의한 휘어짐 현상에 대한 내성이 높다.
솔더볼, 반도체칩, 융점, 인쇄회로기판, 열팽창계수

22. 发明公开

KR1020100034765A 차재 전자 회로용 Ｉｎ 함유 무납 땜납 有权
标题翻译：包含用于车载电子电路的无铅焊枪
公开(公告)号：KR1020100034765A
公开(公告)日：2010-04-01
申请号：KR1020107003337
申请日：2008-07-17
申请人： 센주긴조쿠고교 가부시키가이샤
发明人： 가와마타유지 , 우에시마미노루 , 다무라도무 , 마츠시타가즈히로 , 사카모토마사시
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： C22C13/00 , B23K35/26 , B23K35/262 , H05K3/3463
摘要： Disclosed is a lead-free solder alloy having high reliability, which can be used for soldering an on-vehicle electronic circuit.Specifically disclosed is a lead-free solder alloy containing 2.8-4% by mass of Ag, 3-5.5% by mass of In, 0.5-1.1% by mass of Cu, additionally if necessary, 0.5-3% by mass of Bi, and the balance of Sn. In this lead-free solder alloy, In is solid-solved in at least a part of the Sn matrix.
摘要翻译：公开了一种具有高可靠性的无铅焊料合金，其可用于焊接车载电子电路。具体公开了一种含有2.8-4质量％Ag的无铅焊料合金，为3-5.5质量％的In，0.5-1.1质量％的Cu，另外如果需要，0.5-3质量％的Bi，余量为Sn。在这种无铅焊料合金中，In固溶于Sn基体的至少一部分。

23. 发明公开

KR1020090049729A 반도체 제조장비 셋업용 더미 피시비 有权
标题翻译：用于设置半导体器件封装的DUMMY PCB
公开(公告)号：KR1020090049729A
公开(公告)日：2009-05-19
申请号：KR1020070115971
申请日：2007-11-14
申请人： 서경성
发明人： 서경성
IPC分类号： H05K3/34 , H05K3/40
CPC分类号： H05K3/3463 , H05K1/0266 , H05K3/4038 , H05K2201/09918 , H05K2201/09936
摘要： 본 발명은 반도체 제조장비 셋업용 더미 피시비(PCB)에 관한 것으로서, 더욱 상세하게는 각 공정의 반도체 생산을 위해서 반도체의 특성에 맞도록 설비를 셋업하는 경우에 사용되는 더미 PCB에 관한 것이다.
본 발명에 따른 반도체 제조장비 셋업용 더미 PCB는, 반도체 제조를 위해 각 반도체의 특성에 맞도록 설비를 셋업하는데 사용하는 PCB로서, 에폭시 계열의 수지로 이루어진 본체의 표면에 동(Copper)을 입혀 본체의 표면에 구리층이 형성되는 반도체 제조장비 셋업용 더미 PCB에 있어서;
상기 더미 PCB는 공정별 설비의 인식에 필요한 센싱 마크가 형성되고, 웨이퍼를 절단한 단위 반도체칩이 장착되는 다수의 블록이 종횡으로 배열되어 이루어지되, 각 블록에는 솔더볼을 장착할 수 있는 솔더볼 랜드가 배열되는 것을 특징으로 한다.
셋업, 더미 PCB, 솔더볼 랜드, 홀, 센싱 마크

24. 发明公开

KR1020080096264A 취성파괴 방지를 위한 무전해 ＮｉＸＰ로 표면처리된전자부품의 접합 방법 失效
标题翻译：一种防止电子元器件焊接接头使用电镀NIXP作为UBM的脆性断裂的方法
公开(公告)号：KR1020080096264A
公开(公告)日：2008-10-30
申请号：KR1020070041498
申请日：2007-04-27
申请人： 한국과학기술원
发明人： 유진 , 장동민 , 지영근
IPC分类号： H01L21/60 , H05K3/30
CPC分类号： B23K1/0016 , B23K35/262 , B23K2201/40 , H01L2224/03464 , H01L2224/0401 , H01L2224/05155 , H01L2224/05644 , H01L2224/05664 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2224/16503 , H01L2924/01004 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H05K3/244 , H05K3/3463 , H05K2203/072 , H01L2924/00 , H01L2924/00014 , H01L2924/014
摘要： A solder joint method of electronic components is provided to improve the reliability of electronic device by preventing the brittle fracture in solder joint and spall of metal compounds. A method for preventing the brittle fracture in a solder joint of electronic components includes the step of forming an electroless NiXP metal layer(14) in a metal wire of electronic component; the step of reflowing and joining the lead free solder on an electroless NiXP layer. The junction of the electronic component is used for a semiconductor chip and a package component, and the package component and a printed circuit board(22) or the semiconductor chip and the printed circuit board.
摘要翻译：提供电子部件的焊接方法，以通过防止焊点中的脆性断裂和金属化合物的剥落来提高电子器件的可靠性。防止电子部件的焊点的脆性断裂的方法包括在电子部件的金属线中形成无电镀NiXP金属层（14）的工序; 在无电NiXP层上回流焊接无铅焊料的步骤。电子部件的接点用于半导体芯片和封装部件，以及封装部件和印刷电路板（22）或半导体芯片和印刷电路板。

25. 发明公开

KR1020080077399A 솔더 합금, 솔더 볼 및 그것을 사용한 솔더 접합부 有权
标题翻译：焊接合金，焊球和焊接接头
公开(公告)号：KR1020080077399A
公开(公告)日：2008-08-22
申请号：KR1020087016697
申请日：2007-01-15
申请人： 히타치 긴조쿠 가부시키가이샤
发明人： 후지요시마사루 , 다테마사요시
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： H05K3/3463 , B23K35/0261 , B23K35/26 , B23K35/262 , B23K35/3033 , C22C13/00 , H01L24/13 , H01L2924/01004 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H05K3/244 , H01L2924/00
摘要： Disclosed is a Pb-free solder alloy consisting of, in mass%, 0.1-1.5% of Ag, 0.5-0.75% of Cu, Ni in an amount satisfying 12.5
摘要翻译：公开了以质量％计含有0.1-1.5％的Ag，0.5-0.75％的Cu，Ni，其满足12.5 <= Cu / Ni <= 100的量的无铅焊料合金，其余为Sn和不可避免的杂质。焊料合金优选以Ag计为0.3-1.2％，Ni为0.01-0.04％。还公开了通过球化焊料合金获得的焊球。此外，焊料合金适用于Ni电极上的焊点。焊料合金具有优异的耐滴落冲击性，同时在高温条件下长时间抑制接合强度的降低。

26. 发明公开

KR1020080024217A 무연 반도체 패키지 无效
标题翻译：无铅半导体封装
公开(公告)号：KR1020080024217A
公开(公告)日：2008-03-17
申请号：KR1020087002152
申请日：2006-04-19
申请人： 어드밴스드 마이크로 디바이시즈, 인코포레이티드
发明人： 마스터라즈엔. , 아나드스리니바산아쇽 , 파사사라디스리니바산 , 무이유청
IPC分类号： H01L21/60 , B23K35/26 , H01L23/498 , C22C13/00
CPC分类号： C22C13/02 , B23K35/262 , H01L23/49811 , H01L24/81 , H01L24/97 , H01L2224/16225 , H01L2224/8121 , H01L2224/81815 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/15312 , H01L2924/19105 , H05K3/3463 , H05K2201/10318 , H05K2201/10674 , H05K2203/047 , H01L2224/81 , H01L2224/0401
摘要： A package substrate (4) includes die solder pads (3) and pin solder fillets (5). The pin solder fillets (5) might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads (3) might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads (3) might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin. ® KIPO & WIPO 2008
摘要翻译：封装基板（4）包括模焊盘（3）和焊脚焊脚（5）。针焊料焊脚（5）可以包括约90重量％至约99重量％的锡和约10重量％至1重量％的锑。模焊盘（3）可以包括约4重量％至约8重量％的铋，约2重量％至约4重量％的银，约0重量％至约0.7重量％的铜，以及约87重量％至约 92重量％锡。模具焊盘（3）可以包括约7重量％至约20重量％的铟，约2重量％至约4.5重量％的银之间，约0重量％至约0.7重量％的铜之间，约0重量％至约0.5重量％的锑，以及约74.3重量％至约90重量％的锡。 ®KIPO＆WIPO 2008

27. 发明公开

KR1020080009229A 다층 프린트 배선판 및 그 부품 실장 방법 有权
标题翻译：多层印刷电路板及其零件安装方法
公开(公告)号：KR1020080009229A
公开(公告)日：2008-01-25
申请号：KR1020077028729
申请日：2007-02-01
申请人： 이비덴 가부시키가이샤
发明人： 요코마쿠도시히코
IPC分类号： H05K3/46 , H05K3/34
CPC分类号： H05K3/3463 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/16251 , H05K1/0262 , H05K1/141 , H05K3/341 , H05K3/3415 , H05K3/3457 , H05K3/4602 , H05K2201/045 , H05K2201/10189 , H05K2201/10318 , H05K2201/10424 , H05K2201/10674 , H05K2203/1572 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , H01L2224/05599
摘要： Provided are a multilayer printed-circuit board, which can mount parts easily, which is excellent in working efficiency or which is easily reworkable, and a mounting method therefor. The method mounts the parts of the multilayer printed-circuit board, which is formed with a plurality of solder bumps for mounting the electronic parts on the surface side and/or the back side. The solder bumps are individually formed of any of a first solder, a second solder and a third solder, and the electronic parts and so on are soldered sequentially from the higher melting point, when the first solder, the second solder and the third solder have melting points in the order of a higher temperature of the first solder, the second solder and the third solder. At this time, it is preferred that the solder bump having the larger volume is soldered the earlier.
摘要翻译：提供一种多层印刷电路板，其可以容易地安装部件，其工作效率优异或易于再加工，并且其安装方法。该方法安装多层印刷电路板的部件，其形成有用于将电子部件安装在表面侧和/或背面上的多个焊料凸块。焊料凸块由第一焊料，第二焊料和第三焊料中的任一个单独形成，并且当第一焊料，第二焊料和第三焊料具有第一焊料，第二焊料和第三焊料时，电子部件等从较高熔点顺序地焊接第一焊料，第二焊料和第三焊料的温度高的顺序的熔点。此时，优选较早地焊接具有较大体积的焊料凸块。

28. 发明授权

KR100756134B1 솔더 및 그것을 사용한 실장품 有权
标题翻译：焊接和安装的文章使用相同
公开(公告)号：KR100756134B1
公开(公告)日：2007-09-05
申请号：KR1020067021565
申请日：2005-04-21
申请人： 닛본 덴끼 가부시끼가이샤
发明人： 후나야타쿠오 , 묘가오사무 , 마츠이코지
IPC分类号： B23K35/26 , H05K3/34 , C22C13/00
CPC分类号： C22C13/00 , B23K35/262 , H05K3/3463 , Y10T428/12 , Y10T428/12708
摘要： Sn-Zn계 합금 솔더는, Zn: 7 내지 10질량%, Ag: 0.075 내지 1질량%, Al: 0.07 내지 0.5질량%를 함유하고, 또한 Bi: 0.01 내지 6질량% 및 Cu: 0.007 내지 0.1질량%의 1종 또는 2종을 함유하고, 필요에 응하여, Mg: 0.007 내지 0.1질량%를 함유하고, 잔부가 Sn 및 불가피적 불순물로 이루어지는 조성을 갖는다. 이 솔더는, 종래의 Sn-37중량% Pb 공정계 솔더과 동등한 작섭성, 사용조건, 및 접속 신뢰성을 구비하고, 또한 인체에 대해 유해한 납을 포함하지 않는다.

29. 发明公开

KR1020070082068A 희석용 무연 솔더 조성물과 이를 이용한 전자기기 및인쇄회로기판 有权
标题翻译： DILUENT PB免费焊接组合物，电子设备和PCB
公开(公告)号：KR1020070082068A
公开(公告)日：2007-08-20
申请号：KR1020070015651
申请日：2007-02-14
申请人： 주식회사 에코조인
发明人： 고명완 , 박상복 , 송명규 , 박윤수 , 이광열
IPC分类号： C22C13/00 , B23K35/22 , B23K35/26 , H05K3/34
CPC分类号： C22C13/00 , B23K35/262 , H05K3/3457 , H05K3/3463
摘要： A Pb-free solder composition for dilution which improves soldering efficiency by containing Si and Co in a binary Sn-Ag solder composition or a ternary Sn-Ag-P solder composition, thereby consistently suppressing the generation of oxides by the silicon, and an electronic equipment and a PCB using the same are provided. A Pb-free solder composition for dilution comprises 0.1 to 4 wt.% of silver, 0.001 to less than 0.05 wt.% of silicon, and the balance of tin. The Pb-free solder composition for dilution further comprises 0.001 to 0.2 wt.% of phosphorous. The Pb-free solder composition for dilution further comprises 0.001 to less than 0.01 wt.% of cobalt. As an electronic equipment comprising a plurality of electronic components adhered by a Pb-free solder alloy for dilution, the electronic equipment is characterized in that the Pb-free solder alloy for dilution comprises 0.1 to 4 wt.% of silver, 0.001 to less than 0.05 wt.% of silicon, and the balance of tin. As a PCB(printed circuit board) adhered by a Pb-free solder alloy for dilution, the PCB is characterized in that the Pb-free solder alloy for dilution comprises 0.1 to 4 wt.% of silver, 0.001 to less than 0.05 wt.% of silicon, and the balance of tin.
摘要翻译：一种用于稀释的无铅焊料组合物，其通过在二元Sn-Ag焊料组合物或三元Sn-Ag-P焊料组合物中含有Si和Co来提高焊接效率，从而一致地抑制由硅产生的氧化物，以及电子提供设备和使用该设备的PCB。用于稀释的无铅焊料组合物包含0.1至4重量％的银，0.001至小于0.05重量％的硅，余量为锡。用于稀释的无铅焊料组合物还包含0.001至0.2重量％的磷。用于稀释的无铅焊料组合物还包含0.001至小于0.01重量％的钴。作为包含由无铅焊料合金稀释的多个电子部件的电子设备，电子设备的特征在于，用于稀释的无铅焊料合金为0.1〜4重量％的银，0.001〜小于 0.05重量％的硅，余量为锡。作为通过无铅焊料合金进行稀释的PCB（印刷电路板），PCB的特征在于用于稀释的无铅焊料合金为0.1〜4重量％的银，0.001〜0.05重量％以下。硅的百分比，锡的余量。

30. 发明公开

KR1020070082058A 웨이브 및 디핑용 무연 솔더 조성물과 이를 이용한 전자기기 및 인쇄회로기판 有权
标题翻译： PB自由焊接组合物，电子设备和PCB
公开(公告)号：KR1020070082058A
公开(公告)日：2007-08-20
申请号：KR1020070015638
申请日：2007-02-14
申请人： 주식회사 에코조인
发明人： 고명완 , 박상복 , 송명규 , 박윤수 , 이광열
IPC分类号： C22C13/00 , B23K35/22 , B23K35/26 , H05K3/34
CPC分类号： C22C13/00 , B23K35/262 , H05K3/3457 , H05K3/3463
摘要： A Pb-free solder composition which prevents oxidation of molten solder consistently and effectively, maintains conventional Pb-free soldering temperature and wettability, and can improve soldering adhesive property by containing Si and Co in a quaternary Sn-Cu-Ni-P solder composition, and an electronic equipment and a PCB using the same are provided. A Pb-free solder composition comprises 0.1 to 2 wt.% of copper, 0.001 to 1.0 wt.% of nickel, 0.001 to less than 0.05 wt.% of silicon, 0.001 to 0.2 wt.% of phosphorous, and the balance of tin. The Pb-free solder composition further comprises 0.001 to less than 0.01 wt.% of cobalt. As an electronic equipment comprising a plurality of electronic components adhered by a Pb-free solder alloy, the electronic equipment is characterized in that the Pb-free solder alloy comprises 0.1 to 2 wt.% of copper, 0.001 to 1.0 wt.% of nickel, 0.001 to less than 0.05 wt.% of silicon, 0.001 to 0.2 wt.% of phosphorous, and the balance of tin. As a PCB(printed circuit board) adhered by a Pb-free solder alloy, the PCB is characterized in that the Pb-free solder alloy comprises 0.1 to 2 wt.% of copper, 0.001 to 1.0 wt.% of nickel, 0.001 to less than 0.05 wt.% of silicon, 0.001 to 0.2 wt.% of phosphorous, and the balance of tin.
摘要翻译：无铅焊料组合物能够一致地有效地防止熔融焊料的氧化，保持常规的无铅焊接温度和润湿性，并且可以通过在Si-Cu-Ni-P四元锡焊料组合物中含有Si和Co来提高焊接粘合性，并提供电子设备和使用该设备的PCB。无铅焊料组合物包含0.1至2重量％的铜，0.001至1.0重量％的镍，0.001至小于0.05重量％的硅，0.001至0.2重量％的磷，余量为锡。无铅焊料组合物还包含0.001至小于0.01重量％的钴。作为包含由无铅焊料合金附着的多个电子部件的电子设备，电子设备的特征在于，无铅焊料合金含有0.1〜2重量％的铜，0.001〜1.0重量％的镍，0.001至小于0.05重量％的硅，0.001至0.2重量％的磷，余量为锡。作为通过无铅焊料合金粘合的PCB（印刷电路板），PCB的特征在于，无铅焊料合金包含0.1〜2重量％的铜，0.001〜1.0重量％的镍，0.001〜1.0重量％小于0.05重量％的硅，0.001〜0.2重量％的磷，余量为锡。

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