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11. 发明公开

KR1020170030654A 디스미어 처리 방법 및 디스미어 처리 장치 审中-实审
公开(公告)号：KR1020170030654A
公开(公告)日：2017-03-17
申请号：KR1020177006533
申请日：2013-12-26
申请人： 우시오덴키 가부시키가이샤
发明人： 히로세겐이치 , 호리베히로키 , 하부도모유키 , 엔도신이치
IPC分类号： H05K3/26 , H05K3/00
CPC分类号： H05K3/0088 , H05K1/0373 , H05K3/227 , H05K3/26 , H05K2201/0209 , H05K2203/0285 , H05K2203/0292 , H05K2203/0743 , H05K2203/075 , H05K2203/0766 , H05K2203/081 , H05K2203/087 , H05K2203/1509
摘要： 무기물질및 유기물질의어느것에기인하는스미어라도확실하게제거할수 있고, 폐액처리가필요한약품을이용하는것이불필요한디스미어처리방법및 디스미어처리장치를제공한다. 본발명의디스미어처리방법은, 필러가함유된수지로이루어지는절연층과도전층이적층되어이루어지는배선기판재료의디스미어처리방법에있어서, 상기배선기판재료에대하여, 파장 220nm 이하의자외선을조사하는자외선조사처리공정과, 이자외선조사처리공정을경유한배선기판재료에물리적진동을부여하는물리적진동처리공정을가지는것을특징으로한다.

12. 发明公开

KR1020100009957A 연성 기판의 전극 형성 방법 및 이를 이용한 반도체 칩본딩 방법 无效
标题翻译：用于在柔性板上形成电极的方法和使用其粘合半导体芯片的方法
公开(公告)号：KR1020100009957A
公开(公告)日：2010-01-29
申请号：KR1020080070801
申请日：2008-07-21
申请人： 한화테크윈 주식회사
发明人： 조주현
IPC分类号： H05K3/40
CPC分类号： H05K3/0088 , H05K1/0393 , H05K3/0064 , H05K3/4038
摘要： PURPOSE: A method for forming an electrode on a flexible board and a method for bonding a semiconductor chip using the same are provided to form a flexible substrate by attaching a polymer substrate to the flexible substrate. CONSTITUTION: An electrode pattern(311) is formed inside a high molecule material consisting of a polymer(121). The high molecule material is adhered in a flexible substrate(101) using an adhesive(411). The membranous polymers material is removed by organic solvent. The first high molecule material board and a second high molecule material board are prepared. A plurality of vertical holes corresponding to the electrode pattern is formed in the first high molecule material board. A plurality of horizontal grooves corresponding to the electrode pattern is formed in the first high molecule material board. A second high molecule material board is adhered on the first high molecule material board.
摘要翻译：目的：提供一种用于在柔性基板上形成电极的方法以及使用该方法接合半导体芯片的方法，以通过将聚合物基板附接到柔性基板来形成柔性基板。构成：在由聚合物（121）构成的高分子材料内形成电极图案（311）。使用粘合剂（411）将高分子材料粘附在柔性基板（101）中。膜聚合物材料通过有机溶剂除去。制备第一高分子材料板和第二高分子材料板。在第一高分子材料板中形成与电极图案对应的多个垂直孔。在第一高分子材料板中形成与电极图案对应的多个水平槽。第二高分子材料板粘附在第一高分子材料板上。

13. 发明授权

KR100660086B1 전해 도금을 위한 장치 및 방법 失效
标题翻译：电解镀层的装置和方法
公开(公告)号：KR100660086B1
公开(公告)日：2006-12-20
申请号：KR1020047005787
申请日：2002-10-21
申请人： 비아시스템즈 그룹, 인코포레이티드
发明人： 켐펜하인반
IPC分类号： C25D17/00
CPC分类号： H05K3/0088 , C25D5/02 , C25D5/024 , C25D5/08 , C25D5/20 , C25D7/123 , C25D17/001 , H05K3/423
摘要： The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a laminar flow of electrolyte on each side of the printed circuit boards. A preferred means to alternately generate a laminar flow of electolyte comprises a floating shield with a venturi-shaped partition and an aligned partition below the printed circuit boards, and operating a plurality of eductors below the floating shield. The means to alternately generate a laminar flow of electolyte can further comprise a transport mechanism that moves the floating shield and its partitions from side to side relative to the eductors or a mechanism to move the eductors. The plating can be also be improved by using a vibrator and a spring-mounting system that prevents vibration energy being absorbed by fixed portions of the plating system.

14. 发明授权

KR1019940009176B1 다층회로부재 및 그 제조방법 失效
标题翻译：多层电路成员及其制造方法
公开(公告)号：KR1019940009176B1
公开(公告)日：1994-10-01
申请号：KR1019910012011
申请日：1991-07-15
申请人： 파나소닉 주식회사
发明人： 니시하라무네카즈 , 후쿠시마테쯔오 , 스에쯔구켕이찌로 , 이케다쥰지
IPC分类号： H05K3/46
CPC分类号： B29C45/16 , B29C45/14467 , B29C45/14639 , B29K2105/0097 , H05K1/0393 , H05K1/095 , H05K3/0047 , H05K3/005 , H05K3/0088 , H05K3/1241 , H05K3/284 , H05K3/4069 , H05K3/4611 , H05K3/4635 , H05K3/4664 , H05K2201/09118 , H05K2203/0126 , H05K2203/0195 , H05K2203/0278 , H05K2203/068 , H05K2203/0763 , H05K2203/1327 , H05K2203/1453
摘要： 내용 없음.

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