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    • 8. 发明专利
    • Fluid-based switch and method for manufacturing and sealing fluid-based switch
    • 基于流体的开关和用于制造和密封基于流体的开关的方法
    • JP2005158717A
    • 2005-06-16
    • JP2004313332
    • 2004-10-28
    • Agilent Technol Incアジレント・テクノロジーズ・インクAgilent Technologies, Inc.
    • WONG MARVIN GLENN
    • H01H11/02H01H1/00H01H1/08H01H29/00H01H29/04H01H29/30
    • H01H1/0036H01H2029/008
    • PROBLEM TO BE SOLVED: To provide a fluid-based switch which reduces or eliminates the risk of the chemical contamination of the interior of the switch, and further favorably withstands variations in assembling conditions and heat.
      SOLUTION: The fluid-based switch and a method for manufacturing the same are disclosed. In one embodiment, a method for manufacturing a switch comprises steps for: (605) depositing a first alignment pad on a first substrate; (610) depositing a second alignment pad on a second substrate with a perimeter relief surrounding the second alignment pad; (615) depositing solder on at least one of the alignment pads; (620) depositing a switching fluid on the first substrate; and (625) mating the first substrate to the second substrate by aligning the alignment pads and heating the solder. The substrates (100, 300) define a cavity holding the switching fluid therebetween, the cavity sized to allow the movement of the switching fluid between first and second states to form a liquid switch.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种流体开关,其减少或消除了开关内部的化学污染的风险,并且进一步有利地承受组装条件和热量的变化。 解决方案:公开了基于流体的开关及其制造方法。 在一个实施例中,用于制造开关的方法包括以下步骤:(605)在第一基板上沉积第一对准焊盘; (610)将第二对准焊盘沉积在具有包围所述第二对准焊盘的周边浮雕的第二衬底上; (615)在至少一个所述对准焊盘上沉积焊料; (620)在所述第一基板上沉积开关流体; 和(625)通过对齐对准焊盘并加热焊料将第一衬底与第二衬底相配合。 衬底(100,300)限定在其间保持开关流体的空腔,空腔的尺寸设定成允许开关流体在第一和第二状态之间移动以形成液体开关。 版权所有(C)2005,JPO&NCIPI