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    • 7. 发明专利
    • Semiconductor laser apparatus and method for manufacturing same
    • 半导体激光装置及其制造方法
    • JP2009076665A
    • 2009-04-09
    • JP2007244068
    • 2007-09-20
    • Panasonic Corpパナソニック株式会社
    • KAJIMA TAKAYUKIMAKITA KOJIYOSHIKAWA KENJI
    • H01S5/16H01S5/026H01S5/40
    • H01S5/4031B82Y20/00H01S5/162H01S5/22H01S5/34313H01S5/34326H01S5/4087H01S2301/173
    • PROBLEM TO BE SOLVED: To realize a high-output, low-cost, monolithic laser apparatus of two or more laser wavelengths. SOLUTION: This semiconductor laser apparatus has a first semiconductor laser element 12 and a second semiconductor laser element 13. The first semiconductor laser element 12 has a first end surface window structure 41, which has a region containing a first dopant formed near the end surface. The second semiconductor laser element has a second end surface window structure 42, which has a region containing a second dopant formed near the end surface. A distance from the lower end of a first active layer 23 to the lower end of the end surface window structure 41 is shorter than that from the lower end of a second active layer 33 to the lower end of the second end surface window structure 42. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:实现两个或更多个激光波长的高输出,低成本的单片激光装置。 解决方案:该半导体激光装置具有第一半导体激光元件12和第二半导体激光元件13.第一半导体激光元件12具有第一端面窗结构41,该第一端面结构41具有包含形成在第 端面。 第二半导体激光元件具有第二端面窗结构42,第二端面窗结构42具有包含在端表面附近形成的第二掺杂物的区域。 从第一有源层23的下端到端面窗结构41的下端的距离比从第二有源层33的下端到第二端面窗结构体42的下端的距离短。 版权所有(C)2009,JPO&INPIT
    • 8. 发明专利
    • Manufacturing method of semiconductor light element
    • 半导体光元件的制造方法
    • JP2008235790A
    • 2008-10-02
    • JP2007076871
    • 2007-03-23
    • Mitsubishi Electric Corp三菱電機株式会社
    • ABE SHINJI
    • H01S5/16B82Y20/00H01S5/343
    • H01S5/22B82Y20/00H01S5/0202H01S5/028H01S5/162H01S5/2009H01S5/2214H01S5/34333
    • PROBLEM TO BE SOLVED: To manufacture an LD having high COD resistance by using simple processes, in the LD having a GaN-based material.
      SOLUTION: This manufacturing method comprises a step of forming a semiconductor laminated structure 55 by successively laminating on a GaN substrate 12 a buffer layer 14, a first n-clad layer 16, a second n-clad layer 18, a third n-clad layer 20, an n-side optical guide layer 22, an active layer 26 of a quantum well structure, a p-side SCH layer 28, an electron barrier layer 30, a p-side optical guide layer 32, a p-clad layer 34 and a contact layer 36 which are formed of the GaN-based materials; a step of forming the cleavage of a semiconductor wafer including the semiconductor laminating structure 55 for exposing the cleavage end face 58 of the semiconductor laminating structure 55; and a step of forming an SiO
      2 film 60 on the exposed cleavage end face for disordering the active layer 26 by the Ga void diffusion based on predetermined heat treatment.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:在具有GaN基材料的LD中,通过简单的工艺制造具有高COD电阻的LD。 解决方案:该制造方法包括通过在GaN衬底12上依次层叠缓冲层14,第一n覆层16,第二n覆层18,第三n 包层20,n侧光导层22,量子阱结构的有源层26,p侧SCH层28,电子势垒层30,p侧导光层32, 包覆层34和由GaN基材料形成的接触层36; 形成半导体晶片的切割的步骤,该半导体晶片包括用于暴露半导体层叠结构55的解理端面58的半导体层叠结构55; 以及通过基于预定的热处理的Ga空穴扩散,在暴露的解理端面上形成SiO 2 SBB薄膜60的步骤,使有源层26无序扩散。 版权所有(C)2009,JPO&INPIT
    • 9. 发明专利
    • Two-wavelength semiconductor laser device
    • 双波长半导体激光器件
    • JP2008091713A
    • 2008-04-17
    • JP2006272125
    • 2006-10-03
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • TAKAYAMA TORUSATO TOMOYAKIDOGUCHI ISAO
    • H01S5/026B82Y20/00H01S5/343
    • H01S5/4031H01S5/162H01S5/2059H01S5/4087H01S2301/173
    • PROBLEM TO BE SOLVED: To suitably suppress the generation of a reactive current flowing through a window part owing to the enhancement of disordering for window region formation for both of two kinds of semiconductor lasers that are integrated.
      SOLUTION: First and second semiconductor lasers 10 and 20 comprising buffer layers 11 and 21, clad layers 12 and 22, quantum well active layers 13 and 23 and clad layers 14 and 24 laminated on a substrate 1 while having a stripe structure are integrated on the same substrate, and the quantum well active layer near a resonator end face is disordered by impurity diffusion. When defining the oscillation wavelengths of the active layers of the first and second semiconductor lasers respectively as λ1 and λ2, the energies of the forbidden band width of the buffer layers of the first and second semiconductor lasers respectively as E1 and E2 while wavelengths equivalent to the energies of the forbidden band width of the buffer layers of the first and second semiconductor lasers respectively as λb1 and λb2, the relations of λ1>λb1, λ2>λb2, λ1>λ2 and E1≤E2 are satisfied.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了适当地抑制由于对于两个集成的两种半导体激光器的窗口区域形成的不均匀性的增加,流过窗口部分的无功电流的产生。 解决方案:包括缓冲层11和21,包覆层12和22,量子阱有源层13和23以及层叠在基板1上的包层14和24同时具有条纹结构的第一和第二半导体激光器10和20是 集成在相同的衬底上,并且在谐振器端面附近的量子阱有源层由于杂质扩散而紊乱。 当将第一和第二半导体激光器的有源层的振荡波长分别定义为λ1和λ2时,第一和第二半导体激光器的缓冲层的禁带宽度的能量分别为E1和E2,而波长相当于 第一和第二半导体激光器的缓冲层的禁带宽度的能量分别为λb1和λb2,满足λ1>λb1,λ2>λb2,λ1>λ2和E1≤E2的关系。 版权所有(C)2008,JPO&INPIT