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1. 发明专利

JP2014525683A Bonding method of the semiconductor light emitting element of the substrate 审中-公开
公开(公告)号：JP2014525683A
公开(公告)日：2014-09-29
申请号：JP2014527757
申请日：2012-07-30
申请人：コーニンクレッカフィリップスエヌヴェ
发明人：ベイスン，グリゴリィ , エドワードエプラー，ジョン , スコットマーティン，ポール
IPC分类号： H01L33/02
CPC分类号： H01L33/48 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L33/005 , H01L33/0079 , H01L33/0095 , H01L33/22 , H01L33/50 , H01L33/501 , H01L33/505 , H01L33/507 , H01L2224/0345 , H01L2224/0346 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05644 , H01L2224/05647 , H01L2224/27436 , H01L2224/29191 , H01L2224/32225 , H01L2224/83005 , H01L2224/8309 , H01L2224/83097 , H01L2224/83191 , H01L2224/83209 , H01L2224/94 , H01L2924/12041 , H01L2924/12042 , H01L2924/15788 , H01L2933/0091 , H01L2924/00014 , H01L2224/27 , H01L2224/83 , H01L2924/01074 , H01L2924/00
摘要：発明の実施形態に係る方法は、ｎ型領域とｐ型領域との間に挟まれた発光層を含む半導体構造体を含む半導体発光素子を複数含むウエハ上にフレキシブルフィルムを配置する工程を含む。前記複数の半導体発光素子を含む前記ウエハは、前記フレキシブルフィルムを介して基板に接合される。接合後、前記フレキシブルフィルムは、前記半導体構造体に直接接触させられる。当該方法は、前記ウエハを前記基板に接合した後、前記ウエハを分割する工程を更に有する。

2. 发明专利

JP5189194B2 Vacuum heat-bonding equipment and vacuum heating bonding method 有权
公开(公告)号：JP5189194B2
公开(公告)日：2013-04-24
申请号：JP2011192995
申请日：2011-09-05
申请人：ミカドテクノス株式会社
发明人：隆志伊藤 , 豊樹佐藤
IPC分类号： B30B15/34 , B29C51/10 , B29C51/12 , B30B12/00
CPC分类号： H05K3/305 , B30B5/02 , B30B11/027 , B30B15/34 , B32B37/1009 , B32B37/1284 , B32B2457/12 , B32B2457/14 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/75102 , H01L2224/75315 , H01L2224/75316 , H01L2224/75317 , H01L2224/83001 , H01L2224/8309 , H01L2224/83191 , H01L2224/83203 , H01L2224/83209 , H01L2924/07802 , Y02P70/613 , Y10T29/53174 , Y10T29/53191 , H01L2924/00014 , H01L2924/00
摘要： A vacuum thermally bonding apparatus is provided, in which while air is being prevented in vacuum from entering a bonding layer, an element is thermally bonded to a substrate under vacuum by forming the bonding layer. A lower end portion of an upper frame member is gas-tightly slidably sealed to a peripheral portion of the lower plate member to form a vacuum partition wall therein, and a pressurizing release film is contacted with an upper face of the element, and thermally softened in the atmospheric pressure. A vacuum chamber is evacuated to vacuum, and the lower plate member and an intermediate member are relatively moved in an approaching direction, so that an outer peripheral portion of the pressurizing release film is gas-tightly held between the upper face of the substrate-placing table of the lower plate member and a lower face of an inner frame body.

3. 发明专利

JP4916494B2 Crimping machines, crimping method, and the pressing plate 有权
公开(公告)号：JP4916494B2
公开(公告)日：2012-04-11
申请号：JP2008242946
申请日：2008-09-22
申请人：ソニーケミカル&インフォメーションデバイス株式会社
发明人：和隆古田
IPC分类号： H05K3/32 , H01L21/60 , H01L25/04 , H01L25/18
CPC分类号： H05K3/303 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2224/2919 , H01L2224/32225 , H01L2224/75251 , H01L2224/75314 , H01L2224/75315 , H01L2224/75986 , H01L2224/83209 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15788 , H01L2924/19043 , H05K3/323 , H05K2203/074 , H05K2203/1572 , Y02P70/613 , Y10T29/4913 , Y10T29/53174 , H01L2924/00 , H01L2924/00014
摘要： Even pressure is applied to a mounting target, even in a case where electronic components having different heights from each other are attempted to be mounted to a substrate, or in a case where an electronic component is attempted to be mounted to a substrate whose rear surface is provided with another electronic component. A mounting device 100 includes a lower pressurizing section 102 as a first pressurizing section and an upper pressurizing section 104 as a second pressurizing section, and pressurizes a substrate, a plurality of electronic components, and the like, sandwiched between the lower pressurizing section 102 and the upper pressurizing section 104, thereby mounting the substrate to the plurality of electronic components. The lower pressurizing section 102 or the upper pressurizing section 104 includes a dilatancy fluid 116.

4. 发明专利

JP4574631B2 Multi-chip implementation method 有权
公开(公告)号：JP4574631B2
公开(公告)日：2010-11-04
申请号：JP2007012617
申请日：2007-01-23
申请人：日立化成工業株式会社
发明人：功塚越 , 遵一小出 , 宏治小林 , 和也松田 , 直樹福嶋
IPC分类号： H01L21/60 , H01L23/52 , H01L25/00
CPC分类号： H01L24/27 , H01L24/83 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209

5. 发明专利

JP2007158367A Method of mounting multi chips, chip string with adhesives, and method of manufacturing chip with adhesives 有权
标题翻译：安装多芯片的方法，带粘合剂的芯片，以及用粘合剂制造芯片的方法
公开(公告)号：JP2007158367A
公开(公告)日：2007-06-21
申请号：JP2007012617
申请日：2007-01-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , KOBAYASHI KOJI , MATSUDA KAZUYA , FUKUSHIMA NAOKI , KOIDE NOBUKAZU
IPC分类号： H01L21/60 , H01L23/52 , H01L25/00
CPC分类号： H01L24/27 , H01L24/83 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting multi chips, which arranges chips having different sizes on a surface of an electrode of a substrate and being capable of manufacturing an efficient MCM (multi chip module), which can mount chips at a time, chip string with adhesives, and method of manufacturing a chip with adhesives. SOLUTION: A Method of mounting multi chips having different chip sizes is composed of process as follows; (1) a process, in which an adhesives layer composed of hardening material, which is formed on a separator and larger than the chip size, is made to contact with the surface of the electrode of the chip, being heated from the back of the chip at an active temperature of a curing agent or lower to form a cohesive force fall line of the adhesives layer along the chip size, and the adhesives layer having almost the same size with the chip is exfoliated from the separator to be transferred to the chip, and multiple chips with adhesives are obtained, (2) a process to make electrodes of multiple chips with adhesives to be connected and the electrode of a substrate face each other and perform alignment, and (3) a process, in which electrodes of multiple chips and electrode of the substrate that complete alignment of the electrodes are thermocompression-bonded between electrodes to be connected at the active temperature of the curing agent or higher and electrical connections of multiple chips on the same substrate are obtained. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种安装多芯片的方法，该芯片在基板的电极的表面上布置具有不同尺寸的芯片，并且能够制造高效的MCM（多芯片模块），其可以安装芯片同时，具有粘合剂的芯片串，以及用粘合剂制造芯片的方法。解决方案：安装具有不同芯片尺寸的多芯片的方法由以下过程组成：（1）一种方法，其中形成在隔膜上并且大于芯片尺寸的由硬化材料组成的粘合剂层与芯片的电极的表面接触，从该芯片的背面被加热芯片处于固化剂的活性温度或更低，以形成沿着芯片尺寸的粘合剂层的内聚力下降线，并且具有与芯片几乎相同尺寸的粘合剂层从分离器剥离以转移到芯片，并且获得具有粘合剂的多个芯片，（2）使用要连接的粘合剂制造多个芯片的电极并且基板的电极彼此面对并进行对准的工艺，以及（3）其中多个完成电极对准的基板的芯片和电极在固化剂的活性温度以上的电极之间热连接，在多个芯片的电连接得到相同的基材。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2017139481A 基板を半導体発光素子に接合する方法审中-公开
公开(公告)号：JP2017139481A
公开(公告)日：2017-08-10
申请号：JP2017064523
申请日：2017-03-29
申请人：コーニンクレッカフィリップスエヌヴェ , KONINKLIJKE PHILIPS N.V.
发明人：ベイスン,グリゴリィ , エプラー,ジョンエドワード , マーティン,ポールスコット
IPC分类号： H01L33/00
CPC分类号： H01L33/48 , H01L21/6836 , H01L24/83 , H01L24/94 , H01L33/005 , H01L33/0079 , H01L33/50 , H01L2224/0345 , H01L2224/0346 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05644 , H01L2224/05647 , H01L2224/27436 , H01L2224/29191 , H01L2224/32225 , H01L2224/83005 , H01L2224/8309 , H01L2224/83097 , H01L2224/83191 , H01L2224/83209 , H01L2224/94 , H01L24/29 , H01L24/32 , H01L2924/12041 , H01L2924/12042 , H01L2924/15788 , H01L2933/0091 , H01L33/0095 , H01L33/22 , H01L33/501 , H01L33/505 , H01L33/507
摘要：【課題】フレキシブルフィルムを介して基板に半導体発光素子を有するウエハを接合する方法を提供する。【解決手段】n型領域とp型領域との間に挟まれた発光層を含む半導体構造体13を含む半導体発光素子を複数含むウエハ上にフレキシブルフィルムを配置する工程を含む。フレキシブルフィルムは、シリコーンと混合された波長変換材料を有する。複数の半導体発光素子を含むウエハは、フレキシブルフィルムを介して基板50に接合される。接合後、フレキシブルフィルムは、半導体構造体及び基板に直接接触している。当該方法は、ウエハを基板に接合した後、ウエハを分割する工程を更に有する。【選択図】図4

9. 发明专利

JP2013052424A Vacuum thermal bonding device and vacuum thermal bonding method 有权
标题翻译：真空热连接装置和真空热连接方法
公开(公告)号：JP2013052424A
公开(公告)日：2013-03-21
申请号：JP2011192995
申请日：2011-09-05
申请人： Mikado Technos Kk , ミカドテクノス株式会社
发明人： ITO TAKASHI , SATO TOYOKI
IPC分类号： B30B15/34 , B29C51/10 , B29C51/12 , B30B12/00
CPC分类号： H05K3/305 , B30B5/02 , B30B11/027 , B30B15/34 , B32B37/1009 , B32B37/1284 , B32B2457/12 , B32B2457/14 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/75102 , H01L2224/75315 , H01L2224/75316 , H01L2224/75317 , H01L2224/83001 , H01L2224/8309 , H01L2224/83191 , H01L2224/83203 , H01L2224/83209 , H01L2924/07802 , Y02P70/613 , Y10T29/53174 , Y10T29/53191 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a vacuum thermal bonding device capable of adjusting minute pressing force while preventing an air from mixing into an adhesive layer under vacuum state and forming the adhesive layer with a suitable thickness by restraining an adhesive from sticking out under an adequately pressurized state and bonding an element with a board under a vacuum-heating state.SOLUTION: In the vacuum thermal bonding device, a vacuum partition is internally formed by airtightly slide-sealing a lower end of an upper frame member 12 to the circumference of a lower plate member 6 with a drive unit, a pressure peel-off film is softened by heating under atmospheric pressure while keeping touched with an upper face of an element, and an outer peripheral section of the pressure peel-off film is airtightly retained between the upper face of a board setting base of the lower plate member 6 and the lower face of an internal frame body 13 while a vacuum chamber is set to be internally vacuum and the lower plate member 6 and an intermediate member 10 are relatively moved in a direction wherein both members come close each other. Then, the pressure peel-off film is stuck to the outer surface of the board and the element in order to join the element with the board by applying the atmospheric pressure or pressure higher than the atmospheric pressure to an upper space of the pressure peel-off film in the vacuum chamber.
摘要翻译：解决方案：提供一种能够在真空状态下防止空气混入粘合剂层中的微小按压力的真空热粘合装置，并且通过限制粘合剂的粘附而形成具有合适厚度的粘合剂层在充分加压的状态下并且在真空加热状态下将元件与板接合。解决方案：在真空热粘合装置中，通过用驱动单元将上部框架构件12的下端气密密封地滑动到下部板构件6的周围，内部形成真空隔板，在保持与元件的上表面接触的同时通过在大气压下加热而使薄膜软化，并且压力剥离膜的外周部分气密地保持在下板构件6的板设置基座的上表面之间和内框架体13的下表面，同时真空室被设定为内部真空，并且下板构件6和中间构件10在两个构件彼此靠近的方向上相对移动。然后，通过将高于大气压的大气压或压力施加到压力剥离膜的上部空间，将压力剥离膜粘附到板和元件的外表面，以便将元件与板接合，在真空室中脱膜。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP4832107B2 How to Implement 有权
公开(公告)号：JP4832107B2
公开(公告)日：2011-12-07
申请号：JP2006046649
申请日：2006-02-23
申请人：ソニーケミカル&インフォメーションデバイス株式会社
发明人：孝 ▲松▼村
IPC分类号： H01L21/60 , H05K3/32
CPC分类号： H05K3/303 , B30B5/02 , B30B15/024 , B30B15/065 , H01L21/568 , H01L24/29 , H01L24/75 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/753 , H01L2224/75315 , H01L2224/75317 , H01L2224/75756 , H01L2224/7598 , H01L2224/75988 , H01L2224/81001 , H01L2224/81005 , H01L2224/83192 , H01L2224/83209 , H01L2224/838 , H01L2225/06517 , H01L2225/06572 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/19105 , H01L2924/19106 , H05K2201/0133 , H05K2203/0191 , H05K2203/0278 , H05K2203/1572 , Y02P70/613 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components 32, 33 on a front face and a rear face of the substrate 31 are simultaneously pressed with first and second pressing rubbers 15, 25, the electric components 32, 33 can be connected to the front face and the rear face of the substrate 31 at a time. Because the peripheries of the first and second pressing rubbers 15, 25 are surrounded by a dam member 16 when the first and second pressing rubbers deform, the first and second pressing rubbers 15, 25 are dammed by the dam member 16 and not spread. Thus, positional slip of the electric components 32, 33does not occur. Since the electric components 32, 33 are connected to the substrate 31 at the same positions as at the time of temporary compression bonding, an electric component 30a having high connection reliability is obtained.

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