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1. 发明专利

JP2012009884A Conductive body connecting method, conductive body connecting member, connecting structure, and solar cell module 有权
标题翻译：导电体连接方法，导电体连接构件，连接结构和太阳能电池模块
公开(公告)号：JP2012009884A
公开(公告)日：2012-01-12
申请号：JP2011180849
申请日：2011-08-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUKUSHIMA NAOKI , TSUKAGOSHI ISAO , SHIMIZU TAKEHIRO
IPC分类号： H01L31/042
CPC分类号： H01L31/186 , C09J5/06 , C09J7/22 , C09J7/35 , C09J9/02 , C09J2201/128 , C09J2201/602 , C09J2203/322 , C09J2400/163 , H01L31/0512 , Y02E10/50 , Y10T29/49194
摘要： PROBLEM TO BE SOLVED: To simplify a connecting step when electrically connecting conductive bodies which are separated from each other.SOLUTION: The method of electrically connecting a first conductive body and a second conductive body which are separated from each other, includes a step of heating and pressurizing a metallic foil 1, a first adhesive layer 2 provided on one surface of the metallic foil 1, and the first conductive body while arranging those in this order to electrically connect and bond the metallic foil 1 and the first conductive body; and heating and pressurizing the metallic foil 1, the first adhesive layer 2 or a second adhesive layer 3 provided on the other surface of the metallic foil 1, and the second conductive body while arranging those in this order to electrically connect and bond the metallic foil 1 and the second conductive body.
摘要翻译：要解决的问题：为了简化在彼此分离的导电体电连接时的连接步骤。解决方案：电连接彼此分离的第一导电体和第二导电体的方法包括对金属箔1进行加热和加压的步骤，设置在金属箔1的一个表面上的第一粘合剂层2 箔1和第一导电体，同时依次布置它们以电连接和接合金属箔1和第一导电体; 对设置在金属箔1的另一面上的金属箔1，第一粘合层2或第二粘合剂层3进行加热加压，同时对第二导电体进行按顺序配置，将金属箔 1和第二导电体。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2010007076A Anisotropically conductive adhesive film 审中-公开
标题翻译：各向异性粘合胶片
公开(公告)号：JP2010007076A
公开(公告)日：2010-01-14
申请号：JP2009185125
申请日：2009-08-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KANOTA HIDEJI , SHIROGANE JUNJI , TSUKAGOSHI ISAO , HIROZAWA YUKIHISA
IPC分类号： C09J7/00 , C09J9/02 , C09J11/00 , C09J163/00 , C09J171/10 , H01B1/00 , H01B5/16 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an anisotropically conductive adhesive film which suppresses streaming motion of conductive particles in connection, diminishes secondary aggregation of the conductive particles with a small additive particle amount, and can meet the demand for fine pitch, while retaining the conventional connection characteristic.
SOLUTION: The anisotropically conductive adhesive film is obtained as follows: conductive particles 1 are sprinkled, fixed and concentrated with a flow of air on a surface layer of a first insulating adhesive 2 formed on a peelable film base 3, the conductive particles 1 are uniformly arranged and allowed to exist within 8 μm from the surface of a second insulating adhesive 4 stuck on the first insulating adhesive 2, and the conductive particles 1 are embedded in the surface layer of the first insulating adhesive 2. The first insulating adhesive 2 and the second insulating adhesive 4 comprise a phenoxy resin, a microencapsulated latent curing agent and a liquid epoxy resin.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供抑制导电颗粒的流动运动的各向异性导电粘合剂膜，减少导电颗粒的二次聚集，添加剂添加量小，可以满足细间距的需要，同时保持传统的连接特性。解决方案：各向异性导电粘合膜如下获得：导电颗粒1在形成在可剥离膜基底3上的第一绝缘粘合剂2的表面层上以空气流喷洒，固定和浓缩，导电颗粒 1均匀地布置并允许存在于粘附在第一绝缘粘合剂2上的第二绝缘粘合剂4的表面8μm内，并且导电颗粒1嵌入在第一绝缘粘合剂2的表面层中。第一绝缘粘合剂 2，第二绝缘粘合剂4包含苯氧树脂，微囊化潜固化剂和液体环氧树脂。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009283962A Method of manufacturing chip with adhesive 审中-公开
标题翻译：用粘合剂制造芯片的方法
公开(公告)号：JP2009283962A
公开(公告)日：2009-12-03
申请号：JP2009170295
申请日：2009-07-21
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , KOBAYASHI KOJI , MATSUDA KAZUYA , FUKUSHIMA NAOKI , KOIDE NOBUKAZU
IPC分类号： H01L21/60 , H01L25/18 , H01L21/52 , H01L21/603 , H01L21/68 , H01L25/04 , H05K3/32
CPC分类号： H05K3/323 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/743 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K2201/10674 , H05K2201/10984 , H05K2203/0338 , Y10S428/914 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T156/1054 , Y10T156/1066 , Y10T156/108 , Y10T428/2486 , Y10T428/287 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a novel chip with an adhesive. SOLUTION: The method of manufacturing the chip with the adhesive includes: providing a surface plate 3, an adhesive layer 4 formed on a separator 5, having a larger size than a chip size, and made of a curable material, and a cushion layer 11 mounted between the surface plate 3 and separator 5; bringing the adhesive layer 4 into contact with an electrode surface of the chip; heating the chip from its back side below an active temperature of a curing agent to form a cohesive force decrease line on the adhesive layer 4 along the chip size; and peeling the adhesive layer 4 of nearly the same size with the chip off the separator 5 to transfer and stick the adhesive layer on the chip. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用粘合剂制造新型芯片的方法。解决方案：使用粘合剂制造芯片的方法包括：提供表面板3，形成在隔膜5上的具有比芯片尺寸大的粘合剂层4，并且由可固化材料制成，安装在表面板3和隔板5之间的缓冲层11; 使粘合剂层4与芯片的电极表面接触; 将芯片从其背面加热到低于固化剂的活性温度以在粘合剂层4上沿芯片尺寸形成内聚力减小线; 并且用离开分离器5的芯片将具有几乎相同尺寸的粘合剂层4剥离以将粘合剂层转移并粘附在芯片上。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009188414A Adhesive tape crimping method 审中-公开
标题翻译：胶带贴片方法
公开(公告)号：JP2009188414A
公开(公告)日：2009-08-20
申请号：JP2009081752
申请日：2009-03-30
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , TSUKAGOSHI ISAO , GOTO YASUSHI , FUKUSHIMA NAOKI , YUSA MASAMI , YANAGAWA TOSHIYUKI
IPC分类号： H05K3/32 , C09J7/02 , H01L21/60 , H05K3/34 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To solve a problem that the adhering area of a circuit board is increased with increasing the size of a panel screen, the quantity of an adhesive used each time is increased, the frequency of exchanging a reel with adhesive tape wound is increased and the production efficiency of electronic equipment is not increased due to time-consuming exchange of the reel.
SOLUTION: In an adhesive tape crimping method of applying the adhesive 11 to the entire of one surface of a base material 9 and crimping the adhesive to the circuit board 21 using the reeled-up adhesive tape 1, the width of the adhesive tape is more than the length of one side of the circuit board and part of the adhesive oriented in a cross direction of the adhesive tape is crossly heated and pressed to crimp the adhesive to the circuit board while decreasing the cohesion of the heated part of the adhesive.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了解决电路板的粘附面积随着面板屏幕的尺寸的增加而增加的问题，每次使用的粘合剂的量增加，用粘合剂更换卷轴的频率磁带缠绕增加，并且电子设备的生产效率由于卷轴的更换时间而不增加。解决方案：在将粘合剂11施加到基材9的整个表面并使用卷绕的胶带1将粘合剂压接到电路板21的胶带卷曲方法中，粘合剂的宽度胶带比电路板的一侧的长度大，并且粘合带的横向方向上取向的粘合剂的一部分被交叉加热并压紧以将粘合剂卷曲到电路板上，同时降低了加热部分的内聚力胶粘剂。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2008112733A Imparting method of repairability, and connecting member 有权
标题翻译：可修复性的改进方法和连接会员
公开(公告)号：JP2008112733A
公开(公告)日：2008-05-15
申请号：JP2007299894
申请日：2007-11-19
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , SHIOZAWA NAOYUKI , FUJINAWA MITSUGI , GOTO YASUSHI , OTA TOMOHISA , IKEZOE YOSHIYUKI
IPC分类号： H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide a high-resolution connecting member that is superior in long-term connection reliability, with flow-out of conductive particles from an electrode is less, and air bubbles are difficult to be contained in a connection part, and superior in workability and requiring no accurate positioning between the conductive particles and the electrode, and to provide a connecting structure of the electrode that uses the member. SOLUTION: This is the imparting method of repairability to the connecting member obtained, by which insulating adhesive layers 2, 3 of which the melt viscosity at the time of connection is at least lower than that of a conductive sheet 1 are formed on one surface or both surfaces of the conductive sheet 1, which is formed of a conductive material and a binder and has conductivity in the pressurizing direction. The method is made to have a difference in the resistance to heat in the conductive sheet 1 and the adhesive layers 2, 3. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种长期连接可靠性优异的高分辨率连接部件，导电性粒子从电极流出较少，气泡难以包含在连接中部分并且具有优异的可加工性，并且不需要导电颗粒和电极之间的精确定位，并且提供使用该构件的电极的连接结构。解决方案：这是对获得的连接构件的可修复性的赋予方法，其中连接时的熔体粘度至少低于导电片1的熔融粘度的绝缘粘合剂层2,3形成在导电片1的一个表面或两个表面，其由导电材料和粘合剂形成，并且在加压方向上具有导电性。该方法在导电片1和粘合剂层2,3中的耐热性方面具有差异。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2008112732A Connecting method of electrode 审中-公开
标题翻译：电极连接方法
公开(公告)号：JP2008112732A
公开(公告)日：2008-05-15
申请号：JP2007299891
申请日：2007-11-19
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , SHIOZAWA NAOYUKI , FUJINAWA MITSUGI , GOTO YASUSHI , OTA TOMOHISA , IKEZOE YOSHIYUKI
IPC分类号： H01R11/01 , C09J7/02 , C09J9/02 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a connecting member of high resolution in which an outflow of conductive particles from above an electrode is small, bubbles are difficult to be contained in a connecting part, and which has superior long-term connection reliability and superior workability, since accurate positioning is not necessary between the electrode and the conductive particles, and to provide a connecting structure of the electrode that uses the member. SOLUTION: In this connection method in which the connecting member is interposed between facing electrodes 12, 13 and the electrodes are mutually electrically connected by the application of heating pressurization, and on one face or both faces of a conductive sheet 1 that comprises a conductive material 6 and a binder 5, having conductivity in the pressurizing direction, the connecting member is comprises by forming an insulative adhesive layer 2, having at least lower melt viscosity than that of the sheet at the time of connecting, and the insulative adhesive layer 2 is made to protrude to the surroundings of the connecting part in the connection method. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种高分辨率的连接部件，其中导电颗粒从电极上方的流出量小，连接部分难以包含气泡，并且具有优异的长期连接可靠性并且由于在电极和导电颗粒之间不需要精确的定位，并且提供使用该构件的电极的连接结构，因此具有优异的可加工性。解决方案：在这种连接方法中，连接构件插入在相对电极12,13之间，并且电极通过加热加压相互电连接，并且在导电片1的一个面或两个面上包括导电材料6和粘合剂5，其在加压方向上具有导电性，连接构件包括通过形成绝缘粘合剂层2，其在连接时具有至少比片材低的熔体粘度，并且绝缘粘合剂在连接方法中，使层2突出到连接部的周围。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2008060090A Manufacturing method of connecting member, and connecting member 审中-公开
标题翻译：连接会员和连接会员的制造方法
公开(公告)号：JP2008060090A
公开(公告)日：2008-03-13
申请号：JP2007299896
申请日：2007-11-19
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , SHIOZAWA NAOYUKI , FUJINAWA MITSUGI , GOTO YASUSHI , OTA TOMOHISA , IKEZOE YOSHIYUKI
IPC分类号： H01R43/00 , H01R11/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a high resolution connecting member which is superior in connection reliability in a long period since there is less outflow of conductive particles from an electrode and it is hard to contain air bubbles in a connecting part, and which is superior in workability since accurate positioning of the conductive particles in relation to the electrode is unnecessary. SOLUTION: This is the manufacturing method of the connecting member wherein on one face or both faces of a conductive sheet, an adhesive layer having insulating property of which the melt viscosity at connecting is lower by at least 100 poise or more is laminated by lamination or coating. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种高分辨率连接构件的制造方法，其由于电极中的导电性粒子的流出少，并且难以在气泡中含有气泡，因此长时间的连接可靠性优异连接部分，并且由于导电颗粒相对于电极的精确定位是不必要的，其加工性优异。解决方案：这是连接构件的制造方法，其中在导电片的一个面或两个面上，具有绝缘性的粘合剂层，其连接处的熔体粘度降低至少100泊以上通过层压或涂层。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008060084A Connecting member, and connection structure and connecting method of electrode using the connecting member 有权
标题翻译：连接构件，连接构件和使用连接构件的电极的连接方法
公开(公告)号：JP2008060084A
公开(公告)日：2008-03-13
申请号：JP2007260094
申请日：2007-10-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01R11/01
摘要： PROBLEM TO BE SOLVED: To obtain a connecting member which is superior in long time connecting reliability, which requires no precise positioning of conductive particles in relation to an electrode, which is superior in workability and which has high resolution, and obtain a structure of connecting electrodes using this connecting member. SOLUTION: The structure of connecting the electrodes is a connection structure between electrode rows facing each other. Connection between the electrode rows is made via the connecting member, the connecting member is a multi-layer connecting member obtained by forming an insulating adhesive layer on at least one surface of an adhesive layer which is formed of a conductive material and a binder and which has conductivity in the pressurizing direction, and melt viscosity at connection of binder components is equal to or smaller than that of the insulating adhesive layer. By covering a part of wiring with an insulating layer, at least one of the electrode rows is an electrode row composed of a recessed electrode formed from the part of the wiring which is not covered with the insulating layer. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了获得长时间连接可靠性优异的连接构件，其不需要相对于电极的导电颗粒相对于电极的精确定位，其可加工性优异且分辨率高，并且获得使用该连接部件的连接电极的结构。解决方案：连接电极的结构是彼此面对的电极列之间的连接结构。电极列之间的连接通过连接构件制成，连接构件是通过在由导电材料和粘合剂形成的粘合剂层的至少一个表面上形成绝缘粘合剂层而获得的多层连接构件，在加压方向上具有导电性，粘合剂组分的连接时的熔融粘度等于或小于绝缘粘合剂层的熔融粘度。通过用绝缘层覆盖一部分布线，至少一个电极列是由未被绝缘层覆盖的布线部分形成的凹陷电极组成的电极列。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2008022037A Connection member, connection structure of electrode using the same, and connection method 有权
标题翻译：连接构件，使用其的电极的连接结构和连接方法
公开(公告)号：JP2008022037A
公开(公告)日：2008-01-31
申请号：JP2007260097
申请日：2007-10-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain a high-resolution connection member that has superior long connection reliability, dispenses with the precise alignment between a conductive particle and an electrode, and has excellent workability; and to obtain the connection structure of the electrode using the connection member.
SOLUTION: At least one of the electrode rows standing face to face projects in the connection structure between electrode rows. In this case, one electrode row is connected to the other via the connection member. The connection member is a multilayer connection member, where an insulating adhesive layer is formed on at least one side of an adhesive layer that is made of a conductive material and a binder, and has conductivity in the direction of pressurization. Melting viscosity is not more than that as compared with the insulating adhesive layer, when a binder component is connected. The conductive material is a conductive particle, or an insulating coating particle, where an insulating cover is formed on the surface of the conductive particle. In this case, the number of effective particles contributing to the connection of the electrode of 50 μmϕ is not less than 10, and the insulating adhesive layer covers the periphery of at least substrate side of a projected electrode.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题为了获得具有优异的长连接可靠性的高分辨率连接构件，省去了导电颗粒和电极之间的精确对准，并且具有优异的可加工性; 并且使用连接构件获得电极的连接结构。解决方案：电极列之间的连接结构中的面对面突出的电极列中的至少一个突出。在这种情况下，一个电极列经由连接构件而彼此连接。连接构件是多层连接构件，其中在由导电材料和粘合剂制成的粘合剂层的至少一侧上形成绝缘粘合剂层，并且在加压方向上具有导电性。当粘合剂组分连接时，熔融粘度不超过绝缘粘合剂层的粘度。导电材料是在导电颗粒的表面上形成绝缘盖的导电颗粒或绝缘涂层颗粒。在这种情况下，有助于连接50μm的电极的有效粒子的数量不小于10，并且绝缘粘合剂层覆盖突出电极的至少衬底侧的周边。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2007331949A Adhesive reel 审中-公开
标题翻译：胶粘剂
公开(公告)号：JP2007331949A
公开(公告)日：2007-12-27
申请号：JP2007213991
申请日：2007-08-20
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YANAGAWA TOSHIYUKI , YUSA MASAMI , ARIFUKU MASAHIRO , FUKUSHIMA NAOKI , GOTO YASUSHI , TSUKAGOSHI ISAO
IPC分类号： B65H21/00 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an adhesive reel which can be simply connected to a terminal portion of an adhesive tape of an adhesive reel finishing pay-out, and improve the productivity of electronic instrument.
SOLUTION: The adhesive reel comprises a winding core; the adhesive tape wound around the winding core, equipped with tape-shaped base material and adhesive applied on the base material, and electrically connects opposing circuit electrodes; and a lead tape 41 provided at a starting end portion 30 of the adhesive tape and having an adhesive surface for sticking and fixing the starting end portion 30 to the base material surface of the adhesive tape wound around a reel.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以简单地连接到粘合卷轴精加工支付的粘合带的端子部分并且提高电子仪器的生产率的粘性卷轴。解决方案：粘合剂卷轴包括卷芯; 所述胶带缠绕在所述卷芯上，配备有带状基材和施加在所述基材上的粘合剂，并且电连接相对的电路电极; 以及引线带41，其设置在粘合带的起始端部30处，并且具有用于将起始端部30粘附并固定到卷绕在卷轴上的粘合带的基材表面的粘合表面。版权所有（C）2008，JPO＆INPIT

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