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2. 发明专利

JP2014083611A Grindstone and grinding/polishing device using the same 有权
标题翻译：使用它的磨石和研磨/抛光装置
公开(公告)号：JP2014083611A
公开(公告)日：2014-05-12
申请号：JP2012232441
申请日：2012-10-20
申请人： Nanotemu:Kk , 株式会社ナノテム
发明人： TAKADA ATSUSHI , TAKATSU MASAKAZU , OHASHI KYOSUKE , HORIE KAZUYA , ISHIZAKI KOZO
IPC分类号： B24D7/06 , B24D7/14
CPC分类号： B24B37/12 , B24B7/228
摘要： PROBLEM TO BE SOLVED: To provide a grindstone and a grinding/polishing device using the same which enable three steps of rough processing, lapping and polishing to be performed in the same device while enabling both-side processing, prevent a processing speed from decreasing even when continuously used, and allow a step of dressing to be omitted.SOLUTION: A grindstone is provided for grinding/polishing a workpiece. The grindstone is made of abrasive grains and a binder, and includes: grindstone pillars 1 which consist of a large number of pillars having an axis in the depth direction of a grinding/polishing surface and being arranged mutually in parallel; a grindstone matrix 2 integrally formed with the grindstone pillars 1.
摘要翻译：要解决的问题：为了提供使用该磨石和磨削/研磨装置的磨石和研磨/抛光装置，其能够在同时进行两面加工的同时进行粗加工，研磨和抛光三个步骤，防止加工速度降低均匀当连续使用时，允许省略修整步骤。解决方案：提供用于研磨/抛光工件的磨石。磨石由磨料颗粒和粘合剂制成，包括：磨石柱1，其由在磨削/抛光表面的深度方向上具有轴线并且相互平行布置的大量支柱组成; 与磨石柱1一体形成的磨石基体2。

3. 发明专利

JP2014501455A Polishing platen which is pressure controlled 审中-公开
公开(公告)号：JP2014501455A
公开(公告)日：2014-01-20
申请号：JP2013547510
申请日：2011-12-12
申请人：アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人：ハンチーチェン，
IPC分类号： H01L21/304 , B24B37/20
CPC分类号： B24B37/005 , B24B37/105 , B24B37/12
摘要：研磨プロセスにおいて基板に印加される圧力または力を制御するための方法および装置が開示される。一実施形態においては、研磨システムが説明される。このシステムは、ベースの上に回転自在に配置されたプラテンであって、側壁部およびその上に配置された研磨パッドを有し、それにより内部体積を形成するプラテンと、研磨パッドの下側に隣接するプラテンの内部体積中に配置されたパッド圧力印加装置とを備えている。

4. 发明专利

JP4710774B2 Method of manufacturing a polishing surface plate 有权
公开(公告)号：JP4710774B2
公开(公告)日：2011-06-29
申请号：JP2006258237
申请日：2006-09-25
申请人：株式会社日立製作所
发明人：新治佐々木 , 拓千葉 , 啓人安井 , 旭東楊 , 宏稲葉
IPC分类号： B24D3/00
CPC分类号： B24D18/0054 , B24B37/12

5. 发明专利

JP2006181694A Attitude control device and precision machining device 有权
标题翻译：姿态控制装置和精密加工装置
公开(公告)号：JP2006181694A
公开(公告)日：2006-07-13
申请号：JP2004379810
申请日：2004-12-28
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： KAMIYA SUMIO , IWASE HISAO , NAGAIKE TETSUYA , EDA HIROSHI , SHU RITSUHA
IPC分类号： B23Q1/34 , B23Q5/22 , B23Q5/28 , B24B7/04 , B24B47/22
CPC分类号： B24B37/12 , B24B49/10
摘要： PROBLEM TO BE SOLVED: To provide an attitude control device capable of highly accurately controlling the attitude of a mounted object on the attitude control device according to a grinding stage, and a precision machining device.
SOLUTION: This attitude control device 1 is constituted of a first surface material 21 and a second surface material 22 in parallel to the first surface material 21 with an interval L. A spherical body 3 is interposed at an attitude in which a part of the spherical body 3 is stored in recessed parts 21a and 22a punched in both of the first surface material 21 and the second surface material 22. A first actuator 4a extending in a Z-axis direction orthogonal to a plane constituted of an X-axis and a Y-axis is interposed between the surface materials 21 and 22. The second surface material 22 is connected to second actuators 4b and 4a extending in a proper direction within the plane constituted of the X-axis and Y-axis. The second surface material 22 is constituted to be relatively movable in relation to the first surface material 21 at an attitude mounted with the mounted object. The spherical body 3 is adhered to the first surface material 21 and the second surface material 22 with elastically deformable adhesive 6.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够高精度地控制安装物体在姿态控制装置上的磨削台阶姿态的姿态控制装置和精密加工装置。解决方案：该姿态控制装置1由间隔L与第一表面材料21平行的第一表面材料21和第二表面材料22构成。球体3以部分在第一表面材料21和第二表面材料22两者中的凹部21a和22a中存储有球形体3的第一致动器4a。与Z轴方向正交的与X轴并且在表面材料21和22之间插入Y轴。第二表面材料22连接到在由X轴和Y轴构成的平面内沿适当方向延伸的第二致动器4b和4a。第二表面材料22被构造成相对于第一表面材料21以与被安装物体安装的姿态相对移动。球体3可弹性变形的粘合剂6粘附到第一表面材料21和第二表面材料22上。（C）2006，JPO＆NCIPI

6. 发明专利

JP5454180B2 Manufacturing method of a glass substrate for a magnetic recording medium and a magnetic recording medium for the glass substrate 有权
公开(公告)号：JP5454180B2
公开(公告)日：2014-03-26
申请号：JP2010021114
申请日：2010-02-02
申请人：旭硝子株式会社
发明人：丈彰小野 , 憲昭下平
IPC分类号： B24B7/17 , B24B7/24 , B24B37/12 , B24B53/02 , B24B53/095 , B24D3/00 , B24D3/06 , B24D3/28 , C03C19/00 , G11B5/73 , G11B5/82 , G11B5/84
CPC分类号： B24B1/00 , B24B7/17 , B24B7/24 , B24B37/12 , B24B53/02 , B24B53/095 , B24D3/00 , B24D3/06 , B24D3/28 , C03C19/00 , G11B5/73 , G11B5/82 , G11B5/84

7. 发明专利

JP5450613B2 Chemical mechanical polishing with a slurry delivery to multiple zones 有权
公开(公告)号：JP5450613B2
公开(公告)日：2014-03-26
申请号：JP2011514729
申请日：2009-06-15
申请人：ノベラス・システムズ・インコーポレーテッドNovellus Systems Incorporated
发明人：オムーア、ファーガル , シュルツ、スティーブ
IPC分类号： B24B37/00 , B24B37/20 , H01L21/304
CPC分类号： B24B37/12 , B24B57/02

8. 发明专利

JP2011018706A Heat dissipation instrument with polished heat receiving surface, and method and equipment for polishing the same 有权
标题翻译：具有抛光加热表面的散热器，以及用于抛光其的方法和设备
公开(公告)号：JP2011018706A
公开(公告)日：2011-01-27
申请号：JP2009161169
申请日：2009-07-07
申请人： ▲じつ▼新科技股▲ふん▼有限公司 , Cpumate Inc , Golden Sun News Techniques Co Ltd , 珍通能源技術股▲ふん▼有限公司
发明人： LIN KUO-LEN , LIN CHEN-HSIANG , LIU JUI HO , CHENG CHIH-HUNG , SHIU JIAN-TSAI
IPC分类号： B24B57/02 , H05K7/20 , B24B37/04 , B24B37/30 , B24B41/06 , F28D15/02 , H01L23/427
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat dissipation instrument with its heat receiving surface including a polished heat receiving surface capable of attaining better flatness and roughness, and a method and equipment for polishing the heat dissipation instrument.SOLUTION: In the heat dissipation instrument 30 including a polished heat receiving surface and a method of polishing the same, first a polishing machine 10 including a grinder 11 and a tool 20 are provided. The heat dissipation instrument 30 is set on the tool 20. A polishing member 132 is poured between the grinder 11 and the heat receiving surface 34 of the heat dissipation instrument 30. The heat dissipation instrument 30 is pressurized by the tool 20 to fix. Thus, the heat receiving surface 34 of the heat dissipation instrument 30 comes into flat and tight contact on the polishing member 132, further rotates the grinder 11, and polishes the heat receiving surface 34 at least once. Thus, good surface roughness and flatness of the heat receiving surface 34 can be attained, thereby improving adhesion in contact of the heat receiving surface 34 and a heat-generating component, and improving heat conduction efficiency between the heat dissipation instrument 30 and the heat-generating component.
摘要翻译：要解决的问题：提供一种散热器具，其受热面包括能够获得更好的平坦度和粗糙度的抛光的受热面，以及用于抛光散热器的方法和设备。解决方案：在散热仪器30 包括抛光的受热面及其研磨方法，首先设置包括研磨机11和工具20的研磨机10。散热器30设置在工具20上。抛光构件132被注入到研磨机11和散热器30的受热面34之间。散热器30被工具20加压以固定。因此，散热器30的受热面34在研磨部件132上平坦且紧密接触，进一步使研磨机11旋转，并且使受热面34至少抛光一次。因此，可以实现良好的受热面34的表面粗糙度和平坦度，从而提高受热面34与发热部件的接触的粘附性，提高散热器30与散热器30的热传导效率。生成组件。

9. 发明专利

JP2007227915A Surface polishing 有权
标题翻译：表面抛光
公开(公告)号：JP2007227915A
公开(公告)日：2007-09-06
申请号：JP2007035270
申请日：2007-02-15
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： BONNER BENJAMIN A , MCREYNOLDS PETER , GREGORY E MENK , PRABHU GOPALAKRISHNA B , ANAND N IYER , LEUNG GARLEN C , ZUNIGA STEVEN M , RONDUM ERIK S , AU HENRY H
IPC分类号： H01L21/304 , B24B37/20
CPC分类号： B24B21/06 , B24B21/04 , B24B21/12 , B24B37/12 , B24B37/205 , B24B37/26 , B24D11/001
摘要： PROBLEM TO BE SOLVED: To provide an efficient CMP step providing not only a fast polishing rate but also a finish processed flat substrate surface. SOLUTION: The polishing device comprises a rotational platen 30. In addition, it further comprises a sub pad on the platen for supporting a polishing sheet 34. A groove is formed in the sub pad. The polishing device further comprises a vacuum source. The vacuum source is connected with the groove of the sub pad. In addition, the vacuum source is constituted such that vacuum sufficient for drawing each portion of the polishing sheet into the groove of the sub pad is added such that a groove is produced in a polished surface. COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP3672362B2 Wafer polishing machine having a fluid bearing and drive device 失效
公开(公告)号：JP3672362B2
公开(公告)日：2005-07-20
申请号：JP26315395
申请日：1995-10-11
申请人：ラムリサーチコーポレイション
发明人：エドウィンウェルドンディヴィッド , エイナゴルスキーボーグスロウ , タリエーホメイヤン
IPC分类号： B24B21/00 , B24B21/06 , B24B37/12 , B24B37/20 , H01L21/304 , B24B37/00
CPC分类号： B24B37/20 , B24B21/06 , B24B37/12

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