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1. 发明专利

JP2007108925A Posture control system 审中-公开
标题翻译：姿势控制系统
公开(公告)号：JP2007108925A
公开(公告)日：2007-04-26
申请号：JP2005297611
申请日：2005-10-12
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： KAMIYA SUMIO , EDA HIROSHI , KIMURA TAKAYUKI
IPC分类号： G05D3/00 , B23Q5/28 , B24B41/04 , H01L41/09 , H01L41/12 , H01L41/187 , H01L41/20
摘要： PROBLEM TO BE SOLVED: To provide a posture control system for highly precisely controlling the posture of a heavy load on a posture controller according to each grinding working stage when working an article in which fine shape dimension precision or the flatness of a finish face is required such as a silicon wafer or a magnetic disk substrate.
SOLUTION: This posture control system is configured of at least a location control part 20; a current control part 30; a posture controller 50; an actuator 40; a sensor for measuring the displacement quantity of the posture controller; and an amplifier 60 for amplifying the output of the sensor. The output of the sensor is amplified by the amplifier, and feed back to the location control part so that a primary loop can be configured, and measured currents obtained by measuring currents to be output to the actuator by a current sensor are feed back to the proportionality control part of the current control part so that a secondary loop can be configured of the current control part, and the various gains of the primary loop are adjusted so as to be relatively larger than the gain of the secondary loop.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种姿势控制系统，用于当加工精细形状尺寸精度或精加工平整度的制品时，根据每个研磨工作台高度精确地控制姿势控制器上的重负荷姿势需要如硅晶片或磁盘基板的面。该姿势控制系统至少由位置控制部20构成，电流控制部30; 姿势控制器50; 致动器40; 用于测量姿势控制器的位移量的传感器; 以及用于放大传感器的输出的放大器60。传感器的输出由放大器放大，并反馈到位置控制部分，从而可以配置主回路，并且通过测量通过电流传感器输出到致动器的电流获得的测量电流被反馈到电流控制部分的比例控制部分，使得可以由电流控制部分构成二次回路，并且调整主回路的各种增益，使其相对大于次级回路的增益。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007038358A Apparatus and method for precision processing 有权
标题翻译：装置和精密加工方法
公开(公告)号：JP2007038358A
公开(公告)日：2007-02-15
申请号：JP2005226419
申请日：2005-08-04
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： KAMIYA SUMIO , IWASE HISAO , NAGAIKE TETSUYA , EDA HIROSHI , SHU RITSUHA
IPC分类号： B24B47/12 , B23Q15/00 , B23Q15/22 , B23Q17/20 , B24B7/04 , B24B41/047 , B24B47/14 , B24B49/02
CPC分类号： B24B37/005 , B24B41/061 , B24B49/04 , B24B49/12
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for precision processing capable of highly accurately controlling both thickness and flatness of a target to be ground by conducting feedback control when controlling a travel amount of a moving part constituting a precision processing apparatus and a posture of a posture controller throughout steps from rough grinding to fine precision grinding. SOLUTION: A second base 3 for supporting a rotator 6b for rotating a grinding stone b is equipped with a feed screw mechanism 4 and an actuator 5 so that grinding is carried out while a travel of the second base 3 is appropriately controlled during steps from rough grinding to ultraprecision grinding. The posture controller 7 is provided between a rotator 6a for rotating the target (a) to be ground and a first base 2. The precision processing apparatus measures the thickness and flatness of the target (a) by optical probes 91 and 92, sends the measurement results to a computer 94, and sends a feedback instruction to the posture controller 7 to eliminate deviation between a target value and the measured value for controlling the posture. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种精密加工的装置和方法，其能够通过在控制构成精密加工的移动部件的行进量时进行反馈控制来高精度地控制被研磨对象物的厚度和平坦度装置和姿势控制器的姿势，从粗磨到精密磨削。解决方案：用于支撑用于旋转研磨石b的旋转体6b的第二基座3装备有进给螺杆机构4和致动器5，使得在第二基座3的行进被适当地控制期间进行研磨从粗磨到超精密研磨。姿势控制器7设置在用于使待研磨的目标物（a）旋转的旋转体6a和第一基体2之间。精密加工装置通过光学探头91,92测量靶（a）的厚度和平坦度，将测量结果发送到计算机94，并且向姿势控制器7发送反馈指令，以消除目标值与用于控制姿势的测量值之间的偏差。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006181694A Attitude control device and precision machining device 有权
标题翻译：姿态控制装置和精密加工装置
公开(公告)号：JP2006181694A
公开(公告)日：2006-07-13
申请号：JP2004379810
申请日：2004-12-28
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： KAMIYA SUMIO , IWASE HISAO , NAGAIKE TETSUYA , EDA HIROSHI , SHU RITSUHA
IPC分类号： B23Q1/34 , B23Q5/22 , B23Q5/28 , B24B7/04 , B24B47/22
CPC分类号： B24B37/12 , B24B49/10
摘要： PROBLEM TO BE SOLVED: To provide an attitude control device capable of highly accurately controlling the attitude of a mounted object on the attitude control device according to a grinding stage, and a precision machining device.
SOLUTION: This attitude control device 1 is constituted of a first surface material 21 and a second surface material 22 in parallel to the first surface material 21 with an interval L. A spherical body 3 is interposed at an attitude in which a part of the spherical body 3 is stored in recessed parts 21a and 22a punched in both of the first surface material 21 and the second surface material 22. A first actuator 4a extending in a Z-axis direction orthogonal to a plane constituted of an X-axis and a Y-axis is interposed between the surface materials 21 and 22. The second surface material 22 is connected to second actuators 4b and 4a extending in a proper direction within the plane constituted of the X-axis and Y-axis. The second surface material 22 is constituted to be relatively movable in relation to the first surface material 21 at an attitude mounted with the mounted object. The spherical body 3 is adhered to the first surface material 21 and the second surface material 22 with elastically deformable adhesive 6.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够高精度地控制安装物体在姿态控制装置上的磨削台阶姿态的姿态控制装置和精密加工装置。解决方案：该姿态控制装置1由间隔L与第一表面材料21平行的第一表面材料21和第二表面材料22构成。球体3以部分在第一表面材料21和第二表面材料22两者中的凹部21a和22a中存储有球形体3的第一致动器4a。与Z轴方向正交的与X轴并且在表面材料21和22之间插入Y轴。第二表面材料22连接到在由X轴和Y轴构成的平面内沿适当方向延伸的第二致动器4b和4a。第二表面材料22被构造成相对于第一表面材料21以与被安装物体安装的姿态相对移动。球体3可弹性变形的粘合剂6粘附到第一表面材料21和第二表面材料22上。（C）2006，JPO＆NCIPI

4. 发明专利

JP2005136227A Workpiece surface working method 有权
标题翻译：工作表面工作方法
公开(公告)号：JP2005136227A
公开(公告)日：2005-05-26
申请号：JP2003371192
申请日：2003-10-30
申请人： Hiroshi Eda , Ritsuha Shu , Toyota Motor Corp , トヨタ自動車株式会社 , 立波周 , 弘江田
发明人： EDA HIROSHI , SHU RITSUHA , KAMIYA SUMIO
IPC分类号： B24B7/20 , B24B1/00 , B24D3/00 , B24D3/28 , B24D7/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a surface working method for achieving the distortionless working and non-defective working of wafers such as a silicon wafer, compound wafer or fragile material wafer to be used for electronic equipment relevant parts by fixed abrasive, and making thin those wafers.
SOLUTION: This method for carrying out the surface working of a workpiece is configured to attach cerium oxide abrasive particulate and a grinding stone constituted of salts and synthetic resin to a constant pressure or constant dimension system grinding machine, to bring it into contact with the surface of a plate-shaped workpiece, and to rotate at least either the grinding stone or the workpiece under dry type conditions using no water or other working solution. In this case, it is especially desired that the workpiece is a silicon wafer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种用于实现用于固定磨料的电子设备相关部件的硅晶片，复合晶片或脆性材料晶片等晶片的无失真加工和无缺陷加工的表面加工方法，并制造薄晶片。
解决方案：用于进行工件表面加工的这种方法被配置为将氧化铈磨料颗粒和由盐和合成树脂构成的研磨石附着到恒压或恒定系统的磨碎机上，使其接触与板状工件的表面一起，并且在干式条件下使用无水或其它工作溶液，至少在研磨石或工件上旋转。在这种情况下，特别希望工件是硅晶片。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2006281412A Precision working method 有权
标题翻译：精密工作方法
公开(公告)号：JP2006281412A
公开(公告)日：2006-10-19
申请号：JP2005107821
申请日：2005-04-04
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： KAMIYA SUMIO , IWASE HISAO , NAGAIKE TETSUYA , EDA HIROSHI , SHU RITSUHA
IPC分类号： B24B7/04 , B24B7/20
CPC分类号： B24B7/228 , B24B37/042 , B24B41/02
摘要： PROBLEM TO BE SOLVED: To provide a precision working method carrying out grinding work in high precision by changing over and controlling, for example, a device to rotate a grindstone by stepwise feeding control and stepwise pressure control in accordance with a grinding work step.
SOLUTION: This precision working method is constituted of: a first process to manufacture an intermediate grinding body by roughly grinding a grinding body (a) with a diamond grindstone (b); and a second process to manufacture a final grinding body by grinding the intermediate grinding body with a CMG grindstone. A rotating device 6b and a base 3 are fed and controlled by multiple step feeding different in feeding speed by control based on moving quantity in the first process, and the rotating device 6b and the base 3 are moved and controlled by specified pressure or by constant pressure of multiple steps different in pressure by the control based on the pressure in the second process.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过改变和控制例如通过逐步进给控制旋转磨石的装置和根据研磨工作的逐步压力控制来高精度地进行磨削加工的精密加工方法步。解决方案：该精密加工方法由以下部分构成：通过用金刚石磨石（b）粗磨研磨体（a）来制造中间研磨体的第一工艺; 以及通过用CMG磨石研磨中间研磨体来制造最终研磨体的第二工艺。通过基于第一工序中的移动量的控制，旋转装置6b和基座3由不同于进给速度的多个步进进给和控制，并且旋转装置6b和基座3由指定压力或常数进行移动和控制通过基于第二过程中的压力的控制，压力不同的多个压力的压力。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006181703A Precision machining device and method 有权
标题翻译：精密加工设备和方法
公开(公告)号：JP2006181703A
公开(公告)日：2006-07-13
申请号：JP2004380782
申请日：2004-12-28
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： KAMIYA SUMIO , IWASE HISAO , NAGAIKE TETSUYA , EDA HIROSHI , SHU RITSUHA
IPC分类号： B24B41/06 , B24B47/08
CPC分类号： B24B49/16 , B24B7/228 , B24B37/30
摘要： PROBLEM TO BE SOLVED: To provide precision machining device and method for performing accurate grinding by switching and controlling a device for rotating a grinding tool, for instance, by moving amount and stepwise constant pressure according to a grinding stage.
SOLUTION: A feed screw mechanism 4 constituted of at least a feed screw 41 and a nut 42 and an actuator 5 are mounted on a second base 3 for supporting the rotating device 6b for rotating the grinding tool b. At a rough grinding stage, moving adjustments of the rotating device 6b and the second base 3 are performed by moving the nut 42 by prescribed quantity. At an extra-precision grinding stage, moving adjustments of the rotating device 6b and the second base 3 are performed by performing a pressure control, while stepwisely using a plurality of pneumatic actuators 5a and 5b of different pressure performance. An attitude control device 7 is interposed between a rotating device 6a for rotating an object a to be ground and a first base 2.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供精密加工装置和方法，用于通过切换和控制用于使研磨工具旋转的装置，例如根据研磨阶段的移动量和逐步恒定的压力来进行精确的研磨。解决方案：由至少一个进给螺杆41和螺母42以及致动器5构成的进给螺杆机构4安装在第二基座3上，用于支撑用于旋转研磨工具b的旋转装置6b。在粗磨阶段，通过将螺母42移动规定量来进行旋转装置6b和第二基座3的移动调整。在超精密的研磨阶段，通过执行压力控制，同时逐步使用具有不同压力性能的多个气动致动器5a和5b来进行旋转装置6b和第二基座3的移动调节。姿态控制装置7插入在用于旋转被研磨对象物a的旋转装置6a和第一基座2之间。（C）版权所有（C）2006，JPO＆NCIPI

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