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1. 发明专利

JP2011108592A Substrate for superconductive compound, and its manufacturing method 有权
标题翻译：超导材料基材及其制造方法
公开(公告)号：JP2011108592A
公开(公告)日：2011-06-02
申请号：JP2009265285
申请日：2009-11-20
申请人： Sumitomo Electric Ind Ltd , Toyo Kohan Co Ltd , 住友電気工業株式会社 , 東洋鋼鈑株式会社
发明人： OKAYAMA HIRONAO , NANBU KOJI , KANEKO AKIRA , OTA HAJIME , OKI YASUTARO , YAMAGUCHI TAKASHI , HAYASHI KAZUHIKO , DAIMATSU KAZUYA
IPC分类号： H01B12/06 , C22C9/00 , C22F1/00 , C22F1/08 , H01B13/00
CPC分类号： C22C9/00 , B32B15/015 , C21D8/1255 , C22C19/03 , C22C38/007 , C22C38/40 , C22F1/08 , H01L39/2454 , Y10T428/12903 , Y10T428/12924 , Y10T428/12979
摘要： PROBLEM TO BE SOLVED: To provide a substrate for superconductive compound in which superior adhesion strength and high-orientation of copper can be achieved simultaneously, and its manufacturing method. SOLUTION: Adsorbed articles on a surface of a copper foil worked under a reduction ratio of 90% or more are removed by sputter-etching, and after a non-magnetic metal plate is worked by sputter-etching, the copper foil and the metal plate are pressurized by a rolling roll and joined. The joined laminate is heated so that the copper is crystallized and oriented, and at the same time, the copper is thermally diffused for 10 nm or more on the metal plate, and a protection layer is laminated on the copper surface of the laminate. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供可以同时实现铜的优异的粘合强度和高取向性的超导性化合物的基板及其制造方法。解决方案：通过溅射蚀刻除去在90％或更大的压下率下加工的铜箔表面上的吸附制品，并且在通过溅射蚀刻加工非磁性金属板之后，将铜箔和金属板被轧辊加压并接合。加热接合的层压体，使铜结晶取向，同时铜在金属板上热扩散10nm以上，在层叠体的铜表面上层叠保护层。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2005324467A Manufacturing method of low thermal expansion material layer and manufacturing method of part using low thermal expansion material layer 审中-公开
标题翻译：低热膨胀材料层的制造方法和低热膨胀材料层的制造方法
公开(公告)号：JP2005324467A
公开(公告)日：2005-11-24
申请号：JP2004145538
申请日：2004-05-14
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B32B37/00 , B32B7/02 , B32B31/00
摘要： PROBLEM TO BE SOLVED: To provide a low thermal expansion laminated material obtained by laminating a low thermal expansion material layer and a conductor layer, and a part constituted using it. SOLUTION: In the low thermal expansion laminated material 20 obtained by laminating the low thermal expansion material layer 23 and the conductor layer 24, the joining surface of at least one of the low thermal expansion material layer 23 and the conductor layer 24 of the low thermal expansion laminated material 20 is subjected to activation treatment to be brought into contact with and superposed on the joining surface of the other one of both layers to laminate and join both layers or the respective joining surfaces of both layers to be subjected to activation treatment and brought into contact with each other and superposed one upon another to laminate and join both layers to manufacture the low thermal expansion laminated material 20. The part adapted to the printed wiring use of an interposer or the like is manufactured using the low thermal expansion laminated material 20. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供通过层叠低热膨胀材料层和导体层获得的低热膨胀层压材料，以及使用它构成的部件。解决方案：在通过层叠低热膨胀材料层23和导体层24获得的低热膨胀层叠材料20中，低热膨胀材料层23和导体层24中的至少一个的接合表面使低热膨胀层压材料20进行活化处理以与两层中的另一层的接合面接触并重叠，以层压并连接两层或两层的相互接合表面以进行活化处理并彼此接触并且彼此重叠以层压并连接两层以制造低热膨胀层压材料20.适于内插器等的印刷线路使用的部件使用低热膨胀层压材料20.版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005028790A Heating element laminated material and part using it 有权
标题翻译：加热元件层压材料及其部件
公开(公告)号：JP2005028790A
公开(公告)日：2005-02-03
申请号：JP2003271704
申请日：2003-07-08
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： A61F7/08 , A61K9/70 , A61M1/36 , A61M37/00 , B23K20/14 , B23K20/24 , B23K103/22 , B32B15/01
摘要： PROBLEM TO BE SOLVED: To provide a heating element laminated material constituted by laminating at least one conductive sheet, which is excellent in heat conductivity and electric conductivity, and at least one heating sheet capable of generating required heat energy, and a part made of the laminated material and applicable to the percutaneous or submucous absorption of a medicine.
SOLUTION: At least a conductive layer 26 excellent in heat conductivity and electric conductivity and at least a heating sheet 28 capable of generating required heat energy are laminated and activation treatment is applied to the respective surfaces to be bonded, thereafter both of the surface activated sheets 26 and 28 are brought into contact with each other so that the activated surfaces of them are opposed to each other and superposed, laminated and bonded to manufacture the heating element laminated material 20 wherein a heating part capable of generating required heat energy can be formed in a pattern. The part adaptable to the percutaneous or mucous membrane absorption of the medicine is manufactured using it.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过层叠至少一种导热性和导电性优异的导电片和至少一个能产生所需热能的加热片构成的加热元件叠层材料，以及一部分由层压材料制成，适用于药物的经皮或粘膜下吸收。解决方案：至少导热性和导电性优异的导电层26和至少能产生所需热能的加热片28层压并且对待粘合的各个表面施加活化处理，之后，使表面活化片26,28彼此接触，使得它们的活化表面彼此相对并重叠，层压和结合，以制造加热元件层压材料20，其中能够产生所需热能的加热部件形成一个模式。适用于药物的经皮或粘膜吸收的部位是用它制造的。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2004322615A Smooth laminate manufacturing method and method for manufacturing component using it 审中-公开
公开(公告)号：JP2004322615A
公开(公告)日：2004-11-18
申请号：JP2003124393
申请日：2003-04-28
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B32B37/00 , B32B15/01 , C23C14/14 , H01L23/12 , B32B31/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a smooth laminate constituted so as to make it possible to form a resistor having a required resistance value to the inside of an etched wiring pattern, and a method for manufacturing a component using it. SOLUTION: In the method for manufacturing the smooth laminate which comprises laminating a resistance alloy layer on at least one side of a smooth electroconductive plate, the resistor having the required resistance value can be formed to the inside of the wiring pattern formed by etching by laminating the resistance alloy layer on the smooth electroconductive plate immediately after activation treatment is applied to the electroconductive plate. Further, the component for a high frequency use adapted to a printed circuit board, an IC package or the like is manufactured using the smooth laminate. COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JP2004174899A Method for manufacturing mixed layer laminate and method for manufacturing part using the laminate 审中-公开
公开(公告)号：JP2004174899A
公开(公告)日：2004-06-24
申请号：JP2002343659
申请日：2002-11-27
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B32B38/00 , B29C65/02 , B32B15/08 , H05K3/00 , B32B31/12
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a mixed layer laminate by laminating a mixed layer in which one or more kinds of materials having different properties are arranged on at least a bonding surface, a non-mixed layer having almost uniform properties with respect to the bonding surface and, if necessary, an intermediate layer which can be interposed between both layers, and a method for manufacturing a part using the mixed layer laminate. SOLUTION: The mixed layer laminate is manufactured by laminating the mixed layer 20 and the non-mixed layer 26, or using the intermediate layer 27 if necessarry to laminate the mixed layer 20, the intermediate layer 27 and the non-mixed layer 26. After at least one bonding surface of each of mixed layer laminates 22 and 23 is activated, the intermediate layer 27 is laminated on at least one activated surface if necessary to be brought into contact with the mixed layer 20 and the non-mixed layer 26 in opposed relationship so as to be sandwiched between both layers 20 and 26, and these layers are superposed one upon another and together laminated and bonded to manufacture each of the mixed layer laminates 22 and 23. Each of the mixed layer laminates 22 and 23 is used to manufacture the part for use in a wiring board or the like. COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2004106335A Conductive layer laminated material and part using the same 有权
公开(公告)号：JP2004106335A
公开(公告)日：2004-04-08
申请号：JP2002271550
申请日：2002-09-18
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： H05B33/02 , B32B15/08 , B32B15/09
摘要： PROBLEM TO BE SOLVED: To provide a conductive layer laminated material obtained by inserting a non-alloy conductive layer having conductivity and a conductive layer in the gap between a conductive plate excellent in conductivity and a polymer sheet becoming a substrate, and a part using the same.
SOLUTION: In each of the conductive layer laminated materials 20 and 21 obtained by inserting the non-alloy conductive layer 25 and the conductive layer 27 in the gap between the conductive plate 26 and the polymer plate 24, the conductive plate 26 and the polymer plate 24 are subjected to activation treatment on the bonding scheduled surface sides thereof. Thereafter, the conductive layer 27 is laminated to at least one of the conductive plate 26 and the polymer plate 24, and the conductive plate 26 and the polymer plate 24 are brought to a contact state so that the conductive layer 27 and the non-alloy conductive layer 25 become inside to be stacked, laminated and bonded to manufacture each of the conductive layer laminated materials 20 and 21. The part adapted to a display is manufactured using each of the conductive layer laminated materials 20 and 21.
COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2004090620A Manufacturing process for resistive layer joint and manufacturing process for component using the same 审中-公开
公开(公告)号：JP2004090620A
公开(公告)日：2004-03-25
申请号：JP2003174878
申请日：2003-06-19
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： H05K1/16 , B29C65/00 , B29L9/00 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To enable formation of a resistor which has a required resistance within an etch-formed circuit pattern.
SOLUTION: A resistive layer joint 22 is manufactured by laminating a plurality of polymer plates 24 as a base material, resistive layers 28 of a predetermined resistance and conductive plates 26 of an excellent conductivity. The resistive layer joint 22 is etch-worked to form the resistor of a required resistance within the circuit pattern so that it can be applied to a printed board, an IC package and the like.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2004071866A Method of manufacturing resistive layer laminated material and method of manufacturing component using resistive layer laminated material 审中-公开
公开(公告)号：JP2004071866A
公开(公告)日：2004-03-04
申请号：JP2002229865
申请日：2002-08-07
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B32B7/02 , B29C65/00 , B29L31/34 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a resistive layer laminated material which enables a resistor unit having a desired resistance value to be formed in a wiring pattern formed by etching, and to provide a method of manufacturing a component using the resistive layer laminated material.
SOLUTION: In the method of manufacturing the resistive layer laminated material 20 composed of a conductive plate 26, a polymer plate 24, and a non-alloy resistive layer 25 interposed between the plates 24 and 26, the surfaces to be joined of the conductive plate 26 and the polymer plate 24 are previously subjected to an activation treatment, and then a non-alloy resistive layer is laminated, at least, on either the conductive plate 26 or the polymer plate 24. Thereafter, the conductive plate 26 and the polymer plate 24 are made to join with each other so as to interpose the non-alloy resistive layer 25 between them, forming the resistive layer laminated material 20 which enables a resistor unit having a desired resistance value to be formed in the wiring pattern. A component usable for a printed circuit board, an IC package or the like is manufactured by the use of the resistive layer laminated material 20.
COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2004034623A Manufacturing method for metal sheet laminate, manufacturing method for laminated molded body using metal sheet laminate, and manufacturing method for part using laminated molded object 审中-公开
公开(公告)号：JP2004034623A
公开(公告)日：2004-02-05
申请号：JP2002197900
申请日：2002-07-05
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B23K20/00 , B23K20/04 , B23K20/24 , B32B15/01 , B32B37/00 , C23F4/00 , B32B31/22
摘要： PROBLEM TO BE SOLVED: To perform lamination without exerting adverse effect on the bonded part of a metal sheet laminate and to enhance processability at the time of processing into a required shape. SOLUTION: A plurality of compounded metal sheets 26 and 28 capable of forming an intermetallic compound are laminated and, after the surfaces of the respective metal plates to be bonded are subjected to activation treatment, the metal plates are superposed one upon another in a contact state so that the activated treated surfaces are mutually opposed and lamination bonding is applied to both metal plates to manufacture a metal sheet laminate 20. Next, molding processing is applied to the metal sheet laminate to manufacture a laminated molded object 30 and this molded object is heat-treated to form the intermetallic compound in the vicinity of the bonded surface and, if necessary, the intermetallic compound is formed over the whole to produce a part 34. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2014168814A Manufacturing method of metal lamination substrate for semiconductor device formation and metal lamination substrate for semiconductor device formation 有权
标题翻译：用于半导体器件形成的金属层压衬底和用于半导体器件形成的金属层压衬底的制造方法
公开(公告)号：JP2014168814A
公开(公告)日：2014-09-18
申请号：JP2014058355
申请日：2014-03-20
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： OKAYAMA HIRONAO , KANEKO AKIRA , NANBU KOJI
IPC分类号： B23K20/04 , B21B1/40 , C22C9/00 , C22C9/02 , C22C9/04 , C22F1/00 , C22F1/08 , H01B13/00 , H01L21/20
CPC分类号： C22F1/08 , B32B15/01 , B32B15/015 , C22C9/00 , C22C38/02 , C22C38/44 , C22C38/58 , C30B25/18 , C30B29/06 , C30B29/16 , C30B29/40 , C30B29/52 , C30B33/00 , H01L23/142 , H01L31/03921 , H01L33/007 , H01L2924/0002 , H05K1/0393 , H05K1/09 , H05K3/022 , H05K2201/0355 , H05K2203/1105 , Y02E10/50 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a metal lamination substrate for epitaxial growth film formation for forming a semiconductor device which has high biaxial crystal orientation on a surface of a metal substrate.SOLUTION: A manufacturing method of a metal lamination substrate for semiconductor device formation includes the steps of: activating at least one side surface of a metal plate T1 by sputter etching etc.; activating at least one side surface of a metal foil T2 constituted of Cu or Cu alloy that is cold-rolled with the draft of 90% or more; laminating the activated surface of the metal plate and the activated surface of the metal foil while facing to each other and cold-rolling with the draft of 10% or less, for example; and applying heat treatment to the metal foil at 150°C or higher and 1000°C or lower, to form biaxial crystal orientation.
摘要翻译：要解决的问题：提供一种用于外延生长膜形成的金属层压基板，用于形成在金属基板的表面上具有高双轴晶体取向的半导体器件。解决方案：用于半导体器件形成的金属层叠基板的制造方法包括步骤：通过溅射蚀刻来激活金属板T1的至少一个侧表面; 激活由90％以上的牵伸而冷轧的Cu或Cu合金构成的金属箔T2的至少一个侧面; 将金属板的活化表面和金属箔的活化表面彼此面对并且以例如10％以下的牵伸方式进行冷轧; 并在150℃以上且1000℃以下对金属箔进行热处理，形成双轴结晶取向。

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