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1. 发明专利

JPS59173161A Device for producing flat mask 失效
标题翻译：用于生产扁平面膜的装置
公开(公告)号：JPS59173161A
公开(公告)日：1984-10-01
申请号：JP4854283
申请日：1983-03-23
申请人： Toppan Printing Co Ltd , Toshiba Corp
发明人： HIRAYAMA KAZUNARI , OKUMURA KADODE , SAIGOU MASAKATSU , YAMAMOTO TATSUHIKO , FUJII YOSHIHIRO
IPC分类号： B05B13/02 , B65G15/12 , H01J9/02 , H01J9/14 , H01J29/07
摘要： PURPOSE: To prevent surely spread of a coating liquid to the bottom surface side of a belt-like body by positioning conveying belts on both sides so as to meet the width of the belt-like body and matching both side edges of the belt-like body and the outside edges of the conveying belts.
CONSTITUTION: Conveying belts 25 for a belt-like body 1 are dividedly formed on both sides, and the belts 25 on both sides are provided freely adjustably in the transverse position. The body 1 is conveyed while both side edges of the body 1 and the outside edges of the belts 25 are matched. Then the spread of a coating liquid to the bottom surface side of the belt-like body is prevented by the belts 25, and the working efficiency of the device is improved.
COPYRIGHT: (C)1984,JPO&Japio
摘要翻译：目的：通过将输送带定位在两侧以防止带状体的宽度和带状体的两侧边缘匹配，以防止将涂布液确实地传播到带状体的底面侧主体和输送带的外边缘。构成：用于带状体1的输送带25分成两侧形成，并且两侧的带25在横向位置可自由调节地设置。主体1被输送，同时主体1的两个侧边缘和皮带25的外边缘相匹配。然后，通过带25防止涂布液向带状体的底面侧的扩散，提高了装置的工作效率。

2. 发明专利

JPH08319584A PRODUCTION OF ETCHED PARTS 失效
公开(公告)号：JPH08319584A
公开(公告)日：1996-12-03
申请号：JP12495295
申请日：1995-05-24
申请人： TOPPAN PRINTING CO LTD
发明人： TANAKA SATOSHI , FUJII YOSHIHIRO , KIKUCHI HISAKAZU , UEDA RYUJI , KAKEHASHI TATSURO
IPC分类号： C23F1/00 , C23F1/16
摘要： PURPOSE: To smooth the etched surface and to improve productivity by forming a resist film on the surface of a metallic material, etching the exposed region selectively and conditioning the surface by second etching. CONSTITUTION: A resist film is formed on both sides of a metallic material 1. The material 1 is transported to a first etching chamber 3 and subjected to first etching, the region of the material 1 exposed from the resist film is removed, and the front and rear are communicated. A ferric chloride soln. is used as the liq. etchant. The material 1 subjected to the first etching is sent to a dipping tank 4, second etching is applied to plate the surface etched in the first etching, the ruggednesses on the etched surface are dissolved off, and the metal depositing on etched surface is also dissolved and removed. The etched surface is smoothed in this way. A high-temp. ferric chloride soln., for example, is used as the second etchant.

3. 发明专利

JPH08288423A FABRICATION OF SEMICONDUCTOR DEVICE SUBSTRATE 失效
公开(公告)号：JPH08288423A
公开(公告)日：1996-11-01
申请号：JP9492295
申请日：1995-04-20
申请人： TOPPAN PRINTING CO LTD
发明人： SUGIDACHI KAZUHIKO , IGARASHI TAKASHI , FUJII YOSHIHIRO
IPC分类号： H01L23/12 , H01L23/50
摘要： PURPOSE: To provide an easier method for fabricating a semiconductor device substrate which does not result in separation between a printed wiring board and the island of a lead frame and can provide a semiconductor device having higher reliability when applied to a semiconductor device. CONSTITUTION: In a method of fabricating a semiconductor device substrate comprising a first process to bond a printed wiring board 4 via a bonding material 1 on the island 2 of a lead frame consisting of a metal mainly formed of copper and a second process for electrically connecting the lead frame and the printing wiring board, the process for making rough at least the surface of island 2, using sodium peroxodisulfate is executed before the first process.

4. 发明专利

JPH04199650A CIRCUIT BOARD FOR MOUNTING SEMICONDUCTOR THEREON 失效
公开(公告)号：JPH04199650A
公开(公告)日：1992-07-20
申请号：JP33202890
申请日：1990-11-29
申请人： TOPPAN PRINTING CO LTD
发明人： FUJII YOSHIHIRO
IPC分类号： H01L21/60
摘要： PURPOSE:To contrive a reduction in the manufacturing processes of the title board and a reduction in the cost of the board by a method wherein a thin metal plate consisting of an alloy containing copper as its main ingredient is used as a support board, a bored part is provided at a prescribed position on the support board, an epoxy bonding agent is applied on the support board and a metal foil consisting of copper is laminated on the support board. CONSTITUTION:A circuit board is formed by a method wherein a conductor pattern 7 is formed on a metal foil 3, which is laminated on a support board 1 with an epoxy resin bonding agent and consists of copper, into the form of a pattern by etching and a perforated part 5 is provided at a prescribed position on the foil 3. At that time, the part 5 is formed into a through hole made smaller than a bored part 4 provided in the support board 1 consisting of a thin metal plate and is formed conforming to the part 4 in this board 1. By forming the part 5 in the foil 3 into the part 5 smaller than the part 4 in the board 1 as the result of the formation of the pattern 7, an overhang part 6 of the pattern 7 is formed. This overhang part 6 is so formed that the installation and connection of a semiconductor in the following process can be easily performed. Thereby, it is possible for this method to lead to a shortening in the manufacturing time of the board and a reduction in the cost of the board.

5. 发明专利

JPH0466679A ETCHING METHOD 失效
公开(公告)号：JPH0466679A
公开(公告)日：1992-03-03
申请号：JP17803790
申请日：1990-07-04
申请人： TOPPAN PRINTING CO LTD
发明人： FUJII YOSHIHIRO
IPC分类号： C23F1/02 , C23F1/08 , H01L21/306 , H05K3/06
摘要： PURPOSE:To allow the metal layer of a substrate itself to generate heat and to accelerate the dissolution of the metal layer partially coated with a resist layer in an etching soln. by spraying the etching soln. on the substrate generating an electric current in the metal layer. CONSTITUTION:When a substrate 3 is carried in the casing 2 of an etching apparatus 1, a pressurizing pump 16a is driven on the basis of a light shielding signal from a photodetector 12a and an etching soln. is sprayed from a nozzle 14. The power source of an eddy current generator 15a is simultaneously switched on by the signal and the coil is electrified. When the substrate 3 moves by the coil, an eddy current is generated in the metal layer of the substrate 3. By this eddy current, an induced current is generated in the metal layer of the moving substrate 3, the metal layer generates heat and the etching of the metal layer coming in contact with the etching soln. is accelerated.

6. 发明专利

JPS6247950B2 失效
公开(公告)号：JPS6247950B2
公开(公告)日：1987-10-12
申请号：JP19658784
申请日：1984-09-21
申请人： TOPPAN PRINTING CO LTD
发明人： FUJII YOSHIHIRO
IPC分类号： C23F1/00

7. 发明专利

JPS6176687A Etching method of metallic plate 失效
标题翻译：金属板蚀刻方法
公开(公告)号：JPS6176687A
公开(公告)日：1986-04-19
申请号：JP19658784
申请日：1984-09-21
申请人： Toppan Printing Co Ltd
发明人： FUJII YOSHIHIRO
IPC分类号： C23F1/00
摘要： PURPOSE: To execute automatically an exact perforating operation in the stage of perforating by etching of a metallic plate by discriminating exactly the degree of the perforating by utilizing the transmission quantity of a line of magnetic induction, electromagnetic wave or quantum ray and controlling etching conditions according to said quantity.
CONSTITUTION: A resist pattern 21 is coated on the top and bottom surfaces of a thin metallic plate 22 for a shadow mask and the metallic plate is passed through the inside of an enclosure 10 by a conveyor 11 in the stage of subjecting the shadow mask for a color cathode ray tube to corrosion perforating by etching. The line of magnetic induction, etc. passing the corroded parts are detected by the 1st signal transmitter 12a, signal receiver 12b and the 2nd signal transmitter 13a and signal receiver 13b while the parts having no resist pattern of the plate 22 are corroded by the etching soln. injected from shower pipes 5a, 5b during the passage. The detected values as well as the specific gravity, fatigue degree, temp., etc. of the etching soln. are inputted to an input-output device 15, then the degree of the etching is calculated by an arithmetic unit 16 and the speed of the conveyor 11 is adjusted by a control device 17 according to the calculated speed and the speed of the thin metallic plate is adjusted so that the correct etching is executed.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：通过利用磁感应线，电磁波或量子线的传输量来精确地识别穿孔的程度，通过蚀刻金属板来自动执行穿孔阶段的精确穿孔操作，并根据到数量。构成：将抗蚀剂图案21涂覆在用于荫罩的薄金属板22的顶表面和底表面上，并且金属板通过输送机11通过外壳10的内部，使得荫罩彩色阴极射线管，通过蚀刻腐蚀穿孔。通过第一信号发送器12a，信号接收器12b和第二信号发送器13a和信号接收器13b检测通过腐蚀部分的磁感应线等，而没有板22的抗蚀剂图案的部分被蚀刻腐蚀索恩在通道期间从淋浴管5a，5b喷射。检测值以及蚀刻溶胶的比重，疲劳度，温度等。输入到输入输出装置15，然后通过运算单元16计算蚀刻程度，根据计算出的薄金属板的速度和速度，通过控制装置17调节输送机11的速度被调整为执行正确的蚀刻。

8. 发明专利

JPH10227742A COPPER DENSITY ANALYZATION METHOD AND DEVICE FOR FERRIC CHLORIDE ETCHING LIQUID 失效
公开(公告)号：JPH10227742A
公开(公告)日：1998-08-25
申请号：JP2875797
申请日：1997-02-13
申请人： TOPPAN PRINTING CO LTD
发明人： UEDA RYUJI , KAWASHIMA KATSUMASA , TANAKA SATOSHI , FUJII YOSHIHIRO
IPC分类号： G01N31/00 , C23F1/00 , C23F1/46 , G01N21/78 , H01L21/308
摘要： PROBLEM TO BE SOLVED: To provide the analyzing method and device for directly measuring the Cu density in a ferric chloride etching liquid in the etching job site. SOLUTION: This analyzing device comprises a sampling means 10 for sampling a constant amount of the ferric chloride etching liquid from an etching device, a diluted liquid preparing means 20 for preparing the diluted liquid by diluting the sampled ferric chloride etching liquid gradually by hydrochloric acid 21 and the pure water 22, a reaction liquid preparing means 30 for successively adding a hydroxylamine hydrochloride, sodium vasocupreine sulfonate, sodium acetate, and the pure water 32 to the diluted liquid from a samply supply system 31, to color a copper ion, an absorbance measuring means for measuring the absorbance of the reaction liquid at near 480nm wavelength, a copper density operating means 50 for detecting the copper density by operating the copper ion density on the basis of the analytical curve input in advance, and a controlling means 60 for driving and controlling these means, to analyze the copper density of the ferric chloride etching liquid.

9. 发明专利

JPH0945832A MANUFACTURE OF LEAD FRAME 失效
公开(公告)号：JPH0945832A
公开(公告)日：1997-02-14
申请号：JP19645595
申请日：1995-08-01
申请人： TOPPAN PRINTING CO LTD
发明人： NAOI KATSUYOSHI , FUJII YOSHIHIRO , KAWASHIMA KATSUMASA , TANAKA SATOSHI
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To improve the adhesive strength between a metallic material and dry films and to make it possible to manufacture a lead frame having a high processing accuracy by a method wherein before the dry films are adheres on copper platings, the copper platings are applied to both surfaces of the metallic material consisting of an iron-Ni alloy and, the copper platings are separated from the metallic material after etching. SOLUTION: A metallic material 11 consisting of an iron alloy, which contains Ni, Co and Mn, is cleaned and copper-plated layers 12 are formed on both surfaces of the material 11. Then, alkaline developed dry films are respectively bonded on the copper-plated layers 12 while being pressed and heated. Etching resists 13 having a desired pattern are formed by exposure and developing using a prescribed mask. Moreover, the layers 12 and the material 11 are etched to process a lead frame of a desired shape. After that, after an etching liquid is washed away, the resists 13 are separated from the material 11 using an alkaline aqueous solution. Then, the layers 12 are separated from the material 11 using a copper release solution.

10. 发明专利

JPH093661A ETCHING DEVICE 失效
公开(公告)号：JPH093661A
公开(公告)日：1997-01-07
申请号：JP15152295
申请日：1995-06-19
申请人： TOPPAN PRINTING CO LTD
发明人： UEDA RYUJI , FUJII YOSHIHIRO , KIKUCHI HISAKAZU , KAKEHASHI TATSURO , HORII KAZUYUKI
IPC分类号： C23F1/08 , H01L21/306
摘要： PURPOSE: To enhance the accuracy of etching sizes and to lessen the mismatching of the sizes of the front and rear of a metallic base material by adjusting etching time while hindering contact of an etching liquid with the base material in a region where shielding plates are expanded. CONSTITUTION: While the base material 2 is transported in an etching chamber 1, the etching liquid 5 is injected from nozzles 4 through shower pipes 3 and is sprayed to the base material, by which the base material is etched. At this time, 'Teflon (R)' sheets 6 are installed between the base material 2 and the spray nozzles 4 to prevent the arrival of the etching liquid 5 at the base material 2 for the desired distance within the etching stage. The one-side ends of these 'Teflon (R)' sheets 6 are fixed to supporting bars 7, are drawn out by titanium wires 9 and are taken up in take-up sections 10, by which the areas of the shielding parts is adjusted. As a result, an integral line connected to the fore and post stages is obtd.

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