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1. 发明专利

JPH07106497A SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR SAME 失效
公开(公告)号：JPH07106497A
公开(公告)日：1995-04-21
申请号：JP24666093
申请日：1993-10-01
申请人： TOPPAN PRINTING CO LTD , FUJITSU LTD , KYUSHU FUJITSU ELECTRONIC
发明人： KAWASHIMA KATSUMASA , NAGAMATSU TAKAHIRO , IIZUKA HIROYOSHI , KANAZAWA KENJI , MOTOYOSHI TOSHIFUMI , KASAI JUNICHI , SATO MITSUTAKA , TAKESHITA KOICHI
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To prevent a sealing resin from being cracked by a method wherein the whole surface of a die pad is formed as a half-etched part, the thickness of the sealing resin is made thin and the concentration of a stress is dispersed. CONSTITUTION:A semiconductor chip 1 is mounted on, and fixed to, a die pad 2 for a lead frame by a conductive adhesive such as, e.g. a silver paste, and it is connected electrically to inner leads 4 by gold wires 3. The surface of the die pad 2 is formed as a half-etched part, and its rear is formed as a dimple-worked part in a continuous uneven shape which is composed of mountains and valleys. In addition, the semiconductor element 1 is sealed with a sealing resin 6 exclusive of outer leads 5, and a package for a semiconductor device is formed. The thickness of the sealing resin 6 is set to be thin as compared with that in conventional cases. In the thin package for the semiconductor device, it is possible to prevent a resin crack whose occurrence frequency is high and to increase reliability.

2. 发明专利

JPH0745772A MANUFACTURE OF LEAD FRAME 失效
公开(公告)号：JPH0745772A
公开(公告)日：1995-02-14
申请号：JP20717293
申请日：1993-07-29
申请人： TOPPAN PRINTING CO LTD
发明人： KAWASHIMA KATSUMASA
IPC分类号： C25D7/00 , C25D7/12 , H01L23/50
摘要： PURPOSE:To substantially prevent the deformation of an inner lead by a method wherein, when the plating region at the top of the inner lead of a lead frame is plated, no plating layer is formed on the side plane of the inner lead other than the plating region. CONSTITUTION:In a method wherein a lead frame A having a plating layer 6 in the plating region 2a at the top of the inner lead 2, when the inner lead 2 is formed, an auxiliary tie bar is formed to connect the side planes of the inner lead 2 being adjacent each other near the plating region 2a of the inner lead so as to obtain a lead frame B having an auxiliary tie bar, and then, a plating layer 6 is formed on the plating region 2a to cut and remove the auxiliary tie bar 10 with a laser.

3. 发明专利

JPH05335448A 失效
公开(公告)号：JPH05335448A
公开(公告)日：1993-12-17
申请号：JP14302092
申请日：1992-06-03
申请人： TOPPAN PRINTING CO LTD
发明人： KAWASHIMA KATSUMASA , TSUKAMOTO TAKETO , TOKI SOTARO
IPC分类号： C25D13/00 , H01L21/56 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/50
摘要： PURPOSE:To prevent invasion of water from a gap between leads and sealing resin after a package is sealed and to effectively prevent cracks at a sealing resin layer, etc., by forming an electrodeposited resin layer covering the gap between the leads and the resin by electrodepositing. CONSTITUTION:A semiconductor integrated circuit 6 is mounted on an island 1 of a lead frame having the island 1 formed at a center and leads 2, 3 formed on a periphery of the island 1. The circuit 6 is connected to the leads 3 via wire bondings 7. Particularly, an insulating resin layer 5 covering a gap between the leads 3 and sealing resin 8 is formed on a boundary between an interior of a package and an exterior when the frame is package-sealed with the resin 8 by electrodepositing with a part except a part to be electrodeposited of the lead 3 as a mask. Thus, after package-sealing, invasion of water from a gap between the leads 3 and the resin 3 can be prevented.

4. 发明专利

JPH05119476A PHOTORESIST INTERMEDIATE AND PHOTORESIST 失效
公开(公告)号：JPH05119476A
公开(公告)日：1993-05-18
申请号：JP28462191
申请日：1991-10-30
申请人： TOPPAN PRINTING CO LTD
发明人： TSUKAMOTO TAKETO , NATORI KEIKO , TAMURA AKIRA , KAWASHIMA KATSUMASA , YONEZAWA MASAJI
IPC分类号： G03F7/027 , G03F7/028 , G03F7/033 , H01L21/027 , H05K3/06
摘要： PURPOSE:To improve resolution by preparing a photoresist from a photoresist intermediate and the aq. soln. of this intermediate and bichromate. CONSTITUTION:This photoresist for water development is prepared from the intermediate comprising a water-soluble polymer expressed by formula having 50000-120000 weight mean mol.wt. In formula, A is a water-soluble monomer, x is 0.75-0.85, y is 0.1-0.15, and z is 0.05-0.15. In this case, the water-soluble monomer is preferably maleic acid, vinylpyrrolidone, or acrylic acid. The photoresist intermediate is a water-soluble polymer comprising copolymers of vinyl alcohol, vinyl acetate, and water-soluble monomers such as maleic acid, vinyl pyrrolidone, acrylic acid, etc. The vinyl alcohol is not crystallized and is very easily dissolved in water, so that dissolution proceeds in each single molecule. Thus, resolution can be improved.

5. 发明专利

JPH0997867A SUBSTRATE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0997867A
公开(公告)日：1997-04-08
申请号：JP25491495
申请日：1995-10-02
申请人： TOPPAN PRINTING CO LTD
发明人： KAWASHIMA KATSUMASA
IPC分类号： C23F1/00 , C23F1/02 , H01L23/50 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To flatten a part surface and a lead surface and to join them compactly by providing half etching at a lead frame and a lead edge part. SOLUTION: A half etching part 2 is formed on either surface of front and rear surfaces which oppose each other in a lead edge part 3. The half etching part 2 in the lead edge part 3 of one lead L1 is joined to such junction part as the conductor terminal part of the edge part surface of a printed wiring board P by melted solder. Also, the half etching part 2 in the lead edge part 3 of the other lead L2 is joined to such junction part as the conductor terminal part on the rear surface of the edge part of the printed wiring board P by melted solder. Lead edges 3, 3 of both leads L1 and L2 are arranged on the front and rear surfaces of the printed wiring board which do not oppose each other. The cut-out surface sides of the half etching part 2 of both leads L1 and L2 are joined to each junction part of the front surface of one edge part and the reverse surface of the other edge part out of both opposing edge parts of the printed wiring board P.

6. 发明专利

JPH0846129A LEAD FRAME 失效
公开(公告)号：JPH0846129A
公开(公告)日：1996-02-16
申请号：JP19779294
申请日：1994-07-29
申请人： TOPPAN PRINTING CO LTD
发明人： KAWASHIMA KATSUMASA
IPC分类号： C23F1/00 , H01L23/28 , H01L23/50
摘要： PURPOSE:To obtain a lead frame having outer leads provided with resin dam bars in which projection of the dam bar from the surface of the outer lead is restricted without sacrifice of the strength of outer lead. CONSTITUTION:In a lead frame where a resin dam bar is provided across a half etched part A made in an outer lead 1, a part of the outer lead 1 is not subjected to half etching but left as it is in the direction traversing the outer lead 1 within a region B where the dam bar is provided.

7. 发明专利

JPH0657450A RESIST PATTERN FORMING METHOD 失效
公开(公告)号：JPH0657450A
公开(公告)日：1994-03-01
申请号：JP21777692
申请日：1992-08-17
申请人： TOPPAN PRINTING CO LTD
发明人： NATORI KEIKO , KAWASHIMA KATSUMASA
IPC分类号： C23F1/00 , G03F7/40 , H01L23/50
摘要： PURPOSE:To refine a material to be worked while suppressing the side etching amt. by exposing and then developing a PVA-bichromate resist and dipping the obtained pattern in an aq. soln. of a water-soluble aldehyde. CONSTITUTION:A PVA-bichromate photoresist film formed on a substrate is exposed by using a photomask, room-temp. water is sprayed to dissolve the unexposed part, and the film is developed. A resist pattern thus formed is dipped in an aq. soln. of a water-soluble aldehyde and then post-baked at about 200 deg.C. Acetal is formed by the reaction between the hydroxyl group in PVA and the aldehyde, and the hydrophobicity of the resist surface is improved. Consequently, when the resist surface is etched by using an etchant, the etchant hardly infiltrates from the interface between the resist and substrate, and the side etching amt. is reduced.

8. 发明专利

JPH04371929A LIQUID CRYSTAL DISPLAY DEVICE 失效
公开(公告)号：JPH04371929A
公开(公告)日：1992-12-24
申请号：JP14883791
申请日：1991-06-20
申请人： TOPPAN PRINTING CO LTD
发明人： KAWASHIMA KATSUMASA , NAGASE TOSHIRO
IPC分类号： G02F1/133 , G02F1/1343 , G02F1/136 , G02F1/1365
摘要： PURPOSE:To attain a bright image display by preventing the conduction between varistor elements consisting of sintered bodies and upper row electrodes and forming the patterns of the upper row electrodes to such shapes which do not overlap on the varistor element parts and prevent the decrease in the intersecting areas with lower line electrodes. CONSTITUTION:An auxiliary electrode 21 branched and extended from line electrodes 11 is provided between the respective two adjacent picture element electrodes provided on a lower glass substrate and the varistor element 13 of one section is connected between the two picture element electrodes on both sides via the auxiliary electrode. The shapes of the upper row electrode patterns have notches to prevent the overlap on the varistor elements on the lower glass substrate. The shape patterns of the upper row electrodes are formed so as to obtain even the shape patterns to lessen the decrease in the area of the intersected parts of the projected images on the lower glass substrate and the lower line electrodes, by which the liquid crystal display device is constituted.

9. 发明专利

JPH03166522A LIQUID CRYSTAL DISPLAY DEVICE 失效
公开(公告)号：JPH03166522A
公开(公告)日：1991-07-18
申请号：JP30628189
申请日：1989-11-24
申请人： TOPPAN PRINTING CO LTD
发明人： KAWASHIMA KATSUMASA , NAGASE TOSHIRO
IPC分类号： G02F1/1343 , G02F1/133 , G02F1/136 , G02F1/1365
摘要： PURPOSE:To correct the dispersion in operating characteristics by providing plural small section parts positioned intermittently along the longitudinal direction of a long piece shape part in this part so that the length of the function part of a sintered body varistor element can be adjusted by cutting and separating the small section parts. CONSTITUTION:A metallic electrode 28 is formed to the long piece shape part in which the part to be connected to the sintered body varistor element 23 extends toward the junction of the sintered body varistor element 23 and a line electrode 21. The plural small section parts 28a positioned intermittently along the longitudinal direction of this long piece shape part are provided in this part. The long piece shape part is formed to a ladder shape. The length (d1 to d5) of the function part of the sintered body varistor element 23 is adjusted by cutting the small section parts 28a by laser fusion cutting, etc., and disconnecting the metallic electrode 28 from its front end part when there is a fluctuation in the varistor characteristics between the respective liquid crystal picture elements. The characteristics of the sintered body varistor element 23 are adjusted in this way, by which the dispersion in the operating characteristics of the liquid crystal display device is corrected.

10. 发明专利

JPH0945832A MANUFACTURE OF LEAD FRAME 失效
公开(公告)号：JPH0945832A
公开(公告)日：1997-02-14
申请号：JP19645595
申请日：1995-08-01
申请人： TOPPAN PRINTING CO LTD
发明人： NAOI KATSUYOSHI , FUJII YOSHIHIRO , KAWASHIMA KATSUMASA , TANAKA SATOSHI
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To improve the adhesive strength between a metallic material and dry films and to make it possible to manufacture a lead frame having a high processing accuracy by a method wherein before the dry films are adheres on copper platings, the copper platings are applied to both surfaces of the metallic material consisting of an iron-Ni alloy and, the copper platings are separated from the metallic material after etching. SOLUTION: A metallic material 11 consisting of an iron alloy, which contains Ni, Co and Mn, is cleaned and copper-plated layers 12 are formed on both surfaces of the material 11. Then, alkaline developed dry films are respectively bonded on the copper-plated layers 12 while being pressed and heated. Etching resists 13 having a desired pattern are formed by exposure and developing using a prescribed mask. Moreover, the layers 12 and the material 11 are etched to process a lead frame of a desired shape. After that, after an etching liquid is washed away, the resists 13 are separated from the material 11 using an alkaline aqueous solution. Then, the layers 12 are separated from the material 11 using a copper release solution.

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