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1. 发明专利

JP2013243317A Coating applicator, substrate processing system, and substrate processing method 有权
标题翻译：涂料加工机，基板加工系统和基板加工方法
公开(公告)号：JP2013243317A
公开(公告)日：2013-12-05
申请号：JP2012117002
申请日：2012-05-22
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： INAO YOSHIHIRO , KATSURAGAWA JUNICHI , TSUSHIMA SHUGO
IPC分类号： H01L21/027 , B05C11/08 , B05D1/40
CPC分类号： B05C11/08 , B05D1/005
摘要： PROBLEM TO BE SOLVED: To inhibit the occurence of problems due to adherence of a coating liquid to the interior of a coating applicator in the coating applicator which rotates a substrate thereby spreading the coating liquid to a substrate surface.SOLUTION: A coating applicator 10 includes: a cup 11 enclosing a substrate 1; a nozzle 12 discharging a coating liquid to the substrate 1; a rotation part 18 rotating the substrate 1; a discharge passage 14 discharging the coating liquid from the cup 11; and device cleaning parts 16, 17 supplying a cleaning liquid to at least one of an inner wall of the cup 1 and the discharge passage 14.
摘要翻译：要解决的问题：为了抑制由于涂布液粘附到涂布器内部的涂布器中的问题的发生，所述涂布器旋转基底从而将涂布液扩散到基底表面。涂覆涂布器10包括：封闭基板1的杯11; 将涂布液排出到基板1的喷嘴12; 旋转基板1的旋转部18; 排出通道14，从杯11排出涂布液; 以及向杯1的内壁和排出通道14中的至少一个供给清洗液的装置清洁部16,17。

2. 发明专利

JP2013239499A Sticking device and sticking method 有权
标题翻译：手提装置和手提方法
公开(公告)号：JP2013239499A
公开(公告)日：2013-11-28
申请号：JP2012110098
申请日：2012-05-11
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： KATSURAGAWA JUNICHI , INAO YOSHIHIRO , KATO SHIGERU
IPC分类号： H01L21/02 , B30B15/34 , H01L21/683 , H05K3/00
CPC分类号： H01L21/67092 , B29C43/203 , B29C2043/561 , B30B15/06 , B30B15/32 , B32B37/10 , B32B41/00 , B32B2309/02 , B32B2309/04 , B32B2309/10 , B32B2309/12
摘要： PROBLEM TO BE SOLVED: To prevent a substrate and a support stuck via an adhesion layer from sticking to an upper-side plate member, in a sticking device which includes a pair of upper and lower plate members and in which the substrate and the support are stuck via the adhesion layer.SOLUTION: A sticking device 1 includes a pair of upper and lower plate members 2 sandwiching a laminate formed by laminating a substrate, an adhesion layer and a support supporting the substrate, in the order, and a preventing member 27 for preventing the laminate from sticking to an upper-side plate member 2b is provided at a portion to be in contact with the laminate in the upper-side plate member 2b.
摘要翻译：要解决的问题：为了防止由粘合层粘附的基板和支撑体粘附到上侧板构件，在包括一对上板和下板构件的粘合装置中，其中基板和支撑件是粘贴装置1：粘贴装置1包括一对上下板构件2，夹着通过层叠基板，粘合层和支撑基板的支撑体而形成的层压体，并且防止构件27 在与上侧板部件2b中的层压体接触的部分设置有用于防止层压体粘附到上侧板部件2b的部分。

3. 发明专利

JP2017092195A 支持体分離装置及び支持体分離方法审中-公开
公开(公告)号：JP2017092195A
公开(公告)日：2017-05-25
申请号：JP2015218922
申请日：2015-11-06
申请人：東京応化工業株式会社 , Tokyo Ohka Kogyo Co Ltd
发明人： IWATA YASUMASA , NAKAMURA AKIHIKO , KATSURAGAWA JUNICHI
IPC分类号： H01L21/683
摘要：【課題】支持体の厚さによらず、当該支持体の外周端部を首尾よく把持し、積層体から当該支持体を分離する。【解決手段】支持体分離装置100は、分離プレート4と、ツメ部1とを備え、ツメ部1は、傾斜面1bと、調整部1cとを備え、当接面4aをサポートプレート17の平面部に当接し、傾斜面1bをサポートプレート17の外周端部に設けられた面取り部位17aに当接することでサポートプレート17を把持する。【選択図】図1

4. 发明专利

JP2014003246A Bonding apparatus 有权
标题翻译：绑定装置
公开(公告)号：JP2014003246A
公开(公告)日：2014-01-09
申请号：JP2012139217
申请日：2012-06-20
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： KATSURAGAWA JUNICHI , INAO YOSHIHIRO , KATO SHIGERU
IPC分类号： H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a bonding apparatus which can uniformly bond a substrate and a support medium via an adhesive layer.SOLUTION: A bonding apparatus 1 further comprises: a plurality of circumferential support members 32 for supporting a plate member 2 at parts other than a central part; a detection part for detecting an amount of deflection of the plate member 2 caused by a pressing force applied to a laminate; and a control part for elongating and contracting the circumferential support members 32 so as to compensate for the amount of deflection detected by the detection part.
摘要翻译：要解决的问题：提供一种能够通过粘合剂层均匀地粘合基板和支撑介质的接合装置。解决方案：接合装置1还包括：多个周向支撑构件32，用于在其它部分处支撑板构件2 比中央部分检测部，其检测由施加到层叠体上的按压力引起的板部件2的挠曲量; 以及用于使周向支撑构件32伸长和收缩以便补偿由检测部检测到的偏转量的控制部。

5. 发明专利

JP2012059758A Device and method for bonding 有权
标题翻译：用于结合的装置和方法
公开(公告)号：JP2012059758A
公开(公告)日：2012-03-22
申请号：JP2010198841
申请日：2010-09-06
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： KOBARI HITOSHI , KATSURAGAWA JUNICHI , INAO YOSHIHIRO
IPC分类号： H01L21/02 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide a bonding device which performs accurate bonding.SOLUTION: A bonding device according to this invention is a bonding device for bonding a wafer 42 to glass 41. The bonding device includes: a load lock chamber 6 which can be depressurized and has positioning means that positions the wafer 42 and the glass 41 before bonding the wafer 42 to the glass 41; and a joining chamber 7 which can be depressurized and has bonding means bonding the wafer 42 to the glass 41, which are positioned. The load lock chamber 6 and the joining chamber 7 are formed so that at least a pair of wafer 42 and glass 41, which are positioned, are moved from the load lock chamber 6 to the joining chamber 7 under reduced pressure.
摘要翻译：要解决的问题：提供一种进行精确接合的接合装置。解决方案：根据本发明的接合装置是用于将晶片42接合到玻璃41的接合装置。接合装置包括：负载锁定室6，其可以被减压，并且具有定位装置，其定位晶片42和将晶片42接合到玻璃41之前的玻璃41; 以及能够减压并且具有将晶片42接合到定位的玻璃41的接合装置的接合室7。负载锁定室6和接合室7形成为使得至少一对晶片42和玻璃41被定位成在减压下从负载锁定室6移动到接合室7。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2009206452A Treatment liquid permeation unit, and treating apparatus 有权
标题翻译：处理液体渗透装置和处理装置
公开(公告)号：JP2009206452A
公开(公告)日：2009-09-10
申请号：JP2008050072
申请日：2008-02-29
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： NAKAMURA AKIHIKO , KATSURAGAWA JUNICHI , IWATA YASUMASA
IPC分类号： H01L21/683 , H01L21/304
CPC分类号： H01L21/67092 , H01L21/67017 , H01L21/67132 , Y10T156/1111 , Y10T156/1126 , Y10T156/1922
摘要： PROBLEM TO BE SOLVED: To make a treatment liquid which dissolves an adhesive permeate an adhesive with which a wafer and a support plate are stuck together or an adhesive sticking on a wafer surface. SOLUTION: A treatment liquid permeation unit 10 includes at least one vibration unit 11 and a vibration transmission unit 12 which transmits vibrations from the vibration unit 11. The vibration transmission unit 12 is disposed between the adhesive with which the wafer 20 and support plate 21 are stuck together or the adhesive sticking on the surface of the wafer 20, and vibration unit 11 from the vibration unit 11 are transmitted to the adhesive through the vibration transmission unit 12. Consequently, the treatment liquid for dissolving the adhesive supplied with the treatment liquid permeates the adhesive more, so that the treatment liquid permeates the adhesive uniformly in a shorter time. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了使溶解粘合剂的处理液渗透到晶片和支撑板粘附在一起的粘合剂或粘合在晶片表面上的粘合剂。解决方案：处理液渗透单元10包括至少一个振动单元11和从振动单元11传递振动的振动传递单元12.振动传播单元12设置在晶片20和支撑板21卡在一起，粘合在晶片20的表面上，并且来自振动单元11的振动单元11通过振动传递单元12传递到粘合剂。因此，用于溶解供应有处理液体更多地渗透粘合剂，使得处理液体在较短时间内均匀地渗透粘合剂。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2014082437A Bonding device and bonding method 有权
标题翻译：绑定装置和绑定方法
公开(公告)号：JP2014082437A
公开(公告)日：2014-05-08
申请号：JP2013020895
申请日：2013-02-05
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： INAO YOSHIHIRO , KATO SHIGERU , TSUSHIMA SHUGO , KATSURAGAWA JUNICHI , KOBARI HITOSHI , NAKAMURA AKIHIKO
IPC分类号： H01L21/683 , H01L21/02 , H01L21/677
CPC分类号： H01L21/6835 , B25J11/0095 , B25J15/0042 , H01L21/67092 , H01L21/687 , H01L21/68721 , H01L2221/68304 , H01L2221/68327 , H01L2221/68381 , Y10T156/10 , Y10T156/17
摘要： PROBLEM TO BE SOLVED: To provide a bonding device which improves accuracy of positioning between a substrate and a support medium during bonding and the quality, and to provide a bonding method.SOLUTION: A bonding device 1 bonds a substrate 2 and a support medium 3 with each other through an adhesion layer 4. The bonding device 1 includes support medium holding members 42. A holding jig 42a of each support medium holding member 42 holds the support medium 3 with its slope part (a contact member 42b) so as not to contact with a surface to be bonded to the substrate 2. The bonding device 1 bonds the support medium 3, which is held in the above-mentioned manner, to the substrate 2.
摘要翻译：要解决的问题：提供一种接合装置，其在接合期间提高基板和支撑介质之间的定位精度以及质量，并提供接合方法。解决方案：接合装置1将基板2和支撑介质3 接合装置1包括支撑介质保持构件42.每个支撑介质保持构件42的保持夹具42a以其斜面部分（接触构件42b）将支撑介质3保持为不与要接合到基板2的表面接触。接合装置1将以上述方式保持的支撑介质3接合到基板2。

8. 发明专利

JP2014007299A Superposing apparatus and superposing method 有权
标题翻译：超级装置和超级方法
公开(公告)号：JP2014007299A
公开(公告)日：2014-01-16
申请号：JP2012142389
申请日：2012-06-25
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： KATSURAGAWA JUNICHI , KOBARI HITOSHI
IPC分类号： H01L21/02 , H01L21/304 , H01L21/68
CPC分类号： H01L21/681 , G06T7/0004 , G06T11/60 , G06T2207/30108 , H01L21/68 , H01L21/6835 , H01L21/6836 , H01L21/68785 , H01L2221/68318 , H01L2221/68327 , H01L2221/68331 , H01L2221/6834 , H01L2221/68381
摘要： PROBLEM TO BE SOLVED: To improve the accuracy of alignment between a wafer and a support plate in a superposing apparatus.SOLUTION: The superposing apparatus according to the present invention is configured such that: the center positions of a substrate and a support which are held by a center position detecting unit 3 are detected; the substrate and the support are conveyed from the center position detecting unit 3 to a superposing unit 6; and then the substrate and the support are superposed on each other in the superposing unit 6 so that the detected center positions of the substrate and the support overlap.
摘要翻译：要解决的问题：提高重叠装置中的晶片和支撑板之间的对准精度。解决方案：根据本发明的叠加装置被构造成：保持基板和支撑件的中心位置检测中心位置检测单元3; 基板和支撑件从中心位置检测单元3传送到重叠单元6; 然后将基板和支撑体叠置在叠加单元6中，使得检测到的基板和支撑体的中心位置重叠。

9. 发明专利

JP2014003245A Bonding apparatus 有权
标题翻译：绑定装置
公开(公告)号：JP2014003245A
公开(公告)日：2014-01-09
申请号：JP2012139213
申请日：2012-06-20
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： KATSURAGAWA JUNICHI , INAO YOSHIHIRO , KATO SHIGERU
IPC分类号： H01L21/683 , H01L21/02
CPC分类号： H01L21/683 , B32B37/0046 , B32B37/10 , B32B37/12 , B32B41/00 , B32B2457/14 , H01L21/67092 , H01L21/67288
摘要： PROBLEM TO BE SOLVED: To provide a bonding apparatus which can eliminate the possibility of breakage of a substrate and which can uniformly bond the substrate and a support medium via an adhesive layer.SOLUTION: A bonding apparatus 1 for bonding a substrate and a support medium via an adhesive layer comprises: a pair of plate members 2 for sandwiching a laminate and applying a pressing force to the laminate; and support members 3 for supporting the plate member. A part of the plate member which is brought into contact with the laminate is composed of ceramic and the part brought into contact with the laminate has a flatness at the time of not being pressed of 1.0 μm and under.
摘要翻译：要解决的问题：提供一种能够消除基板破裂的可能性并且能够通过粘合剂层均匀地粘合基板和支撑介质的接合装置。解决方案：用于将基板和支撑介质接合的接合装置1 通过粘合剂层包括：一对板状构件2，用于夹持层压体并向层压体施加按压力; 以及用于支撑板构件的支撑构件3。与层压体接触的板部件的一部分由陶瓷构成，与层压体接触的部分在不被压下1.0μm以下时具有平坦度。

10. 发明专利

JP2013065822A Substrate processing apparatus 有权
标题翻译：基板加工设备
公开(公告)号：JP2013065822A
公开(公告)日：2013-04-11
申请号：JP2012149976
申请日：2012-07-03
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： MIYANARI ATSUSHI , OISHI SEISHI , KATSURAGAWA JUNICHI , KAJIMA ATSUO
IPC分类号： H01L21/304 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To prevent contamination due to dispersion of a process liquid around a cup which houses a substrate.SOLUTION: A substrate processing apparatus 10 includes: an upper exhaust port 1 which is positioned above a substrate 12 and exhausts a gas flowing on the substrate 12 from an area above an outer periphery of the substrate 12; and a first shield part 2 which is provided so as to extend from the upper exhaust port 1 in a direction of the substrate 12 and changes the direction of the gas flow so that the gas flowing on the substrate 12 flows into the upper exhaust port 1.

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