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1. 发明专利

JP2014154607A Transport hand, transport device, and transport method 有权
标题翻译：运输手段，运输设备和运输方法
公开(公告)号：JP2014154607A
公开(公告)日：2014-08-25
申请号：JP2013020890
申请日：2013-02-05
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： INAO YOSHIHIRO , NAKAMURA AKIHIKO , MIYANARI ATSUSHI , TAKASE SHINJI , FUKUSHIMA HIDEHITO , TSUSHIMA SHUGO
IPC分类号： H01L21/677 , B25J15/06
摘要： PROBLEM TO BE SOLVED: To transport a transportation article having a frame member in circumference and to favorably pass the transportation article to an absorbing stage.SOLUTION: A transport hand 1 comprises: an absorbing part 2 for absorbing a part of a single side of a frame member 11; and a pushing part 3 which is disposed at a position different from the absorbing part 2, and which, when a transport article 10 is passed to an absorbing stage 20, pushes the frame member 11 to the absorbing stage 20 by abutting the transport article to the single side of the frame member 11.
摘要翻译：要解决的问题：将具有框架构件的运输物品周围运输并有利地将运输物品通过到吸收台。传送手1包括：吸收部分2，用于吸收单个侧面的一部分框架构件11; 以及设置在与吸收部2不同的位置的推动部3，并且当运送物品10通过吸收台20时，通过将运送物品抵靠到框架部件11而将框架部件11推靠在吸收台20上框架构件11的单侧。

2. 发明专利

JP2014017455A Laminate formation method and laminate formation system 有权
标题翻译：层压成型方法和层压成型体系
公开(公告)号：JP2014017455A
公开(公告)日：2014-01-30
申请号：JP2012155919
申请日：2012-07-11
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： NAKAMURA AKIHIKO , MIYANARI ATSUSHI , INAO YOSHIHIRO , KATSURAGAWA JUNICHI
IPC分类号： H01L21/683 , B65G49/07
摘要： PROBLEM TO BE SOLVED: To provide a new laminate formation method.SOLUTION: A laminate formation method includes the steps of: carrying a substrate 41 into a spinner 52 (first carrying-in step); applying an adhesive to the substrate 41; carrying the substrate 41 into a bake plate 51 (second carrying-in step); forming an adhesion layer on the substrate 41; carrying the substrate 41 into a sticking part 7 (third carrying-in step); carrying a support plate 44 into the sticking part 7 (fourth carrying-in step); and forming a laminate 40 (sticking step).
摘要翻译：要解决的问题：提供新的层压体形成方法。解决方案：层压体形成方法包括以下步骤：将基板41承载在旋转器52中（第一进入步骤）; 将粘合剂施加到基底41上; 将基板41放入烘烤板51（第二进入步骤）中; 在基板41上形成粘合层; 将基板41搬入到粘贴部7（第三搬入工序）中。将支承板44装入到粘贴部分7中（第四进入步骤）; 并形成层压体40（粘贴工序）。

3. 发明专利

JP2013165130A Bonding method and bonding apparatus 有权
标题翻译：接合方法和接合装置
公开(公告)号：JP2013165130A
公开(公告)日：2013-08-22
申请号：JP2012026708
申请日：2012-02-09
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： MIYANARI ATSUSHI , INAO YOSHIHIRO , KATO SHIGERU , SEDAKA TAKAHIRO , ISHIDA SHINGO
IPC分类号： H01L21/02
CPC分类号： B32B37/06 , B32B37/04 , B32B37/10 , B32B2398/20 , H01L21/67092 , H01L21/67132 , H01L2924/0002 , H05K3/0058
摘要： PROBLEM TO BE SOLVED: To uniformly bond a substrate and a support plate.SOLUTION: A bonding method comprises: an adhesive layer formation process of pasting a thermoplastic adhesive on a substrate 1 or a support plate 2 to form an adhesive layer 3; a heating process of heating the adhesive layer 3 formed on the substrate 1 or the support plate 2; and a bonding process of bonding the substrate 1 and the support plate 2 by applying pressure to the substrate 1 and the support plate 2 each other via the heated adhesive layer 3.
摘要翻译：要解决的问题：为了均匀地粘合基板和支撑板。解决方案：粘合方法包括：将粘合剂层形成工艺在基材1或支撑板2上粘贴热塑性粘合剂以形成粘合剂层3; 加热形成在基板1或支撑板2上的粘合层3的加热工序; 以及通过经由加热的粘合剂层3向基板1和支撑板2施加压力来接合基板1和支撑板2的接合工艺。

4. 发明专利

JP2013102052A Substrate processing apparatus and substrate processing method 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：JP2013102052A
公开(公告)日：2013-05-23
申请号：JP2011244832
申请日：2011-11-08
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： INAO YOSHIHIRO
IPC分类号： H01L21/677 , B24B37/02 , B24B37/27 , B24B49/04 , B24B49/12 , H01L21/02
CPC分类号： H01L21/67742 , H01L21/67092 , H01L21/67766 , H01L21/6838 , H01L21/68707 , Y10T156/10
摘要： PROBLEM TO BE SOLVED: To prevent warpage of a wafer in the manufacturing processes.SOLUTION: A substrate processing apparatus includes a transfer unit 20, which transfers a laminated body supported by a support pin supporting an inner peripheral part of a supported surface of a wafer that is opposite to a surface, to which a support plate is bonded, under a decompression environment, and prevents the warpage of the wafer in the manufacturing processes.
摘要翻译：要解决的问题：为了防止制造工艺中的晶片翘曲。解决方案：基板处理装置包括转印单元20，该转印单元20将支撑在支撑板上的支撑销支撑的支撑板支撑在与支撑板相对的表面相对的晶片的支撑表面的内周部分上的层叠体在减压环境下粘合，并且防止在制造过程中晶片的翘曲。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2009140971A Peeling device 有权
标题翻译：污染设备
公开(公告)号：JP2009140971A
公开(公告)日：2009-06-25
申请号：JP2007312867
申请日：2007-12-03
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： NAKAMURA AKIHIKO , KATSURAGAWA JUNICHI , MIYANARI ATSUSHI , INAO YOSHIHIRO , IWATA YASUMASA
IPC分类号： H01L21/683 , H01L21/304
CPC分类号： B32B43/006 , B32B37/12 , B32B2038/1891 , B32B2457/14 , H01L21/67173 , H01L21/67346 , Y10S156/93 , Y10S156/941 , Y10T156/11 , Y10T156/1111 , Y10T156/19 , Y10T156/195 , Y10T156/1978 , Y10T279/11
摘要： PROBLEM TO BE SOLVED: To provide a peeling device for processing a laminate including a substrate and a support plate and peeling the support plate from the substrate, thereby efficiently performing peeling processing. SOLUTION: The peeling device peels the support plate 14 from the substrate 12 of the laminate 10 in which the substrate 12 is bonded to the support plate 14. The peeling device includes: a first storing section 20 for storing the laminate 10; a plurality of first processing sections 30 for reducing adhesive force of an adhesive 13 applied between the substrate 12 and the support plate 14; and a first carrying section 50 which is capable of moving in the first direction and carries the laminate 10 from the first storing section 20 to the first processing section 30 while holding the laminate 10. With the first carrying section 50, it is possible to provide the peeling device 100 which moves straightly. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于处理包括基板和支撑板的层压板并从基板剥离支撑板的剥离装置，从而有效地执行剥离处理。解决方案：剥离装置将基板12与支撑板14接合的层叠体10的基板12剥离支撑板14.剥离装置包括：第一存储部20，用于储存层叠体10; 多个用于降低施加在基板12和支撑板14之间的粘合剂13的粘合力的第一处理部分30; 以及能够沿着第一方向移动并且将层压体10从第一存储部20运送到第一处理部30同时保持层压体10的第一搬运部50。在第一搬运部50中，剥离装置100，其直线移动。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2008205389A Film forming device 审中-公开
标题翻译：电影制作装置
公开(公告)号：JP2008205389A
公开(公告)日：2008-09-04
申请号：JP2007042550
申请日：2007-02-22
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： INAO YOSHIHIRO
IPC分类号： H01L21/312 , B05C11/08
摘要： PROBLEM TO BE SOLVED: To provide a film forming device capable of covering the entire peripheral edge of a circular substrate by supplying a composition for forming a film in a single process.
SOLUTION: The film forming device 1 has a holding section 20 for holding the circular substrate 100 and rotating it in a substrate in-plane direction, and a supply unit 10a for supplying the composition for forming a film to the peripheral edge of the circular substrate 100.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过在单个工艺中提供用于形成膜的组合物来覆盖圆形基板的整个周缘的成膜装置。解决方案：成膜装置1具有用于保持圆形基板100并在基板的面内方向上旋转的保持部分20，以及用于将用于形成薄膜的组合物供给到周边的周边的供给单元10a 圆形基底100。（C）2008，JPO＆INPIT

7. 发明专利

JP2008177412A Liquid solvent abutment unit 有权
标题翻译：液体溶剂处理单元
公开(公告)号：JP2008177412A
公开(公告)日：2008-07-31
申请号：JP2007010335
申请日：2007-01-19
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： NAKAMURA AKIHIKO , MIYANARI ATSUSHI , INAO YOSHIHIRO , IWATA YASUMASA
IPC分类号： H01L21/683 , H01L21/304
CPC分类号： H01L21/67132 , H01L21/67086 , Y10T156/1111
摘要： PROBLEM TO BE SOLVED: To provide a liquid solvent abutment unit which promotes a reaction of a bonding member by a liquid solvent between a perforated support plate and a wafer. SOLUTION: The liquid solvent abutment unit is constituted of: a supply part (103) for supplying the liquid solvent onto a support plate face; a staying part (10) for staying the supplied liquid solvent in a hole forming range on the support plate face; a recovery part (104) for recovering the liquid solvent staying in the hole forming range; and a vibration part (13) for vibrating the liquid solvent. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种液体溶剂邻接单元，其在多孔支撑板和晶片之间通过液体溶剂促进粘合构件的反应。液体溶剂抵接单元由以下部件构成：用于将液体溶剂供给到支撑板面上的供给部（103）用于将供应的液体溶剂保持在支撑板面上的孔形成范围内的停留部分（10）用于回收残留在孔形成范围内的液体溶剂的回收部分（104）; 和振动液体溶剂振动部（13）。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008166536A Pasting apparatus 审中-公开
标题翻译：抛光装置
公开(公告)号：JP2008166536A
公开(公告)日：2008-07-17
申请号：JP2006355112
申请日：2006-12-28
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： NAKAMURA AKIHIKO , MIYANARI ATSUSHI , INAO YOSHIHIRO , IWATA YASUMASA
IPC分类号： H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a pasting apparatus capable of pasting a wafer to a support plate using various pasting methods. SOLUTION: The pasting apparatus (1) for pasting the support plate to the circuit forming surface of the wafer via an adhesive layer includes: an adhesive layer forming means (14) for forming the adhesive layer on the support plate or on the circuit forming surface of the wafer; a reversing means (17) for reversing the support plate or the wafer; a pasting means (18) for pasting the supporting plate to the circuit forming surface of the wafer via the adhesive layer. The apparatus is configured so that the reversing means (17) reverses the support plate or the wafer, and the pasting means (18) pastes the support plate to the circuit forming surface of the wafer via the adhesive layer. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够使用各种粘贴方法将晶片粘贴到支撑板上的粘贴装置。解决方案：用于通过粘合剂层将支撑板粘贴到晶片的电路形成表面的粘贴装置（1）包括：粘合层形成装置（14），用于在支撑板上或在支撑板上形成粘合剂层电路形成表面; 用于反转支撑板或晶片的反转装置（17）; 粘贴装置（18），用于经由粘合剂层将支撑板粘贴到晶片的电路形成表面。该装置被配置为使得反转装置（17）反转支撑板或晶片，并且粘贴装置（18）通过粘合剂层将支撑板粘贴到晶片的电路形成表面。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2008127506A Adhesive composition and adhesive film 有权
标题翻译：胶粘组合物和粘合膜
公开(公告)号：JP2008127506A
公开(公告)日：2008-06-05
申请号：JP2006316094
申请日：2006-11-22
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： ASAI TAKAHIRO , MISUMI KOICHI , MIYANARI ATSUSHI , INAO YOSHIHIRO , NAKAMURA AKIHIKO
IPC分类号： C09J153/00 , C08F290/04 , C09J7/02 , C09J155/00
CPC分类号： C09J153/00 , C08F212/08 , C08F220/06 , C08F220/18 , C08F290/046 , C08F2220/301 , C09J7/381 , C09J133/10 , C09J133/12 , C09J135/06 , C09J2205/114 , C09J2433/00 , C09J2453/00 , Y10T428/2852 , Y10T428/2891
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition being excellent in heat resistance, adhesive strength under high temperature conditions and alkali resistance and easy in peeling after a high temperature process. SOLUTION: The adhesive composition is composed mainly of a polymer prepared by the copolymerization of a monomer composition comprising styrene, a (meth)acrylate having a cyclic structure and an alkyl (meth)acrylate having a chain structure. And the monomer composition may further contain a carboxylic acid having an ethylenic double bond, a bifunctional monomer and a styrene macromonomer, and, when the polymer contains a styrene block segment, heat resistance, adhesive strength in high temperature conditions, alkali resistance and easiness of peeling after a high temperature process are enhanced. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供耐热性优异，在高温条件下的粘合强度和耐碱性并且在高温处理后容易剥离的粘合剂组合物。粘合剂组合物主要由通过包含苯乙烯，具有环状结构的（甲基）丙烯酸酯和具有链结构的（甲基）丙烯酸烷基酯）的单体组合物共聚制备的聚合物组成。并且单体组合物还可以含有具有烯属双键的羧酸，双官能单体和苯乙烯大分子单体，并且当聚合物含有苯乙烯嵌段链段时，耐热性，高温条件下的粘合强度，耐碱性和容易性高温加工后的剥离得到提高。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2008063463A Adhesive composition, adhesive film and method for producing the adhesive composition 审中-公开
标题翻译：胶粘组合物，粘合膜和用于生产胶粘组合物的方法
公开(公告)号：JP2008063463A
公开(公告)日：2008-03-21
申请号：JP2006243451
申请日：2006-09-07
申请人： Tokyo Ohka Kogyo Co Ltd , 東京応化工業株式会社
发明人： ASAI TAKAHIRO , MISUMI KOICHI , MIYANARI ATSUSHI , INAO YOSHIHIRO , NAKAMURA AKIHIKO , SAITO KOJI
IPC分类号： C09J125/14 , C09J7/02 , C09J133/04 , C09J151/00 , C09J153/00 , C09J155/00 , H01L21/304
CPC分类号： C08F293/00 , C08F290/00 , C08F290/044 , C08F290/06 , C08F293/005 , C08L53/00 , C08L2666/02 , C09J7/10 , C09J7/387 , C09J125/14 , C09J133/08 , C09J153/00 , C09J2453/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition which has high heat resistance, adhesive strength in high temperature environments, and alkali resistance, and can easily be peeled after a high temperature process.
SOLUTION: This adhesive composition of the present invention containing a copolymer produced by copolymerizing a monomer composition comprising styrene, a cyclic structure-having (meth)acrylate, and a chain structure-having alkyl (meth)acrylate as a main component is characterized in that the monomer composition further contains a styrene macro monomer. Heat resistance, adhesive strength under high temperature environments, alkali resistance, and peeling facility after high temperature process can thereby be improved.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种粘合剂组合物，其在高温环境下具有高耐热性，粘合强度和耐碱性，并且可以在高温加工后容易地剥离。解决方案：本发明的粘合剂组合物含有通过使包含苯乙烯的单体组合物（具有（甲基）丙烯酸酯的环状结构和具有（甲基）丙烯酸烷基酯）的链状结构的单体组合物作为主要成分共聚而制备的共聚物，其特征在于，所述单体组合物还含有苯乙烯大分子单体。因此，能够提高高温环境下的耐热性，高温环境下的粘合强度，耐碱性和剥离设备。版权所有（C）2008，JPO＆INPIT

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