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    • 4. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR DEVICE
    • JPH02138729A
    • 1990-05-28
    • JP14231889
    • 1989-06-03
    • TOSHIBA CORPTOSHIBA CERAMICS CO
    • WATANABE MASAHARUHONMA KAZUMOTO
    • H01L21/205
    • PURPOSE:To prevent any stacking fault in epitaxial layer from occurring by a method wherein a single crystal semiconductor substrate containing oxygen is heat-treated for specific time at specific temperature to increase the defectives and after heat treatment for another specific time at another specific temperature, the substrate is etched away. CONSTITUTION:Defectives within single crystal ingot to be a substrate or a single crystal substrate are increased by heat treating the substrate for specific time at the temperature e.g., of 600-900 deg.C. Then, the defectives creating the defect density e.g., exceeding 50 /cm are caused in this single crystal substrate when the single crystal substrate is examined by an optical microscope after heat treatment for 18 hours at the temperature e.g., of 1050 deg.C. Through these procedures, in such a semiconductor device wherein an epitaxial layer is formed on the semiconductor substrate, any stacking fault in the epitaxial layer can be prevented from occurring without augmenting the oxygen concentration in the substrate.
    • 6. 发明专利
    • DEVICE FOR GROWING SINGLE CRYSTAL
    • JPS62256788A
    • 1987-11-09
    • JP10055486
    • 1986-04-30
    • TOSHIBA CERAMICS CO
    • TAKASU SHINICHIROTAJI HIDEKAZUHONMA KAZUMOTOYAMATO MITSUHIRO
    • C30B15/00C30B15/14C30B15/22C30B15/30C30B29/06H01L21/18H01L21/208
    • PURPOSE:To increase the life of a heating means by setting a specified condition between the diameter of a cylindrical heating means of a melt and the diameter of an electromagnetic coil arranged on the outside of the heating means and the interval between coils when a single crystal is grown from the melt of an electrically conductive substance by the CZ method. CONSTITUTION:The device for growing a single crystal is composed of a cylindrical crucible 11, the annular electrical heating means 15 arranged concentrically with the center axis of the crucible 11 on the outside of the crucible 11 and used for heating and melting the conductive substance in the crucible 11, a means provided to the heating means 15 and used for passing an electric current in zigzags in the longitudinal direction of the heating means 15, and a couple of electromagnetic coils 17 which are arranged symmetrically to the center axis of the crucible 11 on the outside of the heating means 15 and the centers of which are positioned at about the same height as the liq. surface of the molten conductive substance in the crucible 11. Besides, the diameter 2rc of the electromagnetic coil 17 is made larger than 0.8 times the diameter 2rh of the heating means 15, and the interval L between the coils 17 is made larger than 1.5 times the diameter 2rh of the heating means 15.
    • 8. 发明专利
    • SILICON WAFER AND SELECTOR THEREOF
    • JPS62257739A
    • 1987-11-10
    • JP10055386
    • 1986-04-30
    • TOSHIBA CERAMICS CO
    • HONMA KAZUMOTOTAKASU SHINICHIROKASHIMA KAZUHIKO
    • H01L21/66H01L21/26H01L21/261
    • PURPOSE:To select an Si wafer having excellent characteristics, and to obtain the Si wafer having superior characteristics by bringing transmission intensity to near infrared beams, a wavelength of which extends over a range of 1.0-1.4mum, of a neutron-exposure Si-conversion P-doped silicon wafer to 30% or more. CONSTITUTION:Beams from an incandescence source 1 for a selector for silicon wafers are condensed by a condenser lens 2, and projected to a silicon light- receiving element 6 through a silicon filter 3 having predetermined thickness and few additives and a silicon wafer 5 for measurement on a base plate 4. Voltage proportional to the amount of beams transmitted through the wafer 5 is generated in the light-receiving element 6, and the voltage is measured by an instrumentation indicator 7. The reference amount of transmission of a reference silicon wafer is measured by the device 7 in place of the wafer 5, and relative transmission intensity is obtained from the ratio of the amount of the transmission. The silicon wafers are selected so that transmission intensity to near infrared beams, a wavelength of which is kept within a range of 1.0-1.4mum, of a neutron-exposure Si-conversion P-doped silicon wafer is brought to 30% or more.
    • 10. 发明专利
    • SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
    • JPS5617011A
    • 1981-02-18
    • JP9257979
    • 1979-07-23
    • TOKYO SHIBAURA ELECTRIC COTOSHIBA CERAMICS CO
    • WATANABE MASAHARUHONMA KAZUMOTO
    • H01L21/205C30B15/00C30B23/02C30B33/00C30B33/02H01L21/20H01L21/208H01L21/322
    • PURPOSE:To prevent defects in a laminated layer for a semiconductor device by using a substrate having defects of number larger than 10 /cm even after processing it for 18hr at 1,050 deg.C by heating an Si substrate containing a predetermined density of oxygen at 600-900 deg.C for predetermined time to produce defects of number larger than 10 /cm . CONSTITUTION:Defects 6 existed in the crystal of a substrate 1 (round bottom pits) have close relationship with defects formed in an epitaxial layer 4 of laminated layer for a semiconductor device. If the round bottom pits are higher in number than 10 /cm when heating the substrate at 1,050 deg.C for 18hr in an N2, ethcing it and observing it by an optical microscope, the defects in the epitaxial layer 4 of laminated layer fall within an allowable range. This high temperature process enlarges the miniature defects in the substrate to a size capable of observing them. The more the round bottom pits are increased, the less the defects in the epitaxial layer are decreased. Since the round bottom pit density is varied in accordance with the density of oxygen, when the substrate is heated at low temperature of 600- 900 deg.C, the round bottom pit density is increased without increasing the density of the oxygen in the substrate so as to prevent the defects in the epitaxial layer of the laminated layer.