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1. 发明专利

JP2002299523A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JP2002299523A
公开(公告)日：2002-10-11
申请号：JP2001101840
申请日：2001-03-30
申请人： TOSHIBA CORP
发明人： FUNAKURA HIROSHI , HOSOMI HIDEKAZU , KOSHIO YASUHIRO , OIDA MITSURU , NAGAOKA TETSUYA , NAGANO JUNYA , KUROSU ATSUSHI , YAMAGATA OSATAKE , KAWAI KAORU , FUKUDA MASATOSHI
IPC分类号： H01L23/29 , H01L21/56 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/498
摘要： PROBLEM TO BE SOLVED: To improve connection reliability of both the ILB and OLB of a semiconductor package. SOLUTION: The semiconductor package is provided with a package substrate 20 on which mounting terminals 70 and wiring layers 30 are formed, a semiconductor chip 10 mounted on the substrate 20 and electrically connected to the wiring layers 30, and low-elasticity resin layers 111 formed on the package substrate 20 and wiring layers 30. The package is also provided with a molded resin layer 63 sealing the wiring layers 30, the package substrate 20, the semiconductor chip 10, ILB sections 13, and the resin layers 111. The modulus of elasticity E of the low-elasticity resin layers 111 is smaller than that E of the molded resin layer 63.

2. 发明专利

JPH0729862A METHOD AND APPARATUS FOR GRINDING 失效
公开(公告)号：JPH0729862A
公开(公告)日：1995-01-31
申请号：JP17133293
申请日：1993-07-12
申请人： TOSHIBA CORP
发明人： SATO TAKEO , KAWAI KAORU
IPC分类号： H01L21/304 , H01L21/677 , H01L21/68 , H01L21/683
摘要： PURPOSE:To make the thickness of a semiconductor chip sharply thin, to enhance the production efficiency and to lower the production cost of the semiconductor device. CONSTITUTION:In a freezing and holding part 34, a fixation device 47 which is composed of a cooling plate, a chuck plate and the like is installed under a transport passage 21, a pressurization mechanism 48 which pressurizes a good chip 20 mounted on a protected tape 23 to the chuck plate is installed on one side of the transport passage 21, and a grinding means 49 is installed on the other side of the transport passage 21. In a cleaning and drying part 35, a second cleaning nozzle and a drier are installed at the upper part of a second transfer stand 59. In a chip takeout part 36, a third X-Y table 63 on which a second wafer ring 64 holding the ground good chip 20 has been placed is installed on one side of the transport passage 21, and a fourth X-Y table 65 on which a second transfer head provided with a second suction nozzle has been installed is installed on the other side of the transport passage 21. Consequently, the thickness of a semiconductor chip can be made sharply thin.

3. 发明专利

JP2003152004A METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003152004A
公开(公告)日：2003-05-23
申请号：JP2001344374
申请日：2001-11-09
申请人： TOSHIBA CORP
发明人： KAWAI KAORU , TAURA NOBUHIKO
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which effectively carries out from a flip-chip connection step to a resin sealing step. SOLUTION: In order to effectively manufacture a package by use of a flip-chip connection technique, only a molding device used in a sealing step is used to perform from a flip-chip connection containing the step to a sealing. An upper tool 13 is brought into contact with a lower die 14, and a bump of a semiconductor chip 10 and a wiring substrate 5' are heated and contact- bonded. Thereafter, a fused resin is injected into a space that a semiconductor chip formed by the upper tool and the lower die and the wiring substrate are disposed, and is cured to form a resin sealing body 9. These steps can be processed only by the molding device used by the sealing step, and rationalization and investment cost of a production can be curtailed. As the result, a semiconductor package at low cost can be provided.

4. 发明专利

JPH08222536A SEMICONDUCTOR MANUFACTURING APPARATUS, GRINDING APPARATUS AND MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08222536A
公开(公告)日：1996-08-30
申请号：JP4668095
申请日：1995-02-13
申请人： TOSHIBA CORP
发明人： TAKU SHINYA , KAWAI KAORU
IPC分类号： B24B1/00 , H01L21/304
摘要： PURPOSE: To provide a semiconductor manufacturing apparatus by which a wafer is fixed and bonded to a grinding apparatus by utilizing a frozen film, by which the thickness of the frozen film is made uniform when the wafer is frozen and fixed and by which the wafer is not warped and to provide the manufacturing method, of a semiconductor device, which uses it. CONSTITUTION: A semiconductor manufacturing apparatus is provided with a cooling means 2 which comprises a cooling face forming a frozen film used to fix and bond a main face A where an element region for a semiconductor wafer 1 has been formed and which changes the frozen film 31 used to bond the semiconductor wafer by freezing a pure water film, with a spacer 6 which is arranged on a support stand 20 and which controls the thickness of the pure water film, with a vacuum pad 7 which holds the semiconductor wafer in such a way that a part of the semiconductor wafer is placed on the spacer when the semiconductor wafer is placed on the cooling means and with a grinding means which grinds the rear of the semiconductor wafer fixed and bonded to the cooling means. The thickness of the frozen film is controlled precisely in such a way that the thickness of the spacer arranged near the cooling means is made equal to the sum of the thickness of the cooling means, the thickness of the frozen film and the thickness of the wafer.

5. 发明专利

JPH0778796A METHOD AND EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0778796A
公开(公告)日：1995-03-20
申请号：JP15738794
申请日：1994-07-08
申请人： TOSHIBA CORP
发明人： SATO TAKEO , KAWAI KAORU
IPC分类号： B23Q3/08 , H01L21/301 , H01L21/304 , H01L35/32
摘要： PURPOSE:To enable a semiconductor device manufacturing equipment to be remarkably improved in space and investment efficiency and to remarkably lessen a semiconductor device in thickness. CONSTITUTION:A cooling plate 24 is provided onto a base plate 25, and theromodules 30 serving to cool or heat are mounted on the rear of the cooling plate 24, a flow path 27a through which cooling water is made to circulate is provided inside the base plate 25 and connected to a heat radiator 27. A chuck plate 28 which fixes a wafer is provided onto the cooling plate 24, a porous material 29 is provided onto a part of the upside of the chuck plate 28, and a feed path 28a through which liquid or vapor is fed by a feed means is provided inside the chuck plate 28. A vacuum pump (not shown in a figure) which makes the feed path 28a vacuous or negative in pressure is provided adjacent to the chuck plate 28. Therefore, a manufacturing equipment of this constitution can be remarkably enhanced in space and investment efficiency.

6. 发明专利

JP2000353717A MANUFACTURE OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS 失效
公开(公告)号：JP2000353717A
公开(公告)日：2000-12-19
申请号：JP16673399
申请日：1999-06-14
申请人： TOSHIBA CORP
发明人： YAMAMOTO TETSUYA , KAWAI KAORU
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain the manufacturing method of a semiconductor device, which feeds flux and conductive balls on electrodes on a BGA substrate or a semiconductor element at the same time and with high accuracy, and a semiconductor manufacturing apparatus. SOLUTION: A mask 51, having apertures in the same arrangement as that of an electrode arrangement is superposed on a substrate 3, such as BGA substrate and a semiconductor element, using the mixture of a flux 11 with conductive balls 17 as a material and the mixture is squeezed in this mask by a squeegee 52. By setting the dimension of the apertures provided in the mask in a prescribed range, the flux and the balls 17 can be fed on electrodes 2 on a substrate such as the BGA substrate or the semiconductor element, at the same time and with high accuracy. By using the mixture of flux with the balls 17 in this a way, the formation of high accuracy bumps and a downsizing of a semiconductor device become possible with high productivity.

7. 发明专利

JPH09213661A METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09213661A
公开(公告)日：1997-08-15
申请号：JP1603396
申请日：1996-01-31
申请人： TOSHIBA CORP
发明人： KAWAI KAORU
IPC分类号： H01L21/304 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To greatly rationalize and save the labor of the process of splitting device patterns formed on a semiconductor wafer into the unit of chips. SOLUTION: The cut grooves 101a of the predetermined depth are formed along the dicing lines on the surface of a semiconductor wafer surface 101 on which semiconductor chips 102 are formed. After filling inside the grooves 101a with liquid 13, of which freezing point is lower than room temperature, the liquid 13 is frozen. In the state the semiconductor wafer 101 is fixed to a work plate 11 by the frozen liquid 13, the back surface of the semiconductor wafer 101 is ground with a grinding stone 14. With this, the semiconductor chips 102 are finished to the predetermined thickness while being split to unit pieces.

8. 发明专利

JPH07283293A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH07283293A
公开(公告)日：1995-10-27
申请号：JP6836494
申请日：1994-04-06
申请人： TOSHIBA CORP
发明人： KAWAI KAORU
IPC分类号： B23Q3/08 , B05D3/12 , H01L21/301 , H01L21/304 , H01L21/68 , H01L21/683
摘要： PURPOSE:To promote rationalization of a manufacturing process and marked thinning of a semiconductor substrate. CONSTITUTION:A first liquid is applied on the surface of a semiconductor wafer 22 and this first liquid is made to congeal so as to form a protective film 26 on the surface of the semiconductor wafer 22. Next, a second liquid 28a having a lower freezing point than the first liquid is applied on a work plate 27 and the semiconductor wafer 22 is loaded on the work plate 27 so that the second liquid 28a may come in contact with the protective film 26. Next, the second liquid 28a is made to congeal so as to fix the semiconductor wafer 22 on the work plate 27 by a fixing film 28. Next, after grinding the rear of the semiconductor wafer 22 by a grindstone 29 followed by thawing the fixing film 28, the semiconductor wafer 22 is taken down from the work plate 27. Accordingly, rationalization of a manufacturing process and marked thinning of the semiconductor can be promoted.

9. 发明专利

JP2004006721A SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2004006721A
公开(公告)日：2004-01-08
申请号：JP2003075751
申请日：2003-03-19
申请人： TOSHIBA CORP
发明人： FUKUDA MASATOSHI , KAWAI KAORU
IPC分类号： H01L23/29 , H01L23/31 , H01L23/48 , H01L25/065
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable thin resin-sealed semiconductor device. SOLUTION: The semiconductor device is provided with a substrate, a first semiconductor chip having a thickness ≤0.25 mm flip-chip connected on the substrate with a gap ≤0.055 mm, a conductive connecting member electrically connecting the substrate and the semiconductor chip, and a mold resin layer arranged on the substrate covering the first semiconductor chip and composed by hardening a resin composition comprising 75-92 wt% of an inorganic filler and 0.5-1.5 wt% of carbon black. The thickness of the mold resin layer on the side facing the substrate is ≤0.15 mm. For the inorganic filler, the largest diameter is ≤35 for 99 wt% or more, the average of the largest diameter is ≤15 μm, and the content of fine filler having the largest diameter is ≤10-50 wt% of the entire inorganic filler. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2002141366A METHOD FOR MOUNTING CONDUCTIVE BALL 失效
公开(公告)号：JP2002141366A
公开(公告)日：2002-05-17
申请号：JP2000335519
申请日：2000-11-02
申请人： TOSHIBA CORP
发明人： TOMONO AKIRA , KAWAI KAORU , YAMAMOTO TETSUYA
IPC分类号： H05K3/34 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a means for aligning conductive balls in a prescribed array on a ball grid array base plate or the like. SOLUTION: A method for mounting the conductive ball comprises a first step of displacing and superposing perforated parts of an aligning mask 21 and a supply mask 21 having substantially the same arrays and same opening shapes, a second step of introducing the balls 1 into holes 23 of the aligning mask, and a third step of bringing the opening parts 23 and 24 of the masks 21 and 22 into coincidence and disposing the balls 1 in the prescribed array on the base plate.

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