专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH0689910A DIE-BONDING DEVICE 失效
公开(公告)号：JPH0689910A
公开(公告)日：1994-03-29
申请号：JP23852892
申请日：1992-09-07
申请人： TOSHIBA CORP
发明人： KOBAYASHI HIROAKI , SATO TAKEO , YAMAZAKI MITSUHARU
IPC分类号： H01L21/52
摘要： PURPOSE:To provide a die-bonding device which can automate offset correcting work by forming an impress at an aimed bonding position by performing dummy bonding and detecting the position of the impress. CONSTITUTION:This device is provided with a camera 19 which takes the picture of an impress formed by dummy boding, memory 43 which stores the offset between a tool 15 and the camera 19, and arithmetic processing section 56 which calculates the deviated amount of the dummy bonding position from a preset aimed bonding position based on the picture of the impress taken with the camera 19, and updates the offset stored in advance in the memory 43 by correcting the offset based on the deviated amount calculated by the section 56. The die-bonding device is also provided with a control means 45 which moves the tool 15 based on the updated offset when the tool 15 is used for making ordinary bonding.

2. 发明专利

JPS61108138A Lead frame take-out device 失效
标题翻译：引线框架引出装置
公开(公告)号：JPS61108138A
公开(公告)日：1986-05-26
申请号：JP23107784
申请日：1984-11-01
申请人： Toshiba Corp , Toshiba Micro Comput Eng Corp
发明人： SATO TAKEO , MURAKAMI KOJI
IPC分类号： H01L21/50
CPC分类号： H01L21/50
摘要： PURPOSE:To automatize a transfer of lead frames in the magazine by a method wherein a mechanism, wherein the roller to be made to rotatingly drive is made to pressingly contact to the faces of the lead frames and the lead frames are taken out one sheet by one sheet by friction between the roller and the lead frames, is provided. CONSTITUTION:A roller 31 is made to rotate by the driving mechanism and a magazine 1 is made to descend by the vertically moving mechanism in a state that lead frames 2 are being housed in the magazine 1. When a position, where the lower face of a frame 2 on the lowest stage in the magazine 1 and the conveying face of a lead frame conveying unit 20 coincide with each other, is detected by the sensor, the descent of the magazine 1 is made to stop. Then, the roller 31 being pulled up to the upper direction by a spring 51 through a supporting arm 36 is made to pressingly contact to the face of the lead frame 2 while the frame 2 is made to rotate. The frame 2 is made to transfer by friction between the frame 2 and the roller 31. Then, the magazine 1 is made to descend and the lower face of the lead frame 2 on the second stage from the lowest stage is made to coincide with the conveying face of the conveying unit 20. By the similar way hereafter, a transfer, a transfer of the lead frames being left in the magazine 1 is performed.
摘要翻译：目的：通过以下方法来自动化传送盒子中的引线框架：其中使要旋转驱动的辊被压制地接触引线框架和引线框架的表面的机构被一张一张地取出提供了一个通过辊和引线框之间的摩擦的片材。构成：通过驱动机构使辊31旋转，并且在使引导框架2容纳在盒1中的状态下，通过竖直移动机构使盒1下降。当位置通过传感器检测到料盒1中的最下层上的框架2和引线框架输送单元20的输送面彼此重合，使料仓1的下降停止。然后，通过支撑臂36通过弹簧51向上方拉动的辊31在使框架2旋转的同时与引线框架2的表面压接。使框架2通过框架2和辊31之间的摩擦传递。然后使料盒1下降，使来自最下层的第二级上的引线框架2的下表面与输送单元20的输送面。通过以下相同的方式，执行转印，将残留在料盒1中的引线框的转印。

3. 发明专利

JPS6178035A Projecting crt device 失效
标题翻译：投影CRT设备
公开(公告)号：JPS6178035A
公开(公告)日：1986-04-21
申请号：JP19948384
申请日：1984-09-26
申请人： Toshiba Corp
发明人： HATTORI HIRONOBU , SATO TAKEO
IPC分类号： H01J29/00 , H01J31/10
CPC分类号： H01J29/006
摘要： PURPOSE:To prevent the dispersion of liquid-tightness by providing a pre-airtight fixing section at an airtight fixing section between the outer surface of a funnel and an annular radiating body, heating and hardening it, then injected an adhesive agent into a main airtight fixing section. CONSTITUTION:An annular radiating body 7 is fitted via an airtight fixing section 20 so as to surround the outer surface of a funnel 3, a transparent plate body 6 is fitted via an airtight fixing section 10 in front of the radiating body 7, and a space between them is sealed with a heat cooling medium liquid 11 to form a projecting CRT device. In this case, the airtight fixing section 20 is formed with a pre-airtight fixing section 21 and a main airtight fixing section 22, first the pre-airtight fixing section 21 is coated with an adhesive agent having relatively high viscosity, the annular radiating body 7 is fitted to the pre-airtight fixing section 21, which is heated and hardened, then an adhesive agent having relatively low viscosity is injected into the main airtight fixing section 22 to fix it. Accordingly, reliable liquid-tightness with no disper sion can be obtained and reliability can be improved.
摘要翻译：目的：通过在漏斗外表面和环形辐射体之间的气密固定部分设置预气密固定部分，加热硬化，防止液密性分散，然后将粘合剂注入主气密性固定部分。构成：通过气密固定部分20安装环形辐射体7以围绕漏斗3的外表面，通过在辐射体7前方的气密固定部分10安装透明板体6，并且它们之间的空间用热的冷却介质液体11密封，以形成投影的CRT装置。在这种情况下，气密固定部分20形成有预气密固定部分21和主气密固定部分22，首先，预密封固定部分21涂覆有具有较高粘度的粘合剂，环形辐射体 7被安装到预密封固定部21上，其被加热和硬化，然后将具有相对低粘度的粘合剂注入主气密固定部22中以将其固定。因此，可以获得不分散的可靠的液密性，可以提高可靠性。

4. 发明专利

JP2006317403A Burn-in method and burn-in apparatus 审中-公开
标题翻译：烧焦方法和烧结装置
公开(公告)号：JP2006317403A
公开(公告)日：2006-11-24
申请号：JP2005142887
申请日：2005-05-16
申请人： Toshiba Corp , Toshiba Lsi Package Solutions Corp , 東芝Lsiパッケージソリューション株式会社 , 株式会社東芝
发明人： SATO TAKEO
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide a burn-in method and a burn-in apparatus for improving working efficiency and energy efficiency. SOLUTION: The burn-in method comprises a process that is provided corresponding to each of a plurality of devices on a burn-in board and performs the heat transfer contact of a plurality of members connected mutually by a flexible heat-conducting material to the plurality of devices; and a process for controlling the temperature of the plurality of members collectively. Additionally, the burn-in apparatus comprises the plurality of members capable of performing heat transfer contact with the plurality of devices on the burn-in board; and the flexible heat-conducting material for connecting the plurality of members. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于提高工作效率和能量效率的老化方法和老化装置。解决方案：老化方法包括与老化板上的多个器件中的每一个相对应地设置的处理，并且通过柔性导热材料进行相互连接的多个部件的传热接触到多个设备; 以及共同控制多个部件的温度的处理。此外，老化装置包括能够与老化板上的多个装置进行传热接触的多个部件; 以及用于连接多个构件的柔性导热材料。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JPH0729862A METHOD AND APPARATUS FOR GRINDING 失效
公开(公告)号：JPH0729862A
公开(公告)日：1995-01-31
申请号：JP17133293
申请日：1993-07-12
申请人： TOSHIBA CORP
发明人： SATO TAKEO , KAWAI KAORU
IPC分类号： H01L21/304 , H01L21/677 , H01L21/68 , H01L21/683
摘要： PURPOSE:To make the thickness of a semiconductor chip sharply thin, to enhance the production efficiency and to lower the production cost of the semiconductor device. CONSTITUTION:In a freezing and holding part 34, a fixation device 47 which is composed of a cooling plate, a chuck plate and the like is installed under a transport passage 21, a pressurization mechanism 48 which pressurizes a good chip 20 mounted on a protected tape 23 to the chuck plate is installed on one side of the transport passage 21, and a grinding means 49 is installed on the other side of the transport passage 21. In a cleaning and drying part 35, a second cleaning nozzle and a drier are installed at the upper part of a second transfer stand 59. In a chip takeout part 36, a third X-Y table 63 on which a second wafer ring 64 holding the ground good chip 20 has been placed is installed on one side of the transport passage 21, and a fourth X-Y table 65 on which a second transfer head provided with a second suction nozzle has been installed is installed on the other side of the transport passage 21. Consequently, the thickness of a semiconductor chip can be made sharply thin.

6. 发明专利

JPH06224234A MOUNT CURE METHOD AND ITS DEVICE 失效
公开(公告)号：JPH06224234A
公开(公告)日：1994-08-12
申请号：JP1059393
申请日：1993-01-26
申请人： TOSHIBA CORP
发明人： SATO TAKEO
IPC分类号： H01L21/52
摘要： PURPOSE:To provide a mount cure method easy of in-line promotion at low cost and a mount cure device for executing its method. CONSTITUTION:At the center of a cure furnace 11 are a plurality of heat blocks 13 arranged at equal intervals in circular shape on a block holder 14, and are lead frame holding mechanisms 18 arranged, which hold and turns lead frames 17 so as to oppose each heat block 13. In the first place, the lead frame 17 is supplied to the position A by a carry claw 19, and is cured by an opposite heat block 13, and then is turned and shifted to the adjacent position B and is cured there, and then is turned in order clockwise and 1 cured similarly, and when it reaches the position A again, the lead frame 17 is discharged by the carry claw 19.

7. 发明专利

JPH0689918A WIRE BONDING DEVICE 失效
公开(公告)号：JPH0689918A
公开(公告)日：1994-03-29
申请号：JP23852992
申请日：1992-09-07
申请人： TOSHIBA CORP
发明人： SATO TAKEO , YAMAZAKI MITSUHARU
IPC分类号： H01L21/60 , G06T1/00 , G06F15/62
摘要： PURPOSE:To distinctly form an impress even on a relatively hard material, such as the lead frame, etc., and, at the same time, to automate the offset correcting work. CONSTITUTION:This the device is provided with a wire bonding tool 14, transducer horn 15, and control section 21 which controls them and incorporates a date memory for storing parameters for controlling ordinary bonding operations and parameters used for controlling dummy bonding operations for forming impress on the surfaces to be bonded.

8. 发明专利

JPH0621163A ULTRASONIC HORN FOR WIRE BONDER 失效
公开(公告)号：JPH0621163A
公开(公告)日：1994-01-28
申请号：JP17821692
申请日：1992-07-06
申请人： TOSHIBA CORP
发明人： SATO TAKEO
IPC分类号： H01L21/607 , H01L21/60
摘要： PURPOSE:To provide an ultrasonic horn for wire bonder which can be mounted easily without requiring any complex adjustment and at the same time with stable ultrasonic vibration characteristics. CONSTITUTION:An ultrasonic horn at least consists of a horn part with a flange part 3 and a holder 8. The flange 3 is provided with a guide surface 9 in diameter direction guided in diameter direction, a guide surface 10 in axial direction guided in axial direction, and a guide surface 11 in rotary direction guided in rotary direction. A horn part 2 with the flange 3 formed in this shape is fixed to a plurality of mounting holes 12 of the holder 8 with a bolt 14, etc., by fitting the flange 3 into a pin 13 which is provided at the holder 8 by matching a guide surface 11 in rotary direction.

9. 发明专利

JPH0193134A LEAD FRAME STAY DEVICE 失效
公开(公告)号：JPH0193134A
公开(公告)日：1989-04-12
申请号：JP25097987
申请日：1987-10-05
申请人： TOSHIBA CORP , TOSHIBA MICRO CUMPUTER ENG
发明人： SATO TAKEO , HASHIMOTO KENJI
IPC分类号： H01L21/60
摘要： PURPOSE:To facilitate the fixing and removal of a stay for cutting down the replacement time thereof by a method wherein, while abutting a lead frame stay against abutting surfaces of frame stay fixture, the stay is aligned through the intermediary of this guide parts and then the stay vacuum sucked is fixed on the fixture. CONSTITUTION:A lead frame stay fixture 4 vertically movable is formed into a flat U-shape frame while both end upper surfaces of a lead frame stay 6 are abutted against the lower surface of both ends of the frame to present abutting surfaces 7 rectangular and recessed to fix the stay 6. Simultaneously, guide parts 8 abutting against the outer periphery of the stay 6 are formed on the step parts of respective abutting surfaces. Furthermore, suction holes 9 are made inside the fixture 4; opening ends are connected to a vacuum suction source not shown in figures; the stay 6 is fixed to the fixture 4 through the intermediary of the other suction holes 10 and the suction grooves 9; and then fixture 4 in this state is lowered to fix a frame 1 on a heat block 3.

10. 发明专利

JPS6386528A DIE-BONDING DEVICE 失效
公开(公告)号：JPS6386528A
公开(公告)日：1988-04-16
申请号：JP23230886
申请日：1986-09-30
申请人： TOSHIBA CORP
发明人： SATO TAKEO
IPC分类号： H01L21/52
摘要： PURPOSE:To form the die-bonding device on which an inspection and the change in conditions based on the inspection can be performed easily by a method wherein the relative position between the semiconductor element and a substrate, directly after performance of die-bonding, is recognized, the reference position stored in a memory part in advance and the allowable value of positional deviation are compared with each other, and an appropriate correction is performed. CONSTITUTION:The position of the substrate 7 mounted on a carrier 8 is recognized by a television camera 10, said position is compared with the reference value A stored in a memory part 43, and the amount of deviation of the substrate 7 is worked out. The signal for correction of the substrate position is outputted from a control part 50, the position is corrected, and a die-bonding is performed. Pertaining to the substrate and the semiconductor element for which the die-bonding operation is completed, the position of bonding is recognized again by the television camera 11 and a recognition part 40. The result obtained is compared with the positional deviation value stored in the memory part. When said position is in the prescribed control limits, the correction value for a mechanical working part is outputted so that the amount of deviation will be brought to the minimum. Also, when the amount of deviation exceeds the control limits, a warning is given to the operator, and the device is stopped immediately.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式