专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2005303057A Rotary blade replacement time determining method and cutting apparatus 有权
标题翻译：旋转叶片更换时间确定方法和切割装置
公开(公告)号：JP2005303057A
公开(公告)日：2005-10-27
申请号：JP2004117924
申请日：2004-04-13
申请人： Sodick Co Ltd , Towa Corp , Towa株式会社 , 株式会社ソディック
发明人： ARAYA ICHIRO , HASEGAWA TARO , KAWADA SHUICHI , HIRATA SHIGERU , KAWAMURA KOICHI
IPC分类号： B26D7/28 , B23Q17/09 , B23Q17/24 , B24B27/06 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a rotary blade replacement time determining method wherein a time for rotary blade replacement is determined easily and accurately, and wherein processing efficiency is prevented from degradation as much as possible; and to provide a cutting apparatus. SOLUTION: A standard value to serve as a guide is set for replacement time determination. When the rotary blade length usable for cutting is longer than the total processable length of the object of cutting, blade abrasion loss data are obtained by directly and actually measuring the loss every time an object for cutting is cut or a prescribed number of lines have been cut. When the rotary blade length usable for cutting is not longer than the total processable length of an object of cutting, abrasion loss data are obtained by setting a measured usable length and abrasion loss rate, and then revising and resetting the measured usable length every time a measurement is made. The standard value for determination is reset by calculating a new usable length for every measurement based on the abrasion loss data. Upon arriving of the usable length at the standard value for determination, cutting is stopped for rotary blade replacement. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种旋转刀片更换时间确定方法，其中容易且精确地确定旋转叶片更换的时间，并且尽可能地防止处理效率的劣化; 并提供切割装置。
解决方案：设置更换时间确定的标准值作为指导。当可切割的旋转刀片长度长于切割对象的总可加工长度时，刀片磨耗损失数据是通过直接地并且实际上测量每次切割物体的损失或者规定数量的线切。当可切割的旋转刀片长度不超过切割对象的总可加工长度时，通过设定测量的可用长度和磨损损失率来获得磨损量数据，然后每次修改和重置测量的可用长度进行测量。通过基于磨损损失数据计算每次测量的新的可用长度来重置用于确定的标准值。当达到用于确定的标准值的可用长度时，停止旋转刀片更换的切割。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005279859A Machining apparatus 审中-公开
标题翻译：加工设备
公开(公告)号：JP2005279859A
公开(公告)日：2005-10-13
申请号：JP2004098081
申请日：2004-03-30
申请人： Sodick Co Ltd , Towa Corp , Towa株式会社 , 株式会社ソディック
发明人： ARAYA ICHIRO , KAWADA SHUICHI , KAWAMURA KOICHI , IWATA YASUHIRO
IPC分类号： B23Q3/08 , B23Q1/00
摘要： PROBLEM TO BE SOLVED: To provide a machining apparatus which is excellent in positional accuracy and workability, and has a turntable having a relatively small space necessary for piping.
SOLUTION: A vacuum chuck 5 is provided on the upper surface of the turntable 1. The vacuum chuck 5 has a plurality of suction openings 6. A plurality of fixed pipes 7 are vertically attached to the lower surface of the turntable 1. A flexible hose 8 is connected to the lower end of the fixed pipe 7 by means of a joint 9. A relay fitting 10 is fixed to a cylindrical cover for covering a shaft. The flexible hose 8 is bound by means of the relay fitting 10 so as to be in parallel with the arrangement of a plurality of joints 9, and is laid so as to be in parallel with each other with a small clearance. Further, the flexible hose 8 is provided so as to be small by means of the relay fitting 10 as far as the looseness exists when the turntable 1 has turned to a maximum.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种位置精度和加工性优异的加工装置，具有管路所需空间相对较小的转盘。解决方案：在转台1的上表面上设置真空吸盘5.真空吸盘5具有多个吸入口6.多个固定管7垂直地安装在转台1的下表面上。柔性软管8通过接头9连接到固定管7的下端。继电器配件10固定到用于覆盖轴的圆柱形盖。柔性软管8借助于继电器配件10与多个接头9的布置平行，并且以小的间隙相互平行放置。此外，柔性软管8通过继电器配件10设置得很小，只要转盘1转到最大时就存在松动。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2004207424A Cutting-off method and equipment of substrate 审中-公开
公开(公告)号：JP2004207424A
公开(公告)日：2004-07-22
申请号：JP2002373606
申请日：2002-12-25
申请人： Towa Corp , Towa株式会社
发明人： KAWAMURA KOICHI , IWATA YASUHIRO , HARADA AKIYUKI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To improve productivity of preparations by enabling effective production of a package 2 (preparations) when a fabricated substrate 1 is cut off and each package 2 is separated and formed by using cut-off equipment of a substrate. SOLUTION: Firstly, the fabricated substrate 1 is transferred to a platform 14 installed in the cutting-off equipment and sucked and fixed. In the state that the substrate 1 is sucked and fixed, the cleavage site 9 of the substrate 1 is cut by using a shearing blade 17. Each package 2 is separated and formed from the substrate 1. Secondly, each of the packages 2 cut from the substrate 1 is sucked and engaged by using transport mechanism G installed in the cutting-off equipment. In the state that each of the packages 2 is sucked and engaged, steam is jetted against each of the packages 2, thereby cleaning it. Pressure-feeding of the air is performed to the cleaned package 2, thereby drying it. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2005161473A Substance removing device and substance removing method 审中-公开
标题翻译：物质去除装置和物质移除方法
公开(公告)号：JP2005161473A
公开(公告)日：2005-06-23
申请号：JP2003404211
申请日：2003-12-03
申请人： Towa Corp , Towa株式会社
发明人： TAKEHARA KATSUNAO , KAWAMURA KOICHI
IPC分类号： B24C3/12 , B24C5/02
摘要： PROBLEM TO BE SOLVED: To provide a substance removing device and a substance removing method for removing a sticking object of a base board, without causing deformation, residual stress, influence by heat and a flaw, in the base board, by enhancing polishing efficiency of the base board for an electronic part.
SOLUTION: This device polishes a surface 3 of the base board by using high pressure water 6 including abrasive grains for enhancing flatness of the base board 2 for the electronic part. The device has an injection part 5 autorotating while injecting the high pressure water including the abrasive grains into the surface of the base board from a plurality of nozzles, and rotary shafts 4 and 7 for relatively moving the base board 2 and the injection part so that the injection part draws a predetermined locus to the base board. An area contacting with the high pressure water just after being injected from the nozzles in the surface, includes a desired area as a polishing object. Thus, since the abrasive grains in the high pressure water polish the surface, the polishing efficiency is enhanced by dispensing with dressing when using a polishing tool. Since the high pressure water performs cooling and discharge of polishing chips, the occurrence of deformation of the base board is prevented.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种物质去除装置和物质除去方法，用于通过增强基板中的基板的去除基板的粘着物体而不引起变形，残余应力，热和缺陷的影响用于电子部件的基板的抛光效率。解决方案：该装置通过使用包括磨粒的高压水6对基板的表面3进行抛光，以增强用于电子部件的基板2的平整度。该设备具有注射部分5，其自动喷射，同时从多个喷嘴将包括磨粒的高压水注入基板的表面，以及用于相对移动基板2和喷射部分的旋转轴4和7，使得注射部分将预定的轨迹绘制到基板。在从表面喷嘴注入刚刚与高压水接触的区域中，包括作为抛光对象的所需区域。因此，由于高压水中的磨料颗粒抛光表面，所以当使用抛光工具时，通过分配敷料来提高抛光效率。由于高压水进行研磨用芯片的冷却和排出，因此能够防止基板的变形。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004347876A Holding mechanism and method of columnar body 审中-公开
公开(公告)号：JP2004347876A
公开(公告)日：2004-12-09
申请号：JP2003145094
申请日：2003-05-22
申请人： Towa Corp , Towa株式会社
发明人： KAWAMURA KOICHI , UEYAMA YASUYUKI
IPC分类号： G02B7/02 , H04N5/225 , H04N5/335
摘要： PROBLEM TO BE SOLVED: To provide a holding mechanism and method capable of sucking and holding a columnar body even when the end surface which is the part to be sucked of the columnar body having a through-hole has a small area.
SOLUTION: The suction mechanism 14 is provided with a suction surface 16 disposed oppositely to the end surface 11 of a lens holder 1 (the columnar body having a through-hole), a sucking port 17 disposed on the suction surface 16 so as to contain the through-hole 3 in the case of plain view, a protrusion part 19 which is disposed on the inner side of the sucking port 17 and is protruded from the suction surface 16 so as to contain one part of the through-hole 3 in the case of plain view, a top end part 22 which contains the top end part of the protrusion part 19 and has a hardness lower than that of a base part 23 and a suction path 18 disposed in communication with the sucking port 17. Therefore, the suction is performed via the suction path 18 in the state in which one part of the end surface 11 is bonded on the suction surface 16 and the through-hole 3 is closed in the middle by the deformed top end part 22. Thereby, the area contributing to sucking is increased and the lens holder 1 is sucked without causing leakage.
COPYRIGHT: (C)2005,JPO&NCIPI

6. 发明专利

JP2004330417A Board cutting method, board cutting device and board sucking and fixing mechanism 审中-公开
公开(公告)号：JP2004330417A
公开(公告)日：2004-11-25
申请号：JP2003124799
申请日：2003-04-30
申请人： Towa Corp , Towa株式会社
发明人： KAWAMURA KOICHI
IPC分类号： B23Q3/08 , B28D5/00 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a board cutting method capable of efficiently cutting a sealed board 1 in such a state that the sealed board 1 is certainly sucked and fixed in the suction part 15 of a board sucking and fixing mechanism 10 corresponding to the sealed board 1 of every kind and capable of accurately cutting the sealed board 1 in a state that the cutting precision of the sealed board 1 is held, and a board cutting device and the board sucking and fixing mechanism. SOLUTION: The sealed board 1, which is obtained by collectively molding a plurality of electronic parts mounted on a circuit board 2, is sucked and fixed to the suction part 15 of the board sucking and fixing mechanism 10 formed by combining a soft member 20 and a hard member 21 and cut along the cutting region 4 of the sealed board 1 by a cutting blade 14 to form individual packages 5. COPYRIGHT: (C)2005,JPO&NCIPI

7. 发明专利

JP2003209071A JIG FOR CUTTING RESIN SEALED SUBSTRATE 审中-公开
公开(公告)号：JP2003209071A
公开(公告)日：2003-07-25
申请号：JP2002006295
申请日：2002-01-15
申请人： TOWA CORP
发明人： TASUMI YASUYUKI , KAWAMURA KOICHI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a fig for cutting a resin sealed substrate in the process of forming a package while preventing the package from chipping. SOLUTION: The jig 8 has a nest 6 as a part which includes latticed side walls 9, outer framed 16 which stand at the outmost of the side walls 9, a housing 10 of a quadrilateral space surrounded by each side wall 9 or the side walls 9 and the outer frames 16 for housing the package 23, holding walls 17 which are parts of the side walls and retreated from them, shelves 18 at the base of the holding walls 17 for catching the package 23, and an elastic member 19 made of an elastic material and placed on the outer frame 16. By this jig, unnecessary part 22 of the resin sealed substrate 1 is held by the elastic member 19 when the end of the substrate 1 is cut down by a blade 21. This protects the unnecessary part 22 from breaking down before the completion of cutting and prevents defects such as chipping of the package 23 from occurring. COPYRIGHT: (C)2003,JPO

8. 发明专利

JP2003207455A TOOL FOR RETAINING PACKAGE 审中-公开
公开(公告)号：JP2003207455A
公开(公告)日：2003-07-25
申请号：JP2002006294
申请日：2002-01-15
申请人： TOWA CORP
发明人： KURATO MASAKAZU , KAWAMURA KOICHI
IPC分类号： G01R31/26 , G01N21/84
摘要： PROBLEM TO BE SOLVED: To prevent the misrecognition of an inspecting apparatus due to the reflection of illumination light in a retaining tool used for inspecting a cut package. SOLUTION: A nest 6 that is a tool for retaining a package has an outer frame 15 that is located at the outermost side in a sidewall 7, an accommodation section 8 that is a rectangular space surrounded by the sidewalls 7 or the sidewall 7 and the outer frame 15 and accommodates a package 19, a retention wall 16 that is one portion of the sidewall 7 while the wall surface has retreated, and a shelf section 17 that is provided at the root of the retention wall 16 and locks the package 19. The reflection factor of light is small on the upper surface of at least the retention wall 16, thus inhibiting the reflection of illumination light when inspecting the package on the upper surface of the retention wall 16 and hence reducing the misrecognition of the inspection apparatus caused by reflection light that is reflected from the upper surface of the retention wall. COPYRIGHT: (C)2003,JPO

9. 发明专利

JP2000216316A METHOD AND DEVICE FOR SUPPLY/TRANSFER OF LEAD FRAME 失效
公开(公告)号：JP2000216316A
公开(公告)日：2000-08-04
申请号：JP1398799
申请日：1999-01-22
申请人： TOWA CORP
发明人： TAKASHIMA FUMIO , KAWAMURA KOICHI , HAYASHI MASAYA
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To safely and easily replace a maintenance inspection/lead working die by providing a lead frame supply/transfer device at a front position in the working of a lead work device. SOLUTION: A lead frame supply/transfer device is provided at the front position in working of a lead work part 2 of a lead work device, and a clamp mechanism 62 of the lead frame supply/transfer device is reciprocated in the supply/transfer direction of a lead frame(L/F), so that the lead frame(L/F) clamped to the clamp mechanism 62 is sequentially supplied/transferred to the specified position of a lead working die 5 (52) for each specified pitch interval.

10. 发明专利

JP2000164781A PROCESSING METHOD AND DEVICE FOR LEAD FRAME 失效
公开(公告)号：JP2000164781A
公开(公告)日：2000-06-16
申请号：JP34087698
申请日：1998-12-01
申请人： TOWA CORP
发明人： BANDO KAZUHIKO , OSADA MICHIO , AMAKAWA TAKESHI , FURUSHIMA YOSHIHIKO , TAKASHIMA FUMIO , KAWAMURA KOICHI
IPC分类号： H01L23/50 , H01L21/00 , H01L21/50
摘要： PROBLEM TO BE SOLVED: To enable the pitch of presses (pitch of processing dies) to be automatically adjusted corresponding to the work pitch of the lead frames when lead frames are processed. SOLUTION: A screw shaft 53 is installed in a transfer direction of lead frames a non rotatably, and a nut member 54 linked to a processing press 42 is engaged with the screw shaft 53. The torque of a drive motor 51 is tranfered to the nut member 54 through the intermediary of a power transmission 55, so as to be adjusted and transmitted to the screw shaft 53, whereby a processing press 42 linked to the nut member 54 is adjusted and moved to adjust the pitch P of the processing presses 41 and 42.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式