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1. 发明专利

JP2007083363A Cutting device, and cutting method 有权
标题翻译：切割装置和切割方法
公开(公告)号：JP2007083363A
公开(公告)日：2007-04-05
申请号：JP2005276902
申请日：2005-09-22
申请人： Towa Corp , Towa株式会社
发明人： TAKEHARA KATSUNAO , YOSHIDA MASAHARU , KITAGAWA YASUYUKI , KISHIMOTO KAZUYUKI , KATO SEIJI
IPC分类号： B24C5/02 , B24C7/00 , B24C9/00
CPC分类号： Y02P70/179
摘要： PROBLEM TO BE SOLVED: To improve the abrasion of a nozzle, and improve operation rates in a cutting device. SOLUTION: This cutting device comprising abrasive grains is provided with a high pressure pump 2, a first tank 5 connected to the high pressure pump 2 through first inflow side water system piping 4, a first inflow side on/off valve 30, and a first tank on/off valve 33, a second tank 7 connected to the high pressure pump 2 through second inflow side water system piping 6, a second inflow side on/off valve 31, and a second tank on/off valve 36, first outflow side water system piping 8 and second outflow side water system piping 9 respectively connected to the first tank 5 and the second tank 7, first bypass piping 32 connecting the first inflow side water system piping 4 to the first outflow side water system piping 8 to bypass the first tank 5, second bypass piping 35 connecting the second inflow side water system piping 6 to the second outflow side water system piping 9 to bypass the second tank 7, and nozzle-system piping 10 and a nozzle 11 connected, in order, to the first outflow side water system piping 8 and the second outflow side water system piping 9. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了改善喷嘴的磨损，并提高切割装置的操作速度。解决方案：包括磨粒的切割装置设置有高压泵2，通过第一流入侧水系统管道4连接到高压泵2的第一罐5，第一流入侧开/关阀30，第一罐开/关阀33，通过第二流入侧水系配管6连接到高压泵2的第二罐7，第二流入侧开/关阀31和第二罐开/关阀36，分别连接到第一箱5和第二箱7的第一流出侧水系管路8和第二流出侧水系配管9，将第一流入侧水系配管4连接到第一流出侧水系配管8的第一旁通管32 绕过第一罐5，将第二流入侧水系配管6连接到第二流出侧水系配管9以绕过第二罐7的第二旁通管35，以及顺序连接的喷嘴系统管10和喷嘴11 ，到第一个outflo w侧水系管道8和第二流出侧水系配管9.版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2005190077A Processor and program supply method for processor 审中-公开
标题翻译：处理器的处理器和程序供应方法
公开(公告)号：JP2005190077A
公开(公告)日：2005-07-14
申请号：JP2003429260
申请日：2003-12-25
申请人： Towa Corp , Towa株式会社
发明人： TAKEHARA KATSUNAO , NAKAJIMA RYUJI , KURATO MASAKAZU
IPC分类号： G06F13/10 , G05B19/05 , G06F9/445 , G06F13/14
摘要： PROBLEM TO BE SOLVED: To solve the following problems: when additionally providing or detaching an additional unit in a processor having a basic unit, working man-hours are increased, and a working error is generated.
SOLUTION: A resin sealing device 1B wherein the additional units 4B, 4C, 4D are additionally provided to the basic unit 2 has: a control part 10; a program stored in the control part 10, controlling at least the basic unit 2; and a connector 19 connecting a computer 31 that is a supply source of the resin sealing device 1B and the control part 10 via an electric communication line 30. A new program corresponding to the additional provision of the additional units 4B, 4C, 4D is supplied to the control part 10 via the electric communication line 30 and the connector 19. The resin sealing device 1B has connectors 22-29 connecting electric wires between the basic unit 2 and the additional units 4B, 4C, 4D or between the additional units 4b, 4C, 4D, and the electric wires are connected when mechanically installing the additional units 4B, 4C, 4D.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：解决以下问题：当在具有基本单元的处理器中额外提供或分离附加单元时，增加工作工时，并产生工作错误。解决方案：附加单元4B，4C，4D另外设置到基本单元2的树脂密封装置1B具有：控制部10; 存储在控制部10中的程序，至少控制基本单元2; 以及连接器19，其通过电气通信线30连接作为树脂密封装置1B的供给源的计算机31和控制部10.与附加单元4B，4C，4D的附加设置相对应的新程序被提供通过电气通信线路30和连接器19到控制部分10.树脂密封装置1B具有连接器22-29，其连接基本单元2和附加单元4B，4C，4D之间或附加单元4b之间的电线， 4C，4D，并且在机械地安装附加单元4B，4C，4D时连接电线。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004172535A Method and apparatus for resin-molding electronic component 审中-公开
公开(公告)号：JP2004172535A
公开(公告)日：2004-06-17
申请号：JP2002339206
申请日：2002-11-22
申请人： Towa Corp , Towa株式会社
发明人： TAKEHARA KATSUNAO , AMAKAWA TAKESHI , FUKUTOMI MAKOTO , URAGAMI HIROSHI , FUJINO KINYA , NAKAGAWA TAKERU
IPC分类号： B29C43/18 , B29C43/32 , B29L31/34 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a method and apparatus for resin-molding an electronic component wherein the environmental wrong influence given by it is so reduced as to make possible an efficient environmental conservation and its size can be reduced.
SOLUTION: Firstly, there is used the apparatus for resin-molded electronic parts whereon a mold for resin-molded electronic parts which comprises a fixed mold 1 and a movable mold 2 is mounted. A board 3 mounted with an electronic part 4 is fed and set in a predetermined position of the molds 1/2. When closing the molds 1/2, the movable mold 2 is moved by the small-diameter piston of a moving mechanism B at a large stroke in a mold closing direction. Next, the moving mechanism B itself is changed into a large-diameter structure by fixing the small-diameter piston of the moving mechanism B with a fixing member C. Further, by pressing the moving/fixing mechanisms B/C of the large-diameter structure at a small stroke in the mold closing direction with a hydraulic-pressure-driven pressing mechanism D, the molds 1/2 are so closed with a predetermined mold closing pressure as to mold by a resin the electronic part 4 on the board 3.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2007083364A Cutting nozzle 审中-公开
标题翻译：切割喷嘴
公开(公告)号：JP2007083364A
公开(公告)日：2007-04-05
申请号：JP2005276903
申请日：2005-09-22
申请人： Towa Corp , Towa株式会社
发明人： TAKEHARA KATSUNAO , YOSHIDA MASAHARU , KITAGAWA YASUYUKI , KISHIMOTO KAZUYUKI , KATO SEIJI
IPC分类号： B24C5/04
摘要： PROBLEM TO BE SOLVED: To improve the operation rates of a cutting device by preventing clogging by abrasive grains in a cutting nozzle used for cutting a subject by using water including abrasive grains. SOLUTION: This cutting nozzle 11 is used for cutting a subject by jetting water including abrasive grains 42 under high pressure. It is provided with an injection port 59 to inject water including abrasive grains 42, and a small-diameter passage 58 connected to the injection port 59. Inner diameter D of the small-diameter passage 58 is twice the maximum diameter dmax in the standard related to the diameter (d) of the abrasive grains 42 or more. At least the inner wall of the small diameter passage 58 is composed of material including at least either of diamond, sapphire, and cubic crystal boron nitride. Length L of the small-diameter passage 58 is twice or more and 20 times or less the inner diameter D of the small-diameter passage 58. Space 58 connecting the passage 56 to the small-diameter passage 58 is gradually narrowed toward the small-diameter passage 58. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过使用包含磨粒的水来切割被检体的切割喷嘴中的磨粒阻止堵塞，提高切割装置的操作率。解决方案：该切割喷嘴11用于通过在高压下喷射包括磨粒42的水来切割被摄体。设有注入口59，用于注入含有磨料颗粒42的水和连接到喷射口59的小直径通道58.小直径通道58的内径D是标准相关的最大直径dmax的两倍达到磨粒42以上的直径（d）。至少小直径通道58的内壁由包括金刚石，蓝宝石和立方晶氮化硼中的至少一种的材料构成。小直径通道58的长度L是小直径通道58的内径D的两倍以上且20倍以下。将通道56连接到小直径通道58的空间58朝向小直径通道58逐渐变窄。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2004119816A Resin sealing/forming method and resin sealing/forming apparatus of electronic component 审中-公开
公开(公告)号：JP2004119816A
公开(公告)日：2004-04-15
申请号：JP2002283213
申请日：2002-09-27
申请人： Towa Corp , Towa株式会社
发明人： TAKEHARA KATSUNAO , URAGAMI HIROSHI , WATANABE SO , KAWAKUBO KAZUTERU
IPC分类号： B29C45/14 , B29C45/57 , B29L31/34 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a resin sealing method and a resin sealing apparatus of electronic components for efficiently preventing a resin burr from occurring on a chip non-fitting surface when injecting resin into a die cavity where a chip is fitted while covering the semiconductor chip non-fitting surface of a lead frame in which the semiconductor chip is fitted with a mold release film.
SOLUTION: The resin sealing/forming apparatus for the electronic components basically comprises: two-piece molds 1, 2, the mold release film 3, and a press uniformity mechanism 5. In a process for injecting a molten resin 16 into the die cavity 14 by using the two-piece molds 1, 2, the semiconductor chip non-fitting surface 4 is pressed by uniform pressure via the the mold release film 3. Additionally, the press uniformity mechanism 5 allows the semiconductor non-fitting surface 4 to be uniformly covered with the mold release film 3 without any clearance for adhesion, thus efficiently preventing the molten resin 16 from entering the portion between the semiconductor chip non-fitting surface 4 and the mold release film 3.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2005161473A Substance removing device and substance removing method 审中-公开
标题翻译：物质去除装置和物质移除方法
公开(公告)号：JP2005161473A
公开(公告)日：2005-06-23
申请号：JP2003404211
申请日：2003-12-03
申请人： Towa Corp , Towa株式会社
发明人： TAKEHARA KATSUNAO , KAWAMURA KOICHI
IPC分类号： B24C3/12 , B24C5/02
摘要： PROBLEM TO BE SOLVED: To provide a substance removing device and a substance removing method for removing a sticking object of a base board, without causing deformation, residual stress, influence by heat and a flaw, in the base board, by enhancing polishing efficiency of the base board for an electronic part.
SOLUTION: This device polishes a surface 3 of the base board by using high pressure water 6 including abrasive grains for enhancing flatness of the base board 2 for the electronic part. The device has an injection part 5 autorotating while injecting the high pressure water including the abrasive grains into the surface of the base board from a plurality of nozzles, and rotary shafts 4 and 7 for relatively moving the base board 2 and the injection part so that the injection part draws a predetermined locus to the base board. An area contacting with the high pressure water just after being injected from the nozzles in the surface, includes a desired area as a polishing object. Thus, since the abrasive grains in the high pressure water polish the surface, the polishing efficiency is enhanced by dispensing with dressing when using a polishing tool. Since the high pressure water performs cooling and discharge of polishing chips, the occurrence of deformation of the base board is prevented.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种物质去除装置和物质除去方法，用于通过增强基板中的基板的去除基板的粘着物体而不引起变形，残余应力，热和缺陷的影响用于电子部件的基板的抛光效率。解决方案：该装置通过使用包括磨粒的高压水6对基板的表面3进行抛光，以增强用于电子部件的基板2的平整度。该设备具有注射部分5，其自动喷射，同时从多个喷嘴将包括磨粒的高压水注入基板的表面，以及用于相对移动基板2和喷射部分的旋转轴4和7，使得注射部分将预定的轨迹绘制到基板。在从表面喷嘴注入刚刚与高压水接触的区域中，包括作为抛光对象的所需区域。因此，由于高压水中的磨料颗粒抛光表面，所以当使用抛光工具时，通过分配敷料来提高抛光效率。由于高压水进行研磨用芯片的冷却和排出，因此能够防止基板的变形。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2007083365A Cutting device 有权
标题翻译：切割装置
公开(公告)号：JP2007083365A
公开(公告)日：2007-04-05
申请号：JP2005276904
申请日：2005-09-22
申请人： Towa Corp , Towa株式会社
发明人： TAKEHARA KATSUNAO , YOSHIDA MASAHARU , KITAGAWA YASUYUKI , KISHIMOTO KAZUYUKI , KATO SEIJI
IPC分类号： B24C5/02
CPC分类号： B24C1/045 , B24C3/04
摘要： PROBLEM TO BE SOLVED: To dispense with replacement of a fixing base to fix a subject, and prevent abrasion of the fixing base in cutting the subject along mutually crossing cutting lines. SOLUTION: This cutting device is for cutting a subject 28 along the mutually crossing cutting lines 63 and 64 by injecting water including abrasive grains under high pressure. It is provided with the fixing base 66 for fixing the subject 28, groove parts 68X and 68Y provided at positions corresponding to and below the cutting lines 63 and 64 in the fixing base 66, projected parts 67 provided to get in contact with the subject 28 at other parts than the groove parts 68X and 68Y on the fixing base 66, base parts 69 provided to connect the projected parts 67 to each other almost in parallel to the cutting lines 64 extended in the Y-direction at the groove parts 68X and 68Y, a frame part 70 provided to connect the base parts 69 to each other at least in part of the outer circumference of the fixing base 67, and protective members 74 detachably provided to cover the base parts 69. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：不需要更换固定基座来固定物体，并且防止在相互交叉的切割线上切割物体时固定基座的磨损。解决方案：该切割装置用于通过在高压下注入包括磨粒的水来沿着相互交叉的切割线63和64切割被检体28。设置有用于固定被检体28的固定底座66，设置在固定基座66中的与切割线63和64相对应的位置处的凹槽部68X和68Y，设置成与被检体28接触的突出部67 在固定基座66上的凹槽部分68X和68Y的其他部分上，设置为将突出部分67彼此平行地连接到在凹槽部分68X和68Y处沿Y方向延伸的切割线64彼此平行的基部69 设置为将基部69彼此连接至固定基座67的外周的至少一部分的框架部70以及可拆卸地设置以覆盖基部69的保护构件74.权利要求（C） 2007年，日本特许厅和INPIT

8. 发明专利

JP2005028704A Mold for molding resin and resin molding method 有权
标题翻译：模具树脂模塑和树脂模塑方法
公开(公告)号：JP2005028704A
公开(公告)日：2005-02-03
申请号：JP2003195541
申请日：2003-07-11
申请人： Towa Corp , Towa株式会社
发明人： TAKEHARA KATSUNAO , URAGAMI HIROSHI , NAKAGAWA TAKERU , MIURA MUNEO , AMAKAWA TAKESHI
IPC分类号： B29C33/12 , B29C45/14 , B29C45/77
摘要： PROBLEM TO BE SOLVED: To provide a mold for molding a resin constituted so as to make the clamping pressure to a substrate proper and uniform even if the substrate is made large-sized and the irregularity of thickness or the like occurs in the substrate, and a resin molding method.
SOLUTION: The lower mold 1 of the mold for molding the resin is provided with an underside holder 3, two underside blocks 4 placed on the underside holder 3, the pot block 5 fitted in the through-hole of the underside holder 3 and the space between the underside blocks 4 and the pressure sensors 8 arranged between the underside holder 3 and the underside blocks 4. An upper side holder 11, the piezoelectric element 20 fixed to the recessed part 18 of the upper side holder 11 and the cavity block 12 fixed to the under surface of the piezoelectric element 20 are provided to the upper mold 2 opposed to the lower mold 1. The clamping forces applied to respective substrates 10L and 10R are detected by the pressure sensors 8. When the clamping pressures are less than a target value, voltage is applied to the piezoelectric element 20 to protrude an end surface and the back surface of the cavity block 12 is pressed by the end surface to set the clamping pressures to the target value.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种用于模制树脂的模具，其被构造成使得即使基板被制成大尺寸并且在厚度等的不规则性发生在衬底上的适当且均匀的夹持压力基板和树脂模制方法。解决方案：用于模制树脂的模具的下模具1设置有下侧支架3，放置在下侧支架3上的两个下侧块4，安装在下侧支架3的通孔中的罐块5 以及下侧挡块4和布置在下侧支架3和下侧挡块4之间的压力传感器8之间的空间。上侧支架11，固定在上侧支架11的凹部18上的压电元件20，固定到压电元件20的下表面的块体12设置在与下模具1相对的上模2上。施加到各个基板10L和10R的夹紧力由压力传感器8检测。当夹紧压力较小时电压被施加到压电元件20以突出端面，并且空腔12的后表面被端面按压以将夹紧压力设定为目标值。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2002067066A PRESSING METHOD, PRESSING MECHANISM AND RESIN MOLDING APPARATUS 失效
公开(公告)号：JP2002067066A
公开(公告)日：2002-03-05
申请号：JP2000260678
申请日：2000-08-30
申请人： TOWA CORP
发明人： HARADA AKIYUKI , TAKEHARA KATSUNAO
IPC分类号： B29C43/58 , B29C31/04 , B29C43/02 , B29C43/18 , B29C43/34 , B29C43/36 , B29C45/02 , B29C45/14 , B29L31/34 , B30B1/32 , F15B3/00 , F15B7/08 , F15B11/12
摘要： PROBLEM TO BE SOLVED: To provide a pressing mechanism which reduces nonuniformity on the occasion of pressing an object, prevents pollution due to a hydraulic fluid and also enables attainment of miniaturization. SOLUTION: The pressing mechanism is equipped with a hydraulic fluid source 2 wherein hydraulic fluid 1 is stored, a first sub-cylinder 4, a supply passage 3 making the hydraulic fluid source 2 and the first sub-cylinder 4 communicate with each other, a main cylinder 6 communicating with the hydraulic fluid source 2 through the intermediary of the supply passage 3 and a check valve 5, a main piston 18 provided inside the main cylinder 6, a discharge passage 7 making the main cylinder 6 and the hydraulic fluid source 2 communicate with each other, a supply control valve 22 and a discharge control valve 25 provided respectively for the supply passage 3 and the discharge passage 7, a first sub-piston 10 pressing the hydraulic fluid 1 in the first sub-cylinder 4, a pressing plate 11 pressing the first sub-piston 10, a second sub-cylinder 13, a second sub-piston 15 pressing the pressing plate 11 through the intermediary of the hydraulic fluid in the second sub-cylinder 13, and a first piezoelectric element 16 displacing the second sub-piston 15.

10. 发明专利

JP2002316112A CLEANING METHOD AND CLEANING APPARATUS 失效
公开(公告)号：JP2002316112A
公开(公告)日：2002-10-29
申请号：JP2001119806
申请日：2001-04-18
申请人： TOWA CORP
发明人： KITADA RYOJI , TAKEHARA KATSUNAO
IPC分类号： B08B7/00 , B29C33/72
摘要： PROBLEM TO BE SOLVED: To provide a cleaning method and a cleaning apparatus which can remove mold dirt attached to the surface of a matter to be cleaned sufficiently in a short period of time. SOLUTION: The cleaning apparatus for cleaning a die surface of a lower die 1 is provided with a light source 11 with an excimer lamp 7, a delivery pipe 12 to deliver gas containing oxygen into a space between the die 1 and the light source 11, and a cylinder 15 filled with pure oxygen(O2 ) connected to the pipe 12 through a feed pipe 13 and a solenoid valve 14. Excimer light 10 projected from the lamp 7 cuts off a chemical bond such as mold dirt 5 attached to a die surface, thereby decomposing a part of the bond into carbon 17 and hydrogen (not shown), or the part of the bond is absorbed by oxygen molecules 18 and decomposed into active oxygen atoms(O*) 19 and ozone(O3 ) 20. As a result, the carbon 17 and hydrogen react with the oxygen atoms 19 to produce CO2 and H2 O, which are volatilized to remove the dirt 5.

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