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1. 发明专利

JP2000164781A PROCESSING METHOD AND DEVICE FOR LEAD FRAME 失效
公开(公告)号：JP2000164781A
公开(公告)日：2000-06-16
申请号：JP34087698
申请日：1998-12-01
申请人： TOWA CORP
发明人： BANDO KAZUHIKO , OSADA MICHIO , AMAKAWA TAKESHI , FURUSHIMA YOSHIHIKO , TAKASHIMA FUMIO , KAWAMURA KOICHI
IPC分类号： H01L23/50 , H01L21/00 , H01L21/50
摘要： PROBLEM TO BE SOLVED: To enable the pitch of presses (pitch of processing dies) to be automatically adjusted corresponding to the work pitch of the lead frames when lead frames are processed. SOLUTION: A screw shaft 53 is installed in a transfer direction of lead frames a non rotatably, and a nut member 54 linked to a processing press 42 is engaged with the screw shaft 53. The torque of a drive motor 51 is tranfered to the nut member 54 through the intermediary of a power transmission 55, so as to be adjusted and transmitted to the screw shaft 53, whereby a processing press 42 linked to the nut member 54 is adjusted and moved to adjust the pitch P of the processing presses 41 and 42.

2. 发明专利

JP2004130590A Mold for molding resin and resin molding method 有权
公开(公告)号：JP2004130590A
公开(公告)日：2004-04-30
申请号：JP2002295811
申请日：2002-10-09
申请人： Towa Corp , Towa株式会社
发明人： OKADA MASATOSHI , FURUSHIMA YOSHIHIKO
IPC分类号： B29C33/14 , B29C45/14 , B29C45/26
摘要： PROBLEM TO BE SOLVED: To provide a mold for molding a resin by uniformly pressing a movable block, which is supported in a floating state and has an insert part placed thereon, to stably slide the same, and a resin molding method.
SOLUTION: The mold for molding the resin is equipped with a lower mold 1 and an upper mold 2 both of which are opposed to each other, the recessed part 3 provided to the lower mold 1, the coned disc spring 4 provided to the recessed part 3, the movable block 5 supported by the coned disc spring 4 and provided so as to be freely slid vertically, the movable pin 6 fitted in the through-hole provided to the bottom surface of the recessed part 3 in a freely liftable manner and the ejector pin 7 provided to the through-hole of the lower mold 1. A substrate 8 (insert part) having chiips mounted thereon is placed on the movable block 5 to start mold clamping. When the lower and upper molds 1 and 2 are opened, the movable block 5 is pressed by the coned disk spring 4 and the movable pin 6 even if there is irregularity in the characteristics of the coned disk spring 4. Accordingly, the movable block 5 slides stably to be returned to an initial position.
COPYRIGHT: (C)2004,JPO

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