专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2004235411A Bonding method and apparatus for electronic parts 审中-公开
公开(公告)号：JP2004235411A
公开(公告)日：2004-08-19
申请号：JP2003021899
申请日：2003-01-30
申请人： Towa Corp , Towa株式会社
发明人： HARADA AKIYUKI , TAKASHIMA FUMIO , NITTA KAZUNORI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a bonding method for electronic parts and apparatus therefor capable of effectively solving problems upon pressure welding, by effectively pressurizing the top surfaces of electronic parts individually with uniform pressure without forming any gap by using an electronic parts pressure-welding means to a substrate to include a plurality of semiconductor chips being the electronic parts at a predetermined position.
SOLUTION: The bonding apparatus for electronic parts includes the electronic parts pressure-welding means 1 composed of a pressing mechanism 3 and a pressurizing/equalizing mechanism 4. Further, a plurality of the semiconductor chips 2 and the substrate 5 are effectively pressure-welded by using the pressure-welding means 1 in the state where the top surfaces of the plurality of the semiconductor chips 2 are pressed corresponding to the heights thereof, and the top surfaces of the plurality of the semiconductor chips 2 can be pressurized uniformly, effectively, and individually without causing the gap with the aid of the pressurizing means 1, thereby, the problems upon the pressurization of the plurality of the chips 2 and the substrate 5 can be solved effectively.
COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2000216317A METHOD AND DEVICE FOR SUPPLY/TRANSFER OF LEAD FRAME 失效
公开(公告)号：JP2000216317A
公开(公告)日：2000-08-04
申请号：JP1406099
申请日：1999-01-22
申请人： TOWA CORP
发明人： TAKASHIMA FUMIO , KAWAMURA KOICHI , YAMADA MASAHIKO , HAYASHI MASAYA
IPC分类号： B65G43/08 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To allow a highly accurate positioning (finding top part), when a lead frame L/F is supplied/transferred to a lead working part side. SOLUTION: A position detecting means 11 detects a lead frame front end part for temporarily stopping supply/transfer in a process, where a lead frame L/F is supplied/transferred to the side of a lead working part 2 by a supply/ transfer means 10, as preliminary positioning. The lead frame is supplied/ transferred to the side of lead working part 2 again by the supply/transfer means 10, while the front end position of the lead frame is redetected by the other position detecting means 12 to stop the lead frame at a specified position of the lead working part 2, as a second positioning. With this two-stage positioning control, the front end part of the lead frame is positioned with high accuracy. The lead frame is supplied/transferred by a prescribed set transfer distance by a servo motor 10c rotated by a detection signal 12a of the other position detecting means 12.

3. 发明专利

JP2000216316A METHOD AND DEVICE FOR SUPPLY/TRANSFER OF LEAD FRAME 失效
公开(公告)号：JP2000216316A
公开(公告)日：2000-08-04
申请号：JP1398799
申请日：1999-01-22
申请人： TOWA CORP
发明人： TAKASHIMA FUMIO , KAWAMURA KOICHI , HAYASHI MASAYA
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To safely and easily replace a maintenance inspection/lead working die by providing a lead frame supply/transfer device at a front position in the working of a lead work device. SOLUTION: A lead frame supply/transfer device is provided at the front position in working of a lead work part 2 of a lead work device, and a clamp mechanism 62 of the lead frame supply/transfer device is reciprocated in the supply/transfer direction of a lead frame(L/F), so that the lead frame(L/F) clamped to the clamp mechanism 62 is sequentially supplied/transferred to the specified position of a lead working die 5 (52) for each specified pitch interval.

4. 发明专利

JP2000164781A PROCESSING METHOD AND DEVICE FOR LEAD FRAME 失效
公开(公告)号：JP2000164781A
公开(公告)日：2000-06-16
申请号：JP34087698
申请日：1998-12-01
申请人： TOWA CORP
发明人： BANDO KAZUHIKO , OSADA MICHIO , AMAKAWA TAKESHI , FURUSHIMA YOSHIHIKO , TAKASHIMA FUMIO , KAWAMURA KOICHI
IPC分类号： H01L23/50 , H01L21/00 , H01L21/50
摘要： PROBLEM TO BE SOLVED: To enable the pitch of presses (pitch of processing dies) to be automatically adjusted corresponding to the work pitch of the lead frames when lead frames are processed. SOLUTION: A screw shaft 53 is installed in a transfer direction of lead frames a non rotatably, and a nut member 54 linked to a processing press 42 is engaged with the screw shaft 53. The torque of a drive motor 51 is tranfered to the nut member 54 through the intermediary of a power transmission 55, so as to be adjusted and transmitted to the screw shaft 53, whereby a processing press 42 linked to the nut member 54 is adjusted and moved to adjust the pitch P of the processing presses 41 and 42.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式