专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2011165413A Electric connector and its manufacturing method 审中-公开
标题翻译：电连接器及其制造方法
公开(公告)号：JP2011165413A
公开(公告)日：2011-08-25
申请号：JP2010024952
申请日：2010-02-08
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： IHARA YOSHIHIRO
IPC分类号： H01R33/76 , H01R43/16
摘要： PROBLEM TO BE SOLVED: To provide an electric connector easily coping with narrowed pitching of an electrode terminal and manufactured in a simple method. SOLUTION: The electric connector 3 is provided with: an insulation sheet 2; and a plurality of spring electrodes 10 locked to the insulation sheet 2. Each spring electrode 10 includes: a spring part 12 protruded to a slant upward direction from an upper surface of the insulation sheet 2 and with a contact part 12c fitted at its end; and a folded connection part 11 connected to the spring part 12 inserted into an opening 2a of the insulation sheet 2 and folded and fixed on the underside of the insulation sheet 2. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种电连接器，其容易应对电极端子的变窄的俯仰并以简单的方法制造。电连接器3设置有：绝缘片2; 多个弹簧电极10被锁定在绝缘片2上。每个弹簧电极10包括：弹簧部分12，其从绝缘片2的上表面向斜上方突出，并且在其端部安装有接触部分12c; 以及连接到插入绝缘片2的开口2a中并折叠并固定在绝缘片2的下侧上的弹簧部分12的折叠连接部分11.版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2011054486A Wound-shape spring member, socket for semiconductor package, and method of manufacturing the same 有权
标题翻译：绕线弹簧构件，半导体封装用插座及其制造方法
公开(公告)号：JP2011054486A
公开(公告)日：2011-03-17
申请号：JP2009203885
申请日：2009-09-03
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： OI ATSUSHI , TANAKA MASATO , IHARA YOSHIHIRO , MOCHIZUKI KENJI
IPC分类号： H01R13/24 , H01R33/76 , H01R43/18
摘要： PROBLEM TO BE SOLVED: To provide a spring with high performance, a thinned and downsized semiconductor package with high efficiency, and further, to improve productivity of the spring with high performance and its applied products. SOLUTION: Two end parts 31, 32 of a wound-shape spring member 20 are positioned at a central part of the wound shape, and there is no overlapping area of the wound-shape spring member 20 having two end parts 31, 32 when viewed from the spring in its expanding direction. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供高性能的弹簧，具有高效率的薄型和小型化半导体封装，并且进一步提高具有高性能的弹簧的生产率及其应用产品。解决方案：缠绕形弹簧构件20的两个端部31,32位于缠绕形状的中心部分，并且没有具有两个端部31的缠绕形弹簧构件20的重叠区域，当从弹簧向其膨胀方向观察时。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2011014451A Board having connection terminal 有权
标题翻译：具有连接端子的板
公开(公告)号：JP2011014451A
公开(公告)日：2011-01-20
申请号：JP2009158994
申请日：2009-07-03
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： IHARA YOSHIHIRO
IPC分类号： H01R12/79 , H01L23/12 , H01R12/53 , H01R12/71 , H01R12/78 , H01R24/00
CPC分类号： H01L24/90 , G01R1/07307 , H01L24/13 , H01L24/16 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K1/141 , H05K3/325 , H05K3/4015 , H05K2201/0311 , H05K2201/10378 , Y10T29/49204 , Y10T29/49222
摘要： PROBLEM TO BE SOLVED: To provide a board having a connection terminal which can maintain a constant interval between one end part of the connection terminal and the board.SOLUTION: The board with a connection terminal includes a board body; a first conductor arranged on a first surface of the board body; a conductive connection terminal, which has a spring property, and of which one end part is fixed to the first conductor, and another end part is connected to an object to be connected, which is arranged opposite to the first surface of the board body; and a projection part, which is formed on the one end part of the connection terminal fixed to the first conductor so as to project to a first conductor side.
摘要翻译：要解决的问题：提供一种具有可以在连接端子的一个端部与板之间保持恒定间隔的连接端子的板。解决方案：具有连接端子的板包括板体; 布置在所述板体的第一表面上的第一导体; 具有弹簧特性的导电连接端子，其一端固定在第一导体上，另一端部连接到与该板体的第一面相对配置的被连接物体; 以及突出部，其形成在固定到第一导体的连接端子的一个端部上，以突出到第一导体侧。

4. 发明专利

JP2011009025A Spring connector terminal and its mounting method 审中-公开
标题翻译：弹簧连接器端子及其安装方法
公开(公告)号：JP2011009025A
公开(公告)日：2011-01-13
申请号：JP2009150587
申请日：2009-06-25
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： IHARA YOSHIHIRO
IPC分类号： H01R4/48 , H01L23/32 , H01R43/16
摘要： PROBLEM TO BE SOLVED: To provide a spring connector terminal which enables easy connection to an alignment jig in advance of surface mounting on a substrate or the like and contributes to efficiency of mounting.SOLUTION: The spring connector 10 is provided with a jointing portion 12 which is jointed fixedly to a first pad 41 installed on a first connecting object 40, a contact portion 13 which contacts a second pad installed on a second connecting object, and a spring portion 11 capable of elastic deformation interposed between the jointing portion 12 and the contact portion 13, and is further provided with a weight portion 14 which extends from the contact portion 13 and unevenly distributes the position of the center of gravity of the spring connector 10 to a side near the contact portion 13. The jointing portion 12, the spring portion 11, the contact portion 13, and the weight portion 14 are formed integrally of a metal plate.
摘要翻译：要解决的问题：提供一种弹簧连接器端子，其能够在表面安装在基板等之前容易地连接到对准夹具，并且有助于安装的效率。解决方案：弹簧连接器10设置有接合部分12 其固定地连接到安装在第一连接对象40上的第一焊盘41，接触安装在第二连接对象上的第二焊盘的接触部分13和能够插入在接合部分12和接头部分12之间的弹性变形的弹簧部分11。接触部13，并且还设置有从接触部分13延伸并且将弹簧连接器10的重心位置不均匀地分布到靠近接触部分13的一侧的配重部分14.接合部分12 弹簧部分11，接触部分13和重物部分14由金属板一体形成。

5. 发明专利

JP2010277829A Substrate having connection terminal 有权
标题翻译：具有连接端子的基板
公开(公告)号：JP2010277829A
公开(公告)日：2010-12-09
申请号：JP2009128785
申请日：2009-05-28
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： IHARA YOSHIHIRO , TERASAWA TAKETO , KITAJIMA MASAKUNI
IPC分类号： H01R12/71 , H01R12/00 , H01R12/51 , H01R12/52 , H01R12/55 , H01R12/78 , H01R12/79
CPC分类号： H01R12/57 , H01L2924/0002 , H01R13/2435 , H05K3/325 , H05K3/3421 , H05K2201/0311 , H05K2201/10378 , H05K2201/10719 , H05K2201/10946 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate having a connection terminal, capable of disposing pads of objects to be connected at a narrow pitch. SOLUTION: The substrate having a connection terminal includes a connection terminal 12. The connection terminal includes: a first connection section 21 that is made planar and is fixed to an end face 19A of a through electrode 19 provided on the substrate 11; a second connection section 22 that is pressed by the pad 34 of the object 33 to be connected and is disposed opposite to the first connection section 21; a spring section 23 that is curved and has spring properties; a first support section 24 with one end composed integrally with the spring section 23 and the other end section composed integrally with the first connection section 21; and a second support section 25 with one end composed integrally with the spring section 23 and the other end composed integrally with the second connection section 22. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有连接端子的基板，能够以窄的间距设置要连接的物体的焊盘。具有连接端子的基板包括连接端子12.连接端子包括：第一连接部分21，其被制成平面并固定到设置在基板11上的通孔19的端面19A; 由待连接物体33的焊盘34按压并与第一连接部21相对设置的第二连接部22; 弹簧部23，其弯曲并具有弹簧特性; 第一支撑部24，其一端与弹簧部23一体地构成，另一端部与第一连接部21一体地构成; 和第二支撑部分25，其一端与弹簧部分23一体地构成，另一端与第二连接部分22整体构成。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2009130088A Semiconductor device and method of manufacturing the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2009130088A
公开(公告)日：2009-06-11
申请号：JP2007302719
申请日：2007-11-22
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： IHARA YOSHIHIRO , OI ATSUSHI , CHINO TERUAKI
IPC分类号： H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L2224/73204
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device wherein upper and lower substrates are stacked for precise alignment, with thickness being reduced.
SOLUTION: In a semiconductor device 32, a plurality of substrates 10 are electrically connected and stacked, where a semiconductor chip 18 is electrically connected and mounted on a wiring pattern 14, and the semiconductor chip 18 and the wiring pattern 14 are sealed up with a resin 22. In each substrate 10, grooves 24 where an external connection terminal 14b of the wiring pattern 14 is exposed are opened, on both sides, in required numbers on a pair of parallel sidewall surfaces. In the groove 24, a lead part 30 formed by working with a metal plate is electrically connected and fixed to the exposed external connection terminal 14b of each substrate 10.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件，其中上下基板被堆叠以精确对准，其厚度减小。解决方案：在半导体器件32中，多个基板10电连接并堆叠，其中半导体芯片18电连接并安装在布线图案14上，并且半导体芯片18和布线图案14被密封在每个基板10中，布线图案14的外部连接端子14b露出的凹槽24在两侧以所需数量在一对平行的侧壁表面上打开。在凹槽24中，通过与金属板一起工作形成的引线部分30电连接并固定到每个基板10的暴露的外部连接端子14b上。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2014241242A 電池及びその製造方法有权
标题翻译：电池及其制造方法
公开(公告)号：JP2014241242A
公开(公告)日：2014-12-25
申请号：JP2013123530
申请日：2013-06-12
申请人：新光電気工業株式会社 , Shinko Electric Ind Co Ltd
发明人： KUBOTA KAZUYUKI , AIZAWA MITSUHIRO , IHARA YOSHIHIRO
IPC分类号： H01M2/10 , H01M2/02
CPC分类号： H01M2/1072 , H01M2/0207 , H01M2/0245 , H01M2/0267 , H01M2/1061 , H01M10/052 , H01M10/0585
摘要：【課題】十分な容量や電圧を有する電池及びその製造方法を提供する。【解決手段】電池30は、支持基板32と、支持基板32上に配され、引張強さが0.5〜10.0MPaである第1の樹脂層44を介して積み重ねられた複数の薄型電池20とを有する。【選択図】図2
摘要翻译：要解决的问题：提供具有足够容量或电压的电池及其制造方法。电池30包括：支撑基板32; 以及设置在支撑基板32上的多个薄电池10，通过拉伸强度为0.5〜10.0MPa的第一树脂层44层叠。

8. 发明专利

JP2013048031A Substrate with spring terminal and manufacturing method of the same 审中-公开
标题翻译：具有弹簧端子和其制造方法的基板
公开(公告)号：JP2013048031A
公开(公告)日：2013-03-07
申请号：JP2011185560
申请日：2011-08-29
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： IHARA YOSHIHIRO
IPC分类号： H01R12/55 , H01L23/32 , H01R33/76 , H01R43/02 , H05K3/28 , H05K3/34
CPC分类号： H01R12/57 , H01L23/49811 , H01L23/49827 , H01L2924/0002 , H01R12/52 , H01R13/2442 , H05K3/326 , H05K3/3484 , H05K2201/0311 , H05K2201/09481 , H05K2201/1031 , H05K2201/10378 , H05K2201/10977 , Y02P70/611 , Y10T29/49144 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reinforce a solder connection part of a spring terminal in a substrate with the spring terminal.SOLUTION: A substrate with a spring terminal includes: a substrate 10 including connection pads P; spring terminals 30, each of which has a connection part 32 connected with the connection pad P by a solder layer 22; and reinforcement resin parts 24 which are formed so as to cover side surfaces of the solder layer 22. The solder layers 22 and the reinforcement resin parts 24 are formed by a resin-containing solder paste.
摘要翻译：要解决的问题：用弹簧端子来加强衬底中的弹簧端子的焊接部分。解决方案：具有弹簧端子的基板包括：包括连接焊盘P的基板10; 弹簧端子30，每个具有通过焊料层22与连接焊盘P连接的连接部分32; 以及形成为覆盖焊料层22的侧面的强化树脂部件24.焊料层22和强化树脂部件24由含树脂的焊膏形成。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2013026178A Connection terminal structure, manufacturing method therefor and substrate with connection terminal structure 有权
标题翻译：连接端子结构及其连接端子结构及其基板的制造方法
公开(公告)号：JP2013026178A
公开(公告)日：2013-02-04
申请号：JP2011162909
申请日：2011-07-26
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： IHARA YOSHIHIRO
IPC分类号： H01R13/24 , H01R12/55 , H01R43/16
CPC分类号： H01R13/2442 , H05K7/1069
摘要： PROBLEM TO BE SOLVED: To provide a connection terminal structure which can be manufactured by a simple manufacturing process, and a manufacturing method therefor, and to provide a substrate with the connection terminal structure formed by joining the connection terminal structure to the substrate.SOLUTION: The connection terminal structure comprises: a support; and a metallic connection terminal provided on one surface of the support and including a fixed part at one end, a connection abutting with an object to be connected at the other end, and a spring part for connecting the fixed part and the connection between the one end and the other end. The spring part and the connection are raised together with the support and protrude to the one surface side, and a part of the fixed part is exposed in an opening provided at the support.
摘要翻译：要解决的问题：为了提供可以通过简单的制造工艺制造的连接端子结构及其制造方法，并且提供具有通过将连接端子结构连接到基板而形成的连接端子结构的基板。
解决方案：连接端子结构包括：支撑件; 以及金属连接端子，其设置在所述支撑体的一个表面上，并且在一端具有固定部，与另一端连接的物体邻接的连接部，以及用于连接所述固定部和所述一个结束和另一端。弹簧部分和连接件与支撑件一起被突出到一个表面侧，并且固定部分的一部分暴露在设置在支撑件处的开口中。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2012129014A Socket 有权
标题翻译：插座
公开(公告)号：JP2012129014A
公开(公告)日：2012-07-05
申请号：JP2010278136
申请日：2010-12-14
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： IHARA YOSHIHIRO
IPC分类号： H01R33/76
CPC分类号： H01R12/714 , H01R12/88 , H01R13/24 , H01R43/0256
摘要： PROBLEM TO BE SOLVED: To provide a socket having a structure capable of improving heat dissipation of a connection terminal.SOLUTION: The socket for detachably connecting an object to be connected, to a mounting board via a connection terminal provided with a connection part comprises: a substrate for supporting the connection terminal so that the connection part faces the object to be connected; and a frame-like positioning part for positioning the connection part and a pad of the object to be connected. Openings are provided in a side wall of the positioning part.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式