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1. 发明专利

JP2006245213A Manufacturing method of wiring circuit board 审中-公开
标题翻译：电路板制造方法
公开(公告)号：JP2006245213A
公开(公告)日：2006-09-14
申请号：JP2005057654
申请日：2005-03-02
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： HIZUME TORU , TANAKA SHUICHI , MOCHIZUKI KENJI
IPC分类号： H05K1/11 , H05K3/20 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board formed by adhering a wiring pattern to have a more fine wiring pattern shape.
SOLUTION: The manufacturing method of wiring circuit board comprises the steps of forming an insulating layer on a first wiring formed on a core circuit board, transferring a second wiring to the relevant insulating layer by pressing the relevant second wiring formed on a supporting circuit board to the insulating layer, removing the relevant supporting circuit board, and forming a via plug for connecting the first wiring and the second wiring.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过将布线图案粘合而形成的布线电路板，以使布线图案形状更细。解决方案：布线电路板的制造方法包括以下步骤：在形成在芯电路板上的第一布线上形成绝缘层，通过按压形成在支撑体上的相关第二布线将第二布线转移到相关绝缘层电路板到绝缘层，去除相关的支撑电路板，以及形成用于连接第一布线和第二布线的通孔。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2011054486A Wound-shape spring member, socket for semiconductor package, and method of manufacturing the same 有权
标题翻译：绕线弹簧构件，半导体封装用插座及其制造方法
公开(公告)号：JP2011054486A
公开(公告)日：2011-03-17
申请号：JP2009203885
申请日：2009-09-03
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： OI ATSUSHI , TANAKA MASATO , IHARA YOSHIHIRO , MOCHIZUKI KENJI
IPC分类号： H01R13/24 , H01R33/76 , H01R43/18
摘要： PROBLEM TO BE SOLVED: To provide a spring with high performance, a thinned and downsized semiconductor package with high efficiency, and further, to improve productivity of the spring with high performance and its applied products. SOLUTION: Two end parts 31, 32 of a wound-shape spring member 20 are positioned at a central part of the wound shape, and there is no overlapping area of the wound-shape spring member 20 having two end parts 31, 32 when viewed from the spring in its expanding direction. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供高性能的弹簧，具有高效率的薄型和小型化半导体封装，并且进一步提高具有高性能的弹簧的生产率及其应用产品。解决方案：缠绕形弹簧构件20的两个端部31,32位于缠绕形状的中心部分，并且没有具有两个端部31的缠绕形弹簧构件20的重叠区域，当从弹簧向其膨胀方向观察时。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2012028408A Socket and manufacturing method thereof 有权
标题翻译：插座及其制造方法
公开(公告)号：JP2012028408A
公开(公告)日：2012-02-09
申请号：JP2010163141
申请日：2010-07-20
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： HORIKAWA YASUYOSHI , IHARA YOSHIHIRO , MOCHIZUKI KENJI , TANAKA MASATO
IPC分类号： H01L23/32 , H01R33/76 , H01R43/00
CPC分类号： H01R12/716 , H01R13/2442 , H05K3/301 , H05K3/3436 , H05K7/1069 , H05K2201/10325 , H05K2201/10393 , Y10T29/49147
摘要： PROBLEM TO BE SOLVED: To provide a socket capable of reducing the height and also capable of reducing the connection distance between a connection object and a mounting substrate or the like, as well as to provide a manufacturing method of the socket.SOLUTION: A socket comprises a connection terminal having a first connection formed on one end and a second connection formed on the other end. The socket detachably connects a connection object to a substrate via the connection terminal. The socket also comprises: a support body for fixing the connection terminal; and a through-hole formed on the support body. The connection terminal is inserted into the through-hole. The first connection is fixed to one face of the support body, and the second connection protrudes from the other face of the support body.
摘要翻译：要解决的问题：提供一种能够降低高度并且还能够减少连接对象和安装基板等之间的连接距离的插座，以及提供插座的制造方法。解决方案：插座包括具有形成在一端上的第一连接和在另一端形成的第二连接的连接端子。插座通过连接端子将连接对象可拆卸地连接到基板。插座还包括：用于固定连接端子的支撑体; 以及形成在所述支撑体上的通孔。连接端子插入到通孔中。第一连接件固定在支撑体的一个面上，第二连接部从支撑体的另一个面突出。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2010073324A Arrangement method of external connection terminal 审中-公开
标题翻译：外部连接端子的布置方法
公开(公告)号：JP2010073324A
公开(公告)日：2010-04-02
申请号：JP2008236198
申请日：2008-09-16
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： MOCHIZUKI KENJI
IPC分类号： H01R43/02
摘要： PROBLEM TO BE SOLVED: To provide an arrangement method of an external connection terminal for enhancing adhesion between an optical waveguide bonded to a wiring board with an adhesive and the wiring board. SOLUTION: Conductive paste 23 is formed in each of a plurality of pads for external connection 19 provided at a wiring board 11, a plurality of frames with external connection terminal 45 equipped with frames 35, external connection terminals 25 each aligned with the frame 35 at nearly the same interval as an arrangement pitch of the pads for external connection 19, and narrowed parts 36 formed near the boundaries of the frames 35 and the pads for external connection 19 are formed. Then, each frame with external connection terminal 45 is put between each two of a plurality of spacers 71 so that the external connection terminals 25 are protruded from the spacers 71 made in nearly the same thickness as the arrangement pitch of the pad for external connection 19, and later, each conductive paste 23 molten by heating and each external connection terminal 25 are made in contact with each other to connect the conductive paste 23 and the external connection terminal 25. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种外部连接端子的布置方法，用于提高用粘合剂与布线板接合的光波导与布线板之间的粘合力。解决方案：导电浆料23形成在设置在布线板11上的多个用于外部连接的焊盘19中的多个框架中，多个框架具有外部连接端子45，其具有框架35，外部连接端子25各自与形成与外部连接用焊盘19的配置间距几乎相同的间隔的框架35，以及形成在框架35的边界附近的形成的狭窄部36和用于外部连接的焊盘19。然后，将具有外部连接端子45的每个框架放置在多个间隔件71的每一个之间，使得外部连接端子25从与用于外部连接19的焊盘的布置间距几乎相同的厚度的间隔件71突出然后，通过加热熔融的每个导电浆料23和每个外部连接端子25彼此接触以连接导电浆料23和外部连接端子25.版权所有（C）2010，JPO＆INPIT

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