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1. 发明专利

JP2005343749A Cemented carbide and method of manufacturing the same 有权
标题翻译：硬质合金及其制造方法
公开(公告)号：JP2005343749A
公开(公告)日：2005-12-15
申请号：JP2004165935
申请日：2004-06-03
申请人： Nagano Prefecture , Shinko Electric Ind Co Ltd , 新光電気工業株式会社 , 長野県
发明人： TAKIZAWA SHUICHI , WAKABAYASHI SHINICHI , KITAJIMA MASAKUNI
IPC分类号： C04B35/56 , C01B32/949 , C04B35/64 , C01B31/34
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a cemented carbide obtained by sintering tungsten carbide without blending cobalt and showing excellent hardness and fracture toughness. SOLUTION: In the manufacture of the cemented carbide mainly comprising tungsten carbide, a carbon nanotube is added to the tungsten carbide without adding cobalt to obtain a mixture 20 and the mixture 20 is sintered while applying a prescribed load to the mixture 20 and holding the form of the carbon nanotube. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：待解决的问题：提供一种通过烧结碳化钨而不混合钴而获得的硬质合金的制造方法，并且显示出优异的硬度和断裂韧性。解决方案：在主要包含碳化钨的硬质合金的制造中，将碳纳米管添加到碳化钨中而不添加钴以获得混合物20，并且混合物20在对混合物20施加规定的负荷的同时进行烧结，保持碳纳米管的形式。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2011249684A Heat radiation component and semiconductor package provided with the same 有权
标题翻译：加热元件和半导体封装
公开(公告)号：JP2011249684A
公开(公告)日：2011-12-08
申请号：JP2010123326
申请日：2010-05-28
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： MURAYAMA HIROSHI , SUGANUMA SHIGEAKI , KITAJIMA MASAKUNI , MATSUKI RYUICHI , MIYAJIMA HIROYUKI
IPC分类号： H01L23/373 , H01L21/60
CPC分类号： H01L23/3736 , F28D2021/0029 , F28F7/00 , F28F2255/04 , F28F2255/06 , F28F2265/26 , F28F2275/025 , H01L23/3675 , H01L23/42 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/16251
摘要： PROBLEM TO BE SOLVED: To provide a heat radiation component and a semiconductor package provided with the same which inhibit detachment of a heat conductive member from a semiconductor element.SOLUTION: The heat radiation component disposed on a semiconductor element mounted on a substrate via a heat conductive member, comprises a first layer disposed on a side closer to the semiconductor element, and a second layer laminated on the first layer and disposed on a side further from the semiconductor element. A thermal expansion coefficient of the second layer is smaller than that of the first layer.
摘要翻译：要解决的问题：提供一种散热部件和设置有散热部件的半导体封装件，其抑制导热部件与半导体元件的分离。解决方案：通过导热部件设置在安装在基板上的半导体元件上的散热部件包括设置在更靠近半导体元件的一侧的第一层和层压在第一层上的第二层，并且设置在远离半导体元件的一侧。第二层的热膨胀系数小于第一层的热膨胀系数。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011100836A Lead pin and wiring substrate with lead pin, and method of manufacturing the same 有权
标题翻译：带引脚的引脚和接线基板及其制造方法
公开(公告)号：JP2011100836A
公开(公告)日：2011-05-19
申请号：JP2009254182
申请日：2009-11-05
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： KITAJIMA MASAKUNI
IPC分类号： H01L23/50 , H01L23/12
CPC分类号： H05K3/4015 , H01L24/16 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/81815 , H01L2924/00014 , H01L2924/15312 , H05K3/3426 , H05K2201/10318 , H05K2203/048 , Y10T29/49147 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a lead pin of a novel structure capable of providing a sufficient return amount of the lead pin, and correcting a position when reflowing a solder layer for connecting the lead pin thereto again. SOLUTION: This lead pin 10 includes a shaft part 12, and a connection head part 14 formed on a tip side of the shaft part 12 and having a diameter larger than that of the shaft part 12. The connection head part 14 includes a bonding surface C on the side opposite to the shaft part 12 side. The bonding surface C has a flat surface C1 formed at the center part, a projecting surface C2 formed into a ring-like shape outside the flat surface C1 and rounded into a projecting shape at a radius R, and a recessed surface C3 formed into a ring-like shape outside the projecting surface C2 and rounded into a recessed shape at a radius R. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种新颖结构的引脚，其能够提供足够的引脚的返回量，并且在再次焊接用于将引脚连接到其上的焊料层时校正位置。解决方案：该引导销10包括轴部12和形成在轴部12的前端侧并且具有比轴部12的直径大的直径的连接头部14.连接头部14包括在与轴部12侧相反的一侧的接合面C. 接合表面C具有形成在中心部分的平坦表面C1，在平坦表面C1外部形成为环状的突出表面C2，并且以半径R为圆形的突出形状，并且形成为环状形状，并且以半径R成圆形成凹陷形状。（C）2011，JPO＆INPIT

4. 发明专利

JP2010277829A Substrate having connection terminal 有权
标题翻译：具有连接端子的基板
公开(公告)号：JP2010277829A
公开(公告)日：2010-12-09
申请号：JP2009128785
申请日：2009-05-28
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： IHARA YOSHIHIRO , TERASAWA TAKETO , KITAJIMA MASAKUNI
IPC分类号： H01R12/71 , H01R12/00 , H01R12/51 , H01R12/52 , H01R12/55 , H01R12/78 , H01R12/79
CPC分类号： H01R12/57 , H01L2924/0002 , H01R13/2435 , H05K3/325 , H05K3/3421 , H05K2201/0311 , H05K2201/10378 , H05K2201/10719 , H05K2201/10946 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate having a connection terminal, capable of disposing pads of objects to be connected at a narrow pitch. SOLUTION: The substrate having a connection terminal includes a connection terminal 12. The connection terminal includes: a first connection section 21 that is made planar and is fixed to an end face 19A of a through electrode 19 provided on the substrate 11; a second connection section 22 that is pressed by the pad 34 of the object 33 to be connected and is disposed opposite to the first connection section 21; a spring section 23 that is curved and has spring properties; a first support section 24 with one end composed integrally with the spring section 23 and the other end section composed integrally with the first connection section 21; and a second support section 25 with one end composed integrally with the spring section 23 and the other end composed integrally with the second connection section 22. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有连接端子的基板，能够以窄的间距设置要连接的物体的焊盘。具有连接端子的基板包括连接端子12.连接端子包括：第一连接部分21，其被制成平面并固定到设置在基板11上的通孔19的端面19A; 由待连接物体33的焊盘34按压并与第一连接部21相对设置的第二连接部22; 弹簧部23，其弯曲并具有弹簧特性; 第一支撑部24，其一端与弹簧部23一体地构成，另一端部与第一连接部21一体地构成; 和第二支撑部分25，其一端与弹簧部分23一体地构成，另一端与第二连接部分22整体构成。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2008270531A Multilayer wiring board and manufacturing method thereof 有权
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2008270531A
公开(公告)日：2008-11-06
申请号：JP2007111642
申请日：2007-04-20
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： KITAJIMA MASAKUNI , UEDA KEISUKE , MATSUKI RYUICHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board having a stack via structure providing interlayer connection of high reliability.
SOLUTION: An interlayer connection structure consists of a substrate 10 equipped with: a wiring layer 20; an interlayer insulation layer 30 which is formed on the wiring layer 20 and is provided with a via hole VH1 reaching the wiring layer 20; and a via pad 40 formed, from within the via hole VH1, on the interlayer insulation layer 30 near the hole. A stack via structure 5 is formed by stacking a plurality of interlayer connection structures, with a plurality of via pads 40, 42, and 44 stacked vertically to be connected to each other. A recess C which is recessed from a peripheral part is provided at the central part of the upper surface of each of via pads 40, 42, and 44. On the bottom surface of the recess C of a lower side via pad, the bottom part of the via pad of upper side is arranged.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有提供高可靠性的层间连接的堆叠通孔结构的多层布线板。解决方案：层间连接结构由配备有布线层20的基板10组成; 层间绝缘层30，其形成在布线层20上，并且设置有到达布线层20的通孔VH1; 以及从通孔VH1内形成在孔附近的层间绝缘层30上的通孔焊盘40。堆叠通孔结构5通过堆叠多个层间连接结构而形成，多个通孔焊盘40,42和44垂直堆叠以彼此连接。在每个通孔垫40,42和44的上表面的中央部设置有从周边部凹入的凹部C.在下侧通孔垫的凹部C的底面上，底部的上侧通孔垫。版权所有（C）2009，JPO＆INPIT

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