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1. 发明专利

JP2005281796A Surface treatment method and surface treatment apparatus 审中-公开
标题翻译：表面处理方法和表面处理装置
公开(公告)号：JP2005281796A
公开(公告)日：2005-10-13
申请号：JP2004099075
申请日：2004-03-30
申请人： Shibaura Mechatronics Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 芝浦メカトロニクス株式会社
发明人： KAGAMI NAOTO , HIRAKI NAOZUMI , TAKIZAWA HIROTSUGU , UTSUNOMIYA NOBUAKI , AKUTSU SHIGERU , KURIYAMA NOBORU
IPC分类号： H05H1/46 , C23C16/509 , C23C16/52 , C23F4/00 , H01M8/02
CPC分类号： Y02E60/50
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment method and surface treatment apparatus capable of uniformly performing a plasma treatment of respective surfaces of a substrate to be treated. SOLUTION: The surface treatment method for working a member to be treated having a plurality of surfaces by the plasma discharge treatment includes a process (S 10) of arranging the member 150 to be treated between a plurality of counter electrodes within a chamber, processes (S 20 to S 40) of performing plasma discharge between the member to be treated and the plurality of the counter electrodes and measuring the electric constant of the chamber, a regulation process (S 50) of regulating the relative position relation between the surface to be treated of the member 150 to be treated and the plurality of counter electrodes opposed thereto, a process (S 60) of subjecting the surfaces to be treated to the surface treatment by the plasma between the member to be treated and the plurality of the counter electrodes. According to such configuration, the surface treatment is performed by regulating the respective electric constants between the respective surfaces to be treated of the member to be treated and the corresponding electrodes so as to make the constants approximately equal to each other and therefore the respective surfaces to be treated can be subjected to the uniform surface treatment by the one process. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够均匀地进行待处理基板的各个表面的等离子体处理的表面处理方法和表面处理装置。解决方案：通过等离子体放电处理来加工具有多个表面的待处理部件的表面处理方法包括将待处理部件150布置在室内的多个对电极之间的工序（S10）在所述被处理对象物与所述多个对置电极之间进行等离子体放电并测量所述室的电常数的处理（S 20〜S 40），调整所述处理对象之间的相对位置关系的调整处理（S50）待处理的构件150的表面和与其对置的多个对置电极，对待处理的表面进行表面处理的待处理表面的处理（S60）对电极。根据这样的结构，通过调整待处理对象物的各个表面和相应的电极之间的各自的电常数来进行表面处理，使常数大致相等，被处理可以通过一个过程进行均匀的表面处理。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2004235605A Electrostatic attracting method, electrostatic attracting device and bonding device 有权
公开(公告)号：JP2004235605A
公开(公告)日：2004-08-19
申请号：JP2003176608
申请日：2003-06-20
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： IWAMI MUNENORI , KURIYAMA NOBORU , TAKEISHI KOJI , HAYAFUJI IKUO , MASUDA KOICHI
IPC分类号： G02F1/13 , G02F1/1333 , G02F1/1339 , H01L21/683 , H02N13/00 , H01L21/68
CPC分类号： H01L21/6833 , G02F2001/133354 , H02N13/00
摘要： PROBLEM TO BE SOLVED: To provide an electrostatic attracting method for increasing the electrostatic force for attracting and holding a substrate. SOLUTION: The electrostatic attracting method for attracting and holding a substrate on the holding surface of a table by an electrostatic force generated by applying a direct current to electrodes provided on the table made of dielectrics includes: a first step for applying a voltage, which has a predetermined polarity, to the electrodes to give electrical charges on the holding surface with a polarity opposite to that of the electrodes; a second step for contacting a substrate with the holding surface to prevent the dissipation of the electrical charges borne on the holding surface; a third step for applying a voltage, which has an opposite polarity to that of the voltage applied in the first step, to the electrodes with the substrate being contact with the holding surface to occur electric charges, which has the same polarity as that of the electric charges borne on the holding surface in the first step, on the holding surface of the table, thereby attracting and holding the substrate using this electric charges and the electric charges borne on the holding surface in the first step. COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2004183012A Power source, source for sputtering, and sputtering device 有权
公开(公告)号：JP2004183012A
公开(公告)日：2004-07-02
申请号：JP2002348531
申请日：2002-11-29
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： KURIYAMA NOBORU , IMAGAWA KAZUHIKO
IPC分类号： C23C14/34
摘要： PROBLEM TO BE SOLVED: To provide a power source capable of cutting off abrupt current such as arc discharge and making its scale compact, and to provide a power source for sputtering and a sputtering device.
SOLUTION: In this power source, the power in the forward direction is output to a load to perform the regular operation, and when the load impedance is reduced, the voltage in the reverse direction is output to the load, and the power in the forward direction is output. When the power in the forward direction is output at the voltage closer to zero than the voltage in the regular operation, the output of the current is limited to a value smaller than the rated current, and the output current in a state that arc discharge occurs can be limited.
COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2003073826A Power source device for sputtering apparatus and power source device 有权
标题翻译：电源装置和电源装置的电源装置
公开(公告)号：JP2003073826A
公开(公告)日：2003-03-12
申请号：JP2001256243
申请日：2001-08-27
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： IMAGAWA KAZUHIKO , KURIYAMA NOBORU
IPC分类号： C23C14/34 , G05F1/00 , G05F1/02
摘要： PROBLEM TO BE SOLVED: To provide a power supply device for a sputtering apparatus, which can connect several power sources not in a master-slave manner but in parallel.
SOLUTION: The power source device for the sputtering apparatus, having a negative output terminal and a positive output terminal, comprises arc discharge detecting means r1 and r2 for detecting an arc discharge, direct voltage generating parts 22, 23, and 34, diodes D1 and D2 which are connected between the direct voltage generating part and the negative output terminal and are connected in a direction of blocking current from the direct voltage generating part to the negative output terminal, and arc intercepting means Q1 and C1 which are triggered by the arc discharge detecting means.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种用于溅射装置的电源装置，其可以以主从方式但并联连接多个电源。解决方案：具有负输出端和正输出端的用于溅射装置的电源装置包括用于检测电弧放电的电弧放电检测装置r1和r2，直流电压产生部分22,23和34，二极管D1和 D2，其连接在直流电压产生部分和负输出端子之间，并且在阻抗电流方向从直流电压产生部分连接到负极输出端子;以及电弧截止装置Q1和C1，由电弧放电触发检测装置。

5. 发明专利

JP2014180691A Ultrasonic bonding device 有权
标题翻译：超声波接合装置
公开(公告)号：JP2014180691A
公开(公告)日：2014-09-29
申请号：JP2013057284
申请日：2013-03-19
申请人： Toshiba Corp , 株式会社東芝 , Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： AIZAWA TAKAHIRO , KURIYAMA NOBORU , MORI MIKI
IPC分类号： B23K20/10 , B06B1/02 , H01L21/607
CPC分类号： B23K20/10 , B06B1/0253 , B06B3/00 , B29C65/08
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device that further efficiently bonds an object of bonding.SOLUTION: An ultrasonic bonding device in accordance with an embodiment includes an ultrasonic transducer that generates ultrasonic waves in response to a voltage, a distal tool that applies a load and ultrasonic oscillations to an object of bonding, an ultrasonic horn that conveys the load and the ultrasonic oscillations, which are produced by the ultrasonic transducer, to the distal tool, and an ultrasonic oscillator. The ultrasonic oscillator includes an oscillation circuit and feeds a voltage, which is generated by the oscillation circuit, to the ultrasonic transducer. The ultrasonic oscillator further includes control means that detects a voltage reflectance on the basis of the voltage and current to be generated by the oscillation circuit, and controls the frequency of the voltage, which is generated by the oscillation circuit, so that the voltage reflectance will be minimal.
摘要翻译：要解决的问题：提供一种进一步有效地粘合物体的超声波接合装置。解决方案：根据实施例的超声波接合装置包括响应于电压产生超声波的超声波换能器，应用的远端工具将超声波振动传递到远端工具的超声波振动器和超声波振荡器。超声波振荡器包括振荡电路，并将由振荡电路产生的电压馈送到超声换能器。超声波振荡器还包括控制装置，其基于由振荡电路产生的电压和电流来检测电压反射率，并且控制由振荡电路产生的电压的频率，使得电压反射率将最小

6. 发明专利

JP2006286950A Method and device for surface processing 审中-公开
标题翻译：表面处理的方法和装置
公开(公告)号：JP2006286950A
公开(公告)日：2006-10-19
申请号：JP2005105141
申请日：2005-03-31
申请人： Shibaura Mechatronics Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 芝浦メカトロニクス株式会社
发明人： KAGAMI NAOTO , HIRAKI NAOZUMI , KURIYAMA NOBORU , TAKIZAWA HIROTSUGU , YOSHIMURA KOJI
IPC分类号： H01L21/3065 , C23C16/44 , H01L21/205 , H05H1/46
摘要： PROBLEM TO BE SOLVED: To provide a surface processing method and a surface processing device wherein plasma can be kept stable even when both the surfaces of two or more substrates are subjected to surface processing. SOLUTION: Moisture and/or inert gas is added to process gas in a surface processing method where the surfaces of the processed member are subjected to plasma processing in the presence of process gas in a chamber. By this setup, the produced plasma can be kept stable. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种表面处理方法和表面处理装置，其中等离子体可以在两个或更多个基板的两个表面经受表面处理时保持稳定。解决方案：在表面处理方法中加入水分和/或惰性气体，其中处理的构件的表面在室中的处理气体存在下进行等离子体处理。通过这种设置，所产生的等离子体可以保持稳定。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2012185975A Plasma processing device and plasma processing method 有权
标题翻译：等离子体处理装置和等离子体处理方法
公开(公告)号：JP2012185975A
公开(公告)日：2012-09-27
申请号：JP2011047543
申请日：2011-03-04
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： IVAN PETROV GANASHEV , KURIYAMA NOBORU , TONO HIDESHI
IPC分类号： H05H1/46 , C23C16/507 , H01L21/205 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To provide a plasma processing device and a plasma processing method capable of reducing damage of a window part.SOLUTION: The plasma processing device comprises: a processing container 2; a pressure reduction part 9 for reducing a pressure inside the processing container; a locating part 4 for locating a workpiece; a gas supply part 18 for supplying gas inside; a window part 3 for permeating electromagnetic waves; a load part 20 arranged outside the window part, and having plural conductor parts 21 and plural capacity parts for generating an electromagnetic field; and a power source 6b for applying power to the load part 20. The conductor parts 21 and the capacity parts are electrically alternately connected to each other. When the workpiece is processed with plasma, a position, at which an imaginary number component of a potential difference becomes 0 (zero), is created at the conductor part 21 provided between the capacity parts, and a value of the imaginary number component of the potential difference between a first terminal and a second terminal of the load part 20 is made not more than a value of an actual number component of the potential difference.
摘要翻译：要解决的问题：提供能够减少窗口部件的损坏的等离子体处理装置和等离子体处理方法。解决方案：等离子体处理装置包括：处理容器2; 用于减小加工容器内的压力的减压部9; 用于定位工件的定位部件4; 用于在内部供给气体的气体供给部18; 用于渗透电磁波的窗口部分3; 布置在窗部外的负载部20，具有多个导体部21和用于产生电磁场的多个电容部; 以及用于向负载部分20施加电力的电源6b。导体部分21和电容部分彼此电交替地连接。当用等离子体处理工件时，在设置在容量部分之间的导体部分21处产生电位差的虚数分量变为0（零）的位置，并且，负载部20的第一端子和第二端子之间的电位差不大于电位差的实数分量的值。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2011132605A Power source device for sputtering 有权
标题翻译：电源电源装置
公开(公告)号：JP2011132605A
公开(公告)日：2011-07-07
申请号：JP2011053780
申请日：2011-03-11
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： KURIYAMA NOBORU , IMAGAWA KAZUHIKO
IPC分类号： C23C14/38 , H02M3/155 , H05H1/00 , H05H1/46
摘要： PROBLEM TO BE SOLVED: To provide a power source device for sputtering which is capable of eliminating the failure of arc discharge suppression during sputtering. SOLUTION: The power source device having a negative pole output terminal and a positive pole output terminal comprises a DC power source PS1 for sputtering, a first switch SW1 provided in the negative pole side of the DC power source for sputtering, a plurality of mutually independent choke coils L1-L4 connected in series to the first switch, a reverse direction arc preventing circuit 13 provided between the plurality of choke coils and the negative pole output terminal, a DC power source PS2 for generating reverse voltage, a second switch SW2 provided between the DC power source for generating reverse voltage and an intermediate position between the plurality of the mutually independent choke coils connected in series to each other and the reverse direction arc preventing circuit, voltage detecting parts R1, R2 for detecting the voltage generated between the negative pole output terminal and the positive pole output terminal and a controller 21 for controlling the opening and the closing of the first and second switches. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够消除溅射期间电弧放电抑制失败的用于溅射的电源装置。解决方案：具有负极输出端子和正极输出端子的电源装置包括用于溅射的直流电源PS1，设置在用于溅射的直流电源的负极侧的第一开关SW1，多个与第一开关串联连接的相互独立的扼流线圈L1-L4，设置在多个扼流线圈和负极输出端子之间的反向防止电路13，产生反向电压的直流电源PS2，第二开关 SW2设置在用于产生反向电压的直流电源和彼此串联连接的多个相互独立的扼流线圈之间的中间位置和反向电弧防止电路之间，电压检测部分R1，R2用于检测在负极输出端子和正极输出端子以及用于控制开度的控制器21和c 丢失第一和第二开关。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2011106034A Power source device for sputtering 有权
标题翻译：电源电源装置
公开(公告)号：JP2011106034A
公开(公告)日：2011-06-02
申请号：JP2011053782
申请日：2011-03-11
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： KURIYAMA NOBORU , IMAGAWA KAZUHIKO
IPC分类号： C23C14/34
摘要： PROBLEM TO BE SOLVED: To provide a power source device for sputtering, in which the failure of suppression of arc discharge during sputtering can be eliminated. SOLUTION: The power source device for sputtering having a negative electrode output terminal and a positive electrode output terminal includes: a DC power source PS1 for sputtering; a first switching means SW1 provided to the negative electrode side of the DC power source for sputtering; a plurality of mutually independent choke coils L1 to L4 connected in series with the first switching means; a reverse direction arc prevention circuit 13 provided between the plurality of choke coils and the negative electrode output terminal; a DC power source PS2 for reverse voltage generation; a second switching means SW2 provided between the DC power source PS2 for reverse voltage generation and an intermediate position between the mutually independent choke coils connected in series and the reverse direction arc prevention circuit; voltage detection parts R1, R2 detecting the voltage generated between the negative electrode output terminal and the positive electrode output terminal; and a control means 21 controlling the opening/closing of the first switching means and the second switching means. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够消除溅射中的电弧放电抑制失败的溅射用电源装置。解决方案：具有负极输出端子和正极输出端子的用于溅射的电源装置包括：用于溅射的DC电源PS1; 设置在用于溅射的直流电源的负极侧的第一开关装置SW1; 与第一开关装置串联连接的多个相互独立的扼流线圈L1〜L4; 设置在多个扼流线圈和负极输出端子之间的反向防止电路13; 用于反向电压产生的直流电源PS2; 设置在用于反向电压产生的直流电源PS2和串联连接的相互独立的扼流线圈之间的中间位置和反向电弧防止电路之间的第二开关装置SW2; 检测负极输出端子和正极输出端子之间产生的电压的电压检测部件R1，R2; 以及控制装置21，其控制第一切换装置和第二切换装置的打开/关闭。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2011106033A Power source device for sputtering 有权
标题翻译：电源电源装置
公开(公告)号：JP2011106033A
公开(公告)日：2011-06-02
申请号：JP2011053781
申请日：2011-03-11
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： KURIYAMA NOBORU , IMAGAWA KAZUHIKO
IPC分类号： C23C14/34
摘要： PROBLEM TO BE SOLVED: To provide a power source device for sputtering, in which the failure of suppression in arc discharge during sputtering can be eliminated. SOLUTION: The power source device for sputtering having a negative electrode output terminal and a positive electrode output terminal is composed of: a DC power source PS1 for sputtering; a first switching means SW1 provided to the negative electrode side of the DC power source for sputtering; a plurality of mutually independent choke coils L1 to L4 connected to the first switching means in series; a reverse direction arc prevention circuit 13 provided at a space between the plurality of choke coils and the negative electrode output terminal; a DC power source PS2 for reverse voltage generation; a second switching means SW2 provided in the space of the intermediate position among the DC power source for reverse voltage generation, the plurality of mutually independent choke coils connected in series and the reverse direction arc prevention circuit; voltage detection parts R1, R2 detecting the voltage generated between the negative electrode output terminal and the positive electrode output terminal; and a control means 21 controlling the opening/closing of the first switching means and the second switching means. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种能够消除溅射中的电弧放电抑制失败的溅射用电源装置。解决方案：具有负极输出端子和正极输出端子的用于溅射的电源装置包括：用于溅射的DC电源PS1; 设置在用于溅射的直流电源的负极侧的第一开关装置SW1; 与第一开关装置串联连接的多个相互独立的扼流线圈L1〜L4; 设置在多个扼流线圈与负极输出端子之间的空间处的反向防止电路13; 用于反向电压产生的直流电源PS2; 设置在用于反向电压产生的直流电源中的中间位置的空间中的第二开关装置SW2，串联连接的多个相互独立的扼流线圈和反向电弧防止电路; 检测负极输出端子和正极输出端子之间产生的电压的电压检测部件R1，R2; 以及控制装置21，其控制第一切换装置和第二切换装置的打开/关闭。版权所有（C）2011，JPO＆INPIT

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