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1. 发明专利

JP2014180691A Ultrasonic bonding device 有权
标题翻译：超声波接合装置
公开(公告)号：JP2014180691A
公开(公告)日：2014-09-29
申请号：JP2013057284
申请日：2013-03-19
申请人： Toshiba Corp , 株式会社東芝 , Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： AIZAWA TAKAHIRO , KURIYAMA NOBORU , MORI MIKI
IPC分类号： B23K20/10 , B06B1/02 , H01L21/607
CPC分类号： B23K20/10 , B06B1/0253 , B06B3/00 , B29C65/08
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device that further efficiently bonds an object of bonding.SOLUTION: An ultrasonic bonding device in accordance with an embodiment includes an ultrasonic transducer that generates ultrasonic waves in response to a voltage, a distal tool that applies a load and ultrasonic oscillations to an object of bonding, an ultrasonic horn that conveys the load and the ultrasonic oscillations, which are produced by the ultrasonic transducer, to the distal tool, and an ultrasonic oscillator. The ultrasonic oscillator includes an oscillation circuit and feeds a voltage, which is generated by the oscillation circuit, to the ultrasonic transducer. The ultrasonic oscillator further includes control means that detects a voltage reflectance on the basis of the voltage and current to be generated by the oscillation circuit, and controls the frequency of the voltage, which is generated by the oscillation circuit, so that the voltage reflectance will be minimal.
摘要翻译：要解决的问题：提供一种进一步有效地粘合物体的超声波接合装置。解决方案：根据实施例的超声波接合装置包括响应于电压产生超声波的超声波换能器，应用的远端工具将超声波振动传递到远端工具的超声波振动器和超声波振荡器。超声波振荡器包括振荡电路，并将由振荡电路产生的电压馈送到超声换能器。超声波振荡器还包括控制装置，其基于由振荡电路产生的电压和电流来检测电压反射率，并且控制由振荡电路产生的电压的频率，使得电压反射率将最小

2. 发明专利

JP2013212512A Tip for ultrasonic joining 审中-公开
标题翻译：超声波接合提示
公开(公告)号：JP2013212512A
公开(公告)日：2013-10-17
申请号：JP2012082854
申请日：2012-03-30
申请人： Toshiba Corp , 株式会社東芝
发明人： MORI MIKI , AIZAWA TAKAHIRO , KASHIWAZAKI EIKI , WATASE AYA
IPC分类号： B23K20/10
摘要： PROBLEM TO BE SOLVED: To provide a tip for ultrasonic joining which suppresses sticking.SOLUTION: A tip for an ultrasonic joining includes: a mount part 5a; a vibration transmission part 5b formed so that one end thereof is continued to the mount part 5a and having a substantial L-shape; and an abutment part 5c formed continuously to the other end of the vibration transmission part 5b while being decentered relative to a loading direction K applied to the mount part 5a. A first end T1 which is an end of the abutment part 5c on a side of the loading direction K and a second end T2 which is an end on a side opposite to the first end T1 have curved surfaces formed so as to satisfy R1
摘要翻译：要解决的问题：提供一种抑制粘附的超声波接合的尖端。解决方案：用于超声波接合的尖端包括：安装部分5a; 形成为使其一端与安装部5a连续并具有大致L字形的振动传递部5b; 以及邻接部件5c，其相对于施加到安装部分5a的加载方向K而相对于振动传递部分5b的另一端连续地形成。作为抵接部5c的装载方向K侧的端部的第一端T1和与第一端T1相反的一侧的端部的第二端T2具有形成为满足R1

3. 发明专利

JP2012069268A Battery and ultrasonic bonding method for battery 有权
标题翻译：电池电池和超声波接合方法
公开(公告)号：JP2012069268A
公开(公告)日：2012-04-05
申请号：JP2010210760
申请日：2010-09-21
申请人： Toshiba Corp , 株式会社東芝
发明人： AIZAWA TAKAHIRO , IKETANI YUKIHIRO , TOMIOKA TAIZO
IPC分类号： H01M2/26
CPC分类号： H01M2/30 , B23K20/10 , B23K2201/38 , B23K2203/10 , H01M2/263
摘要： PROBLEM TO BE SOLVED: To provide a battery and an ultrasonic bonding method for the battery, in which both low electric resistance of a lead and securing of ultrasonic bonding strength can be achieved by using ultrasonic bonding.SOLUTION: The battery comprises: a container 12; an electrode group 1 stored in the container and including a cathode and an anode; a plurality of collector tabs 2a and 2b which are extended from the cathode or the anode of the electrode group and are superposed on each other; leads 5a-5c and 6a-6c bonded to at least one of the collector tabs by ultrasonic bonding; a lid 11 covering an opening of the container; and external terminals 9 and 10 provided on the lid 11 and connected to the collector tabs via the leads. Cross-sectional areas of the leads are increased on the way from the ultrasonically bonded portions between the leads and the collector tabs to the external terminals.
摘要翻译：要解决的问题：提供一种电池的电池和超声波接合方法，其中通过使用超声波接合可以实现引线的低电阻和超声波接合强度的确保。电池包括：容器12; 存储在容器中并包括阴极和阳极的电极组1; 从电极组的阴极或阳极延伸并叠置的多个集电片2a和2b; 引线5a-5c和6a-6c通过超声波接合结合到至少一个收集片; 覆盖容器的开口的盖11; 以及设置在盖11上的外部端子9和10，并且经由引线连接到收集器突出部。引线的横截面积在从引线和收集器突片之间的超声波接合部分到外部端子的路上增加。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2007035757A Ultrasonic bonding device, ultrasonic bonding method, and method of manufacturing semiconductor component 审中-公开
标题翻译：超声波接合装置，超声波接合方法及制造半导体元件的方法
公开(公告)号：JP2007035757A
公开(公告)日：2007-02-08
申请号：JP2005214090
申请日：2005-07-25
申请人： Toshiba Corp , 株式会社東芝
发明人： OTANI KAZUMI , AIZAWA TAKAHIRO
IPC分类号： H01L21/607
CPC分类号： H01L24/75 , H01L24/81
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device which has no change in ultrasonic characteristics and has no change over time and hence can perform a good bonding operation with a stable bonding quality. SOLUTION: The ultrasonic bonding device comprises a source 2 of ultrasonic waves for producing ultrasonic vibration, ultrasonic horn 3 with one end connected to the source 2 of ultrasonic waves and the other end formed with a through-hole 3a, suction pipe 11 which is arranged near the ultrasonic horn 3 concentrically with the through-hole 3a thereof and has a larger inner diameter than that of the through-hole 3a, support member 12 for supporting the suction pipe 11, and pressurization apparatus 6, 7, and 8 which can move the through-hole 3a-side end of the ultrasonic horn 3 in a direction toward a member to be bonded. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种超声波特性没有变化并且随时间没有变化的超声波接合装置，因此可以以稳定的接合质量进行良好的接合操作。解决方案：超声波接合装置包括用于产生超声波振动的超声波源2，超声波喇叭3，其一端连接到超声波源2，另一端形成有通孔3a，吸入管11 其配置在与其通孔3a同心的超声波喇叭3附近，并且具有比通孔3a大的内径，用于支撑吸管11的支撑构件12和加压装置6,7和8 其可以使超声波喇叭3的通孔3a侧端朝向被接合构件的方向移动。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2010123680A Semiconductor device, connection conductor, and method of manufacturing semiconductor device 审中-公开
标题翻译：半导体器件，连接导体及制造半导体器件的方法
公开(公告)号：JP2010123680A
公开(公告)日：2010-06-03
申请号：JP2008294673
申请日：2008-11-18
申请人： Toshiba Corp , 株式会社東芝
发明人： NISHIUCHI HIDEO , KITANI TOMOYUKI , IGUCHI TOMOHIRO , AIZAWA TAKAHIRO , OISHI MASAKO , TOJO HIROSHI
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L2224/35 , H01L2224/37 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40 , H01L2224/40091 , H01L2224/40245 , H01L2224/40247 , H01L2224/83801 , H01L2224/84 , H01L2224/84205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device reducing package loss by reducing electric resistance in a conduction state and reducing manufacturing man-hours, to provide a connection conductor, and to provide a method of manufacturing the semiconductor device. SOLUTION: This semiconductor device 1 includes: a lead frame 20 having drain terminals 12, a source terminal 13 and a gate terminal 14; a semiconductor chip 10 arranged on the lead frame 20, having a drain electrode 15c on one surface on the lead frame 20 side, and having a source electrode 15a and a gate electrode 15b on the other surface; and a plate-like connection conductor 16 where a conductive strip-like conduction part 16a for a source extending in a first direction, and having one end side connected to the source terminal 13 and the other end side connected to the source electrode 15a, and a strip-like conductive conduction part 16b for a gate extending in the first direction, and having one end side connected to the gate terminal 14, and the other end side connected to the gate electrode 15b are integrally formed by being arranged side by side in a second direction intersecting the first direction while interposing an insulation part 16c therebetween. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种半导体器件，通过降低导通状态下的电阻和减少制造工时来减小封装损耗，提供连接导体，并提供制造半导体器件的方法。解决方案：该半导体器件1包括：具有漏极端子12的引线框架20，源极端子13和栅极端子14; 布置在引线框架20上的半导体芯片10，在引线框架20侧的一个表面上具有漏电极15c，并且在另一个表面上具有源电极15a和栅极电极15b; 以及板状连接导体16，其中用于沿第一方向延伸的源极的导电条状导电部分16a，其一端侧连接到源极端子13，另一端侧连接到源极电极15a，以及用于在第一方向延伸的栅极的带状导电部分16b，并且具有连接到栅极端子14的一端侧，与栅极电极15b连接的另一端侧通过并排布置而一体地形成，与第一方向相交的第二方向，同时在其间插入绝缘部分16c。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2010062316A Semiconductor device and method for manufacturing the semiconductor device 有权
标题翻译：用于制造半导体器件的半导体器件和方法
公开(公告)号：JP2010062316A
公开(公告)日：2010-03-18
申请号：JP2008226236
申请日：2008-09-03
申请人： Toshiba Corp , 株式会社東芝
发明人： TOJO HIROSHI , KITANI TOMOYUKI , IGUCHI TOMOHIRO , AIZAWA TAKAHIRO , NISHIUCHI HIDEO , OISHI MASAKO
IPC分类号： H01L23/48 , H01L21/301 , H01L21/56
CPC分类号： H01L21/561 , H01L23/3107 , H01L24/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a structure of not using a bonding wire, thereby enhancing an electric characteristic while securing the reliability, and improved in productivity by reducing a manufacturing time, and also to provide a method for manufacturing the same. SOLUTION: The semiconductor device includes: a semiconductor chip 5 in which a first electrode 5a1 of a semiconductor element is arranged on a first surface 5a, and a second electrode 5b1 of the semiconductor element is arranged on a second surface 5b opposing to the first surface 5a; a sealer 3 which is molten and hardened by heating the semiconductor chip 5 for sealing, and is provided with a first hole 3a1 and a second hole 3b1 so as to expose regions of the first electrode 5a1 and the second electrode 5b1; a first conductive member 2a connected to the first surface 5a of the semiconductor chip 5 through the first hole 3a1; a second conductive member 2b connected to the second surface 5b of the semiconductor chip 5 through the second hole 3b1; and a plating film 4 coating five faces which do not come into contact with the sealers 3 of the first conductive member 2a and the second conductive member 2b. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有不使用接合线的结构的半导体器件，从而在确保可靠性的同时提高电特性，并且通过缩短制造时间来提高生产率，并且还提供一种方法制造相同。解决方案：半导体器件包括：半导体芯片5，其中半导体元件的第一电极5a1布置在第一表面5a上，半导体元件的第二电极5b1布置在与半导体元件相对的第二表面5b上第一表面5a; 通过加热用于密封的半导体芯片5熔融和硬化的密封件3，并且设置有第一孔3a1和第二孔3b1，以暴露第一电极5a1和第二电极5b1的区域; 通过第一孔3a1连接到半导体芯片5的第一表面5a的第一导电构件2a; 通过第二孔3b1连接到半导体芯片5的第二表面5b的第二导电构件2b; 以及涂覆不与第一导电部件2a和第二导电部件2b的密封件3接触的五个面的镀膜4。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2009224601A Ultrasonic wave bonding apparatus, and method of manufacturing semiconductor apparatus using the same 审中-公开
标题翻译：超声波接合装置及使用其制造半导体装置的方法
公开(公告)号：JP2009224601A
公开(公告)日：2009-10-01
申请号：JP2008068205
申请日：2008-03-17
申请人： Toshiba Corp , 株式会社東芝
发明人： IGUCHI TOMOHIRO , NISHIUCHI HIDEO , KITANI TOMOYUKI , AIZAWA TAKAHIRO , TOJO HIROSHI , OISHI MASAKO
IPC分类号： H01L21/607
CPC分类号： H01L2224/37124 , H01L2224/40 , H01L2224/40245 , H01L2224/77 , H01L2224/84205 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic wave bonding apparatus capable of improving productivity and production efficiency, and to provide a method of manufacturing a semiconductor apparatus, using this ultrasonic wave bonding apparatus. SOLUTION: The ultrasonic wave bonding apparatus has: an ultrasonic wave vibration generator 21 generating ultrasonic wave vibration; a bar-shaped ultrasonic wave horn 22 to which the ultrasonic wave vibration is propagated from the ultrasonic wave vibration generator 21; and an application block 23 which is attached to the ultrasonic wave horn 22 and has an application surface to be brought into contact with a bonding target 3. A plurality of convex parts 26, grasping the bonding target 3, is provided to the application surface, and a value indicating the height from the application surface of the convex parts 26 to the head is smaller than the value indicating the thickness of the bonding target 3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种能够提高生产率和生产效率的超声波接合装置，并提供使用该超声波接合装置的半导体装置的制造方法。解决方案：超声波接合装置具有：产生超声波振动的超声波振动发生器21; 从超声波振动发生器21传播超声波振动的棒状超声波波峰22; 以及安装在超声波波峰22上并且具有与接合目标3接触的施加面的施加块23.在施加面上设置有夹持接合目标3的多个凸部26，并且表示从凸部26的涂布面到头部的高度的值小于表示接合目标3的厚度的值。（C）2010，JPO＆INPIT

8. 发明专利

JP2007319876A Ultrasonic bonding device, and semi-conductor device manufacturing method 审中-公开
标题翻译：超声波接合装置及半导体装置的制造方法
公开(公告)号：JP2007319876A
公开(公告)日：2007-12-13
申请号：JP2006150612
申请日：2006-05-30
申请人： Toshiba Corp , 株式会社東芝
发明人： TOJO HIROSHI , AIZAWA TAKAHIRO , KITANI TOMOYUKI , NISHIUCHI HIDEO
IPC分类号： B23K20/10 , B23K101/42 , H01L21/60 , H01L21/607
摘要： PROBLEM TO BE SOLVED: To change a component corresponding to a worn application unit at low cost when the application unit for applying ultrasonic waves in an ultrasonic bonding device is worn. SOLUTION: The ultrasonic bonding device comprises an ultrasonic horn 12 in which the ultrasonic vibration is propagated from an ultrasonic vibration generation unit, a mounting recessed part 15 formed in the ultrasonic horn 12 and having a tapered side wall surface 15a at least in a part thereof, an application block 13 having an insertion head part 19 having a truncated conical shape, a shaft part 20 extending from the insertion head part 19, and an application unit 21 formed on a fore end side of the shaft part 20 and abutted on an object 3 to be joined, a female screw part 16 formed on a part opposite to the circumference of the shaft part 20 when the insertion head part 19 is inserted in the mounting recessed part 15, and a fixing member 13 having a pass-through hole part 25 for passing the shaft part 20 therethrough, a male screw part 26 to be screwed to the female screw part 16, and a pressing part 28 to press the insertion head part 19 against the side wall surface 15a of the mounting recessed part 15. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：当在超声波接合装置中施加超声波的施加单元被磨损时，以低成本改变与磨损的应用单元相对应的部件。解决方案：超声波接合装置包括超声波喇叭12，其中超声波振动从超声波振动发生单元传播，安装凹部15形成在超声波喇叭12中，并且具有锥形侧壁表面15a至少在其一部分具有具有截头圆锥形状的插入头部19，从插入头部19延伸的轴部20和形成在轴部20的前端侧的施加单元21，并且抵接在要被接合的物体3上，当插入头部19插入到安装凹部15中时，形成在与轴部20的圆周相对的部分上的阴螺纹部16以及具有通孔的固定构件13，用于使轴部20穿过的通孔部25，与螺纹部16螺合的阳螺纹部26，以及将插入头部19压靠在内螺纹部16的侧壁面15a上的按压部28。安装凹部15.版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2004079969A Bonding tool 审中-公开
公开(公告)号：JP2004079969A
公开(公告)日：2004-03-11
申请号：JP2002242042
申请日：2002-08-22
申请人： Toshiba Corp , 株式会社東芝
发明人： AIZAWA TAKAHIRO , IKETANI YUKIHIRO , OTANI KAZUMI
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： H01L24/81 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75355 , H01L2224/75753 , H01L2224/81121 , H01L2224/81205 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01082 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To stably measure the amplitude at the tip of a bonding tool during bonding operation with an ultrasonic wave horn, even if an ultrasonic wave vibration is applied in the direction vertical to a bonding surface.
SOLUTION: An ultrasonic wave vibrator system 26 press contacts a tip to an electronic component 4 for pressurizing, and generates ultrasonic wave vibration in the pressurizing direction. A through hole 16 is formed on the ultrasonic wave vibrator system 26 from its base end toward tip side. A laser vibration meter 17A radiates laser beam to the tip through the through hole 16 to observe a reflected light and measures the amplitude at the tip end of the ultrasonic wave vibrator system 26.
COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2011142367A Ultrasonic bonding device and method of manufacturing semiconductor device 有权
标题翻译：超声波接合装置及制造半导体器件的方法
公开(公告)号：JP2011142367A
公开(公告)日：2011-07-21
申请号：JP2011097534
申请日：2011-04-25
申请人： Toshiba Corp , 株式会社東芝
发明人： AIZAWA TAKAHIRO , SHIBATA MOTOJIRO , YAMANAKA TAKESHI
IPC分类号： H01L21/607 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To improve bonding performance of an ultrasonic bonding device using ultrasonic vibration.
SOLUTION: The ultrasonic bonding device has a hollow and rod-like bonding tool 16 in which a hollow passage is formed in the interior, and a suction unit for suction-holding a semiconductor chip 5 is formed on one end side, a rod-like ultrasonic horn 23 for holding the bonding tool 16 and transmitting ultrasonic vibration caused in an ultrasonic generation source to the bonding tool 16, a block 32 which is attached to the other end side of the bonding tool 16, and in which a second hollow passage whose one end side is communicated with the hollow passage, and the other end side is connected to a vacuum generating unit, is formed in the interior, and a pressing member 35 for restricting the movement of the block 32 to a direction in which a connected state between the block 32 and the bonding tool 16 is changed.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提高使用超声波振动的超声波接合装置的接合性能。解决方案：超声波接合装置具有中空的棒状接合工具16，其中在内部形成有中空通道，并且在一端侧形成有用于吸持保持半导体芯片5的抽吸单元，棒状超声波喇叭23，用于保持接合工具16，并将在超声发生源中产生的超声波振动传递到接合工具16;块32，其安装在接合工具16的另一端侧，并且其中第二中空通道，其一端侧与中空通道连通，另一端与真空发生单元相连，形成在内部;以及按压构件35，用于将块32的运动限制到块32与接合工具16之间的连接状态发生变化。版权所有（C）2011，JPO＆INPIT

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