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1. 发明专利

JP2013036810A Sensor module and electronic device 有权
标题翻译：传感器模块和电子设备
公开(公告)号：JP2013036810A
公开(公告)日：2013-02-21
申请号：JP2011171886
申请日：2011-08-05
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KINOSHITA YUSUKE , KOBAYASHI SACHIHIRO
IPC分类号： G01C19/5783 , G01P15/08 , H05K7/14
摘要： PROBLEM TO BE SOLVED: To provide a sensor module capable of increasing mounting area of electronic components compared with a conventional one, without increase in volume.SOLUTION: The sensor module includes: a mounting member 16 having legs 18, 19 and a ceiling 21 connected to one end of each of the legs 18, 19; and electronic components including sensor elements 32, 33. The mounting member 16 includes multiple fixing surfaces having perpendicular vectors not parallel to each other. On at least two of the fixing surfaces 35, 36, the sensor elements 32, 33 are provided, and in a cavity 25 partitioned by the legs 18, 19 and the ceiling 21, at least one of the electronic components is arranged.
摘要翻译：要解决的问题：提供一种能够增加电子部件的安装面积而不增加体积的传感器模块。传感器模块包括：具有腿18,19的安装构件16和连接到每个腿18,19的一端的天花板21; 以及包括传感器元件32,33的电子部件。安装部件16包括具有彼此不平行的垂直矢量的多个固定面。在至少两个固定表面35,36上设置有传感器元件32,33，并且在由腿18,19和天花板21分隔的空腔25中，布置有至少一个电子部件。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2008109676A Crystal device, tuning fork type crystal vibrating chip, and method of manufacturing tuning fork type crystal vibrating chip 有权
标题翻译：晶体装置，调谐型晶振片，以及制造调谐型晶体振动芯片的方法
公开(公告)号：JP2008109676A
公开(公告)日：2008-05-08
申请号：JP2007293579
申请日：2007-11-12
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KINOSHITA YUSUKE , TAKAYAMA KATSUMI , KAWAUCHI OSAMU , TAKEUCHI MANABU
IPC分类号： H03H9/19 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/23 , H01L41/332 , H03H3/02 , H03H9/215
摘要： PROBLEM TO BE SOLVED: To provide a crystal device which is capable of forming an electrode in a precise form without complicating manufacturing steps, and a method of manufacturing the same. SOLUTION: The present invention relates to a crystal device 30 which houses a crystal vibrating chip 40 within a package, wherein electrodes 46, 47 for driving the crystal vibrating chip are formed on a surface including a side face portion 73 of the crystal vibrating chip and slopes 61, 62 are formed in an area wherein the electrodes 46, 47 should be electrically separated, in the side face portion of the crystal vibrating chip. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够精确形成电极而不使制造步骤复杂化的晶体装置及其制造方法。解决方案：本发明涉及一种在封装内容纳晶体振动片40的晶体装置30，其中用于驱动晶体振动片的电极46,47形成在包括晶体的侧面部分73的表面上振动片和斜面61,62形成在晶体振动片的侧面部分中电极46,47应电气分离的区域中。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2006121467A Package structure of piezoelectric device, the piezoelectric device and electronic apparatus 审中-公开
标题翻译：压电器件的压电结构，压电器件和电子设备
公开(公告)号：JP2006121467A
公开(公告)日：2006-05-11
申请号：JP2004307761
申请日：2004-10-22
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KINOSHITA YUSUKE
IPC分类号： H03B5/32 , H01L23/02 , H01L41/09 , H03H9/02
摘要： PROBLEM TO BE SOLVED: To provide a package structure for a piezoelectric device and the piezoelectric device, that is less likely to be influenced by excess solder etc., even if a sealed hole is arranged near the mounting portion.
SOLUTION: This piezoelectric device here is a device 10, wherein an integrated circuit 16 is mounted on the bottom face of a package base 12, a piezoelectric oscillating piece 18 is mounted above the integrated circuit 16, respectively, and a through hole 24 is formed for connecting the interior side and the exterior side of the package base 12. The through hole 24 is so structured as to have a bent part in between an opening, formed in the external side of the package base 12 and an opening formed in the internal side of the package base 12.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使在安装部附近设置有密封孔，也可以提供压电装置和压电装置的封装结构，其不易受多余焊料等的影响。解决方案：这里的压电装置是装置10，其中集成电路16安装在封装基座12的底面上，压电振荡片18分别安装在集成电路16上方，通孔 24形成为用于连接封装基座12的内侧和外侧。通孔24被构造成在形成在封装基座12的外侧的开口和形成的开口之间具有弯曲部分在包装底座12的内侧。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2004153408A Piezoelectric device and its manufacturing method 有权
公开(公告)号：JP2004153408A
公开(公告)日：2004-05-27
申请号：JP2002314321
申请日：2002-10-29
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： TAKEUCHI MANABU , TAKAYAMA KATSUMI , KAWAUCHI OSAMU , KINOSHITA YUSUKE
IPC分类号： H03H9/25 , H01L41/053 , H02N2/00 , H03H3/02 , H03H3/08 , H03H9/02 , H03H9/05 , H03H9/10
CPC分类号： H03H9/1071 , B81B7/0048 , H01L41/053 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/16195 , H03H9/02897 , H03H9/02984 , H03H9/0552 , H03H9/059 , H03H9/1021 , H01L2924/00014 , H01L2924/00 , H01L2224/05624
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric device capable of sharing a package base, and to provide its manufacturing method. SOLUTION: The piezoelectric device 1 is configured such that a piezoelectric vibration chip 10 is mounted on the package base 42 via a TAB tape forming a wiring pattern 30 on the surface of an insulation tape 22. The manufacturing method of the piezoelectric device 1 is configured to include: a first process wherein the piezoelectric vibration chip 10 is mounted on the TAB tape; and a second step wherein the TAB tape 20 with the piezoelectric vibration chip 10 mounted thereon is mounted on the package base 42. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2004096403A Piezoelectric device and manufacturing method thereof, and mobile phone device utilizing piezoelectric device, and electronic equipment 审中-公开
公开(公告)号：JP2004096403A
公开(公告)日：2004-03-25
申请号：JP2002254509
申请日：2002-08-30
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KINOSHITA YUSUKE , TAKAYAMA KATSUMI , KAWAUCHI OSAMU , TAKEUCHI MANABU
IPC分类号： G01C19/56 , G01C19/5628 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/23 , H01L41/313 , H03H3/02 , H03H9/02 , H03H9/10 , G01P9/04
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric device with excellent vibration characteristics by controlling a coating position of an adhesive to adhere a piezoelectric element with high accuracy so as to suppress dispersion in manufacturing even when the piezoelectric device is made small-sized and to provide a manufacturing method thereof, and a mobile phone device and electronic equipment utilizing the piezoelectric device.
SOLUTION: The manufacturing method of the piezoelectric device 10 provided with the piezoelectric element 20 and a package 30 to which part of the piezoelectric element 20 is adhered to be housed, is characterized in that a restriction tool 60 is placed to the piezoelectric element 20 and / or the package 30 and restricts the coating position of the adhesive 40 to adhere the piezoelectric element 20 to the package 30.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2014228489A センサーユニットおよびその製造方法並びに電子機器および運動体有权
标题翻译：传感器单元及其制造方法，电子设备和移动体
公开(公告)号：JP2014228489A
公开(公告)日：2014-12-08
申请号：JP2013110293
申请日：2013-05-24
申请人：セイコーエプソン株式会社 , Seiko Epson Corp
发明人： KINOSHITA YUSUKE , KOBAYASHI SACHIHIRO , SAITO YOSHIKUNI , SAKUMA MASAYASU
IPC分类号： G01C19/5783 , H01L25/10 , H01L25/18
CPC分类号： B23K26/211 , B23K1/0016 , B23K1/0056 , H05K1/117 , H05K1/18 , H05K1/181 , H05K3/3405 , H05K2201/10015 , H05K2201/10022 , H05K2201/10151 , H05K2201/10189 , H05K2201/10446 , H05K2201/1053 , Y02P70/611
摘要：【課題】既存のジャイロパッケージを使用可能とし、小型で低背なセンサーユニットを提供する。【解決手段】センサーユニットはセンサーデバイス23を備える。センサーデバイス23は外面23aに第1の電極24が配置されている。基板12は、互いに表裏関係にある第1面12aおよび第2面12bと側面17とを備える。第1面12aの輪郭に沿って第1の導電端子22が配置されている。センサーデバイス23は、外面23aが基板12の側面17に沿って配置され、第1の電極24が第1の導電端子22に第1導電体26により接続され、かつ、第1面12a側に突出する外面23aの第1突出長さは、第2面12b側に突出する外面23aの第2突出長さよりも小さい。【選択図】図3
摘要翻译：要解决的问题：提供一种能够使现有的陀螺仪包在其中使用并且尺寸和高度减小的传感器单元。解决方案：传感器单元包括传感器装置23.传感器装置23具有设置在第一电极24上的第一电极24 其外表面23a。基板12具有彼此具有前后关系的第一表面12a和第二表面12b以及侧表面17.沿着第一表面12a的轮廓布置第一导电端子22。传感器装置23具有沿着基板12的侧面17配置的外表面23a，第一电极24通过第一导体26与第一导电端子22连接，外表面23a的第一突出长度突出朝向第一表面12a的距离小于朝向第二表面12b突出的外表面23a的第二突出长度。

7. 发明专利

JP2008281586A Support mechanism of oscillator and oscillator unit 有权
标题翻译：振荡器和振荡器单元的支持机制
公开(公告)号：JP2008281586A
公开(公告)日：2008-11-20
申请号：JP2008221029
申请日：2008-08-29
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KINOSHITA YUSUKE
IPC分类号： G01C19/56 , G01P9/04
摘要： PROBLEM TO BE SOLVED: To solve the problem of a conventional support mechanism adapted to stationarily support a gyro oscillator, in which vibration of a driving part and vibration of a detection part are regulated or inhibited. SOLUTION: This mechanism is provided on a substrate for installing the oscillator in order to support through a support part the oscillator including a driving part on which a Coliolis force is applied in the first direction corresponding to rotation given by self-vibration, a detection part vibrating in the second direction which is the same as or vertical to the first direction corresponding to the Coliolis force for detecting the magnitude of the Coliolis force working on the driving part, and the support part for supporting the driving part and the detection part. The characteristic resonance frequency of the vibration along at least one direction of the first direction and the second direction is lower than the characteristic resonance frequency of the vibration along the direction other than the one direction. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：为了解决适用于固定地支撑驱动部的振动和检测部的振动被调节或抑制的陀螺振荡器的常规支撑机构的问题。解决方案：该机构设置在用于安装振荡器的基板上，以便通过支撑部分支撑振荡器，该振荡器包括驱动部分，在该驱动部分上，在对应于由自振产生的旋转的第一方向上施加合力，检测部，其在与用于检测在驱动部上工作的Coliolis力的大小的Coliolis力相同或垂直的第二方向上振动，以及用于支撑驱动部的支撑部和检测部部分。沿着第一方向和第二方向的至少一个方向的振动的特征谐振频率低于除沿一个方向以外的方向的振动的特征共振频率。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2006284373A Piezo-electric device 有权
标题翻译： PIEZO-ELECTRIC DEVICE
公开(公告)号：JP2006284373A
公开(公告)日：2006-10-19
申请号：JP2005104983
申请日：2005-03-31
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KINOSHITA YUSUKE
IPC分类号： G01C19/56 , G01C19/5628 , H01L41/08 , H01L41/18 , H03H9/09
摘要： PROBLEM TO BE SOLVED: To provide a piezo-electric device including a piezo-electric vibrating reeds, such as gyroscope vibrating reeds, with both stable oscillation characteristic and crashworthiness. SOLUTION: Each width of electrode leads 6a and 6b, 6c and 6f, and 6d and 6e of a TAB substrate 4 configuring three pairs of point symmetry to the central point G of an aperture hole 7 coinciding with the central point G at the loading time of a gyroscope vibrating reed 10 is formed to intermingle thick electrode leads 6a and 6b and narrow electrode leads 6c to 6f, by making the lead pairs having positional relation symmetrical with line to both the central line P1 bisecting the aperture hole 7 in the direction of long side through the central point G and the central line P2 bisecting the aperture hole 7 in the direction of short side to be equal. By joining a terminal connecting part formed on the back surface of nearly central part of the gyroscope vibrating reed 10 with the top surface of each apical part of each electrode lead 6a to 6f, the structure supported can be achieved, while forming a gap T to avoid contact of the gyroscope vibrating reed 10 with the TAB substrate except junction. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种压电装置，其包括具有稳定的振荡特性和耐碰撞性的诸如陀螺仪振动片的压电振动簧片。解决方案：将TAB基板4的电极引线6a和6b，6c和6d和6e的每个宽度与中心点G重合的孔眼7的中心点G构成三对点对称的TAB基板4的宽度形成陀螺仪振动片10的装载时间，使厚电极引线6a和6b与窄电极引线6c至6f相互混合，使得具有与线对称的位置关系的引线对与将孔眼7平分的中心线P1 通过中心点G的长边方向和将孔眼7沿短边方向平分的中心线P2相等。通过将形成在陀螺仪振动片10的大致中央部的后表面上的端子连接部与每个电极引线6a〜6f的顶端部的顶面接合，可以实现支撑的结构，同时形成间隙T 避免陀螺仪振动片10与TAB基板的接触以外的接触。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006174370A Mounted body, tab substrate, piezoelectric vibration piece, and piezoelectric device 审中-公开
标题翻译：安装体，TAB基板，压电振动片和压电元件
公开(公告)号：JP2006174370A
公开(公告)日：2006-06-29
申请号：JP2004367830
申请日：2004-12-20
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KINOSHITA YUSUKE
IPC分类号： H03H9/10 , H01L41/09 , H03B5/32
摘要： PROBLEM TO BE SOLVED: To provide a mounted body where a conductive adhesive applied onto electrodes flows out to cause the electrodes to short-circuit, a TAB substrate, a piezoelectric vibration piece, and a piezoelectric device.
SOLUTION: The piezoelectric device 10 includes: a package 18 with a mount electrode 26, the conductive adhesive 24 which is applied onto the mount electrode 26; the TAB substrate 14 which is provided with a connection electrode 20 with a means of making the conductive adhesive 24 flow to a top surface side on a reverse surface at a position corresponding to the mount electrode 26 and mounted on the mount electrode 26; and a piezoelectric vibration piece 12 which is mounted on the top surface of the TAB substrate 14 while electrically connected to the connection electrode 20.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种安装在电极上的导电粘合剂流出以使电极短路的安装体，TAB基板，压电振动片和压电元件。解决方案：压电装置10包括：具有安装电极26的封装18，施加到安装电极26上的导电粘合剂24; 设置有连接电极20的TAB基板14，其具有使导电粘合剂24在与安装电极26对应的位置的反面上流到顶面侧的装置，并安装在安装电极26上; 以及压电振动片12，其安装在TAB基板14的顶表面上，同时电连接到连接电极20.版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005010034A Piezoelectric device, manufacturing method of piezoelectric device, and electronic equipment with piezoelectric device mounted thereon 有权
标题翻译：压电器件，压电器件的制造方法以及其中安装有压电器件的电子设备
公开(公告)号：JP2005010034A
公开(公告)日：2005-01-13
申请号：JP2003175020
申请日：2003-06-19
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KINOSHITA YUSUKE
IPC分类号： G01C19/00 , G01C19/04 , G01C19/56 , G01C19/5628 , H01L41/053 , H01L41/08 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/29 , G01P9/04
CPC分类号： G01C19/56 , Y10T29/42 , Y10T29/435 , Y10T29/49005 , Y10T29/49169 , Y10T29/49174
摘要： PROBLEM TO BE SOLVED: To solve a problem that forming work for a lead wire is required, when joining the lead wire for holding a piezoelectric vibration piece to a package, in a piezoelectric device. SOLUTION: This piezoelectric device of the present invention is constituted of the piezoelectric vibration piece, the lead wire with one end connected to the piezoelectric vibration piece to hold the piezoelectric vibration piece, and a support substrate for supporting the lead wire, of which the vicinity of the other end is fixed onto a face brought into an obverse and reverse relation with respect to a face opposed to the vibration piece. COPYRIGHT: (C)2005,JPO&NCIPI

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