专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2013019825A Sensor device and electronic apparatus 有权
标题翻译：传感器和电子设备
公开(公告)号：JP2013019825A
公开(公告)日：2013-01-31
申请号：JP2011154502
申请日：2011-07-13
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： SAKUMA MASAYASU , KOBAYASHI SACHIHIRO , KITAMURA SHOJIRO , KAYANO TAKEHITO
IPC分类号： G01C19/5628 , H01L41/08 , H01L41/09 , H01L41/18
CPC分类号： G01D11/245 , G01C19/5769 , G01C21/16 , G01D11/30
摘要： PROBLEM TO BE SOLVED: To provide a sensor device in which an electronic component can be positioned easily and accurately while attaining reduction in size, and an electronic apparatus.SOLUTION: A sensor device 1 comprises a fixing member 3 including fixing surfaces 101, 102 inside and at least one electronic component 7 which is fixed directly or indirectly on the fixing surfaces 101, 102 of the fixing member 3. The fixing member 3 constitutes a part of a casing 10 that accommodates the electronic component 7 therein. Furthermore, the fixing surfaces 101, 102 are orthogonal to each other.
摘要翻译：要解决的问题：提供一种传感器装置，其中电子部件可以容易且准确地定位，同时减小尺寸，以及电子设备。解决方案：传感器装置1包括固定构件3，固定构件3包括内部的固定表面101,102和至少一个直接或间接固定在固定构件3的固定表面101,102上的电子部件7.固定构件图3构成容纳电子部件7的壳体10的一部分。此外，固定面101,102彼此正交。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013019745A Sensor device and electronic apparatus 有权
标题翻译：传感器和电子设备
公开(公告)号：JP2013019745A
公开(公告)日：2013-01-31
申请号：JP2011152731
申请日：2011-07-11
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： SAKUMA MASAYASU , KOBAYASHI SACHIHIRO , KITAMURA SHOJIRO , KAYANO TAKEHITO , IMAI NOBUYUKI
IPC分类号： G01C19/5628 , G01P15/08 , H05K7/14
CPC分类号： G01C19/5783 , G01P1/00 , G01P15/02 , G01P15/097 , G01P15/18
摘要： PROBLEM TO BE SOLVED: To provide a sensor device and an electronic apparatus capable of simply and accurately positioning an electronic component while achieving reduction in size.SOLUTION: A sensor device 1 includes: a mounting substrate 2 having a first rigid substrate 21 on which an angular velocity sensor 711 is mounted, and a third rigid substrate 23 on which an annular speed sensor 712 is mounted; and a pedestal 3 which fixes the mounting substrate 2. Moreover, the pedestal 3 includes: a base part 31 having a first fixing surface along an x-axis and a y-axis; and protrusions 41 to 44 which are provided on the base part 31 and have at least one of a second fixing surface along the x-axis and the y-axis and a third fixing surface along the y-axis and a z-axis. Each of rigid substrates 21, 22 and 23 is supported by the first fixing surface, the second fixing surface or the third fixing surface, and the annular speed sensors 711 and 712 have detection axes crossing to each other.
摘要翻译：要解决的问题：提供能够简单且准确地定位电子部件同时实现尺寸减小的传感器装置和电子设备。传感器装置1包括：安装基板2，其具有安装有角速度传感器711的第一刚性基板21和安装有环形速度传感器712的第三刚性基板23; 以及固定安装基板2的台座3.此外，基座3包括：具有沿x轴和y轴的第一固定面的基部31; 以及设置在基部31上并具有沿着x轴和y轴的第二固定面和沿着y轴和z轴的第三固定面中的至少一个的突起41〜44。每个刚性基板21,22和23由第一固定表面，第二固定表面或第三固定表面支撑，并且环形速度传感器711和712具有彼此交叉的检测轴。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013019826A Circuit board, sensor module, and electronic apparatus 审中-公开
标题翻译：电路板，传感器模块和电子设备
公开(公告)号：JP2013019826A
公开(公告)日：2013-01-31
申请号：JP2011154503
申请日：2011-07-13
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KAYANO TAKEHITO , SAKUMA MASAYASU , KITAMURA SHOJIRO
IPC分类号： G01C19/5628 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide a circuit board, a sensor module and an electronic apparatus, which can have excellent reliability while decreasing in size.SOLUTION: A sensor module 1 includes: a mounting board 4 having an analog circuit part 421 formed on an undersurface 42 and a digital circuit part 411 formed on an upper surface 41; a circuit board 2 where two angular velocity sensors 712, 713 provided on the side of the undersurface 42 of the mounting board 4 are placed in a direction perpendicular to the mounting board 4; and a pedestal 3 which is arranged in a manner to face to the undersurface 42 of the mounting board 4 and which supports the circuit board 2.
摘要翻译：要解决的问题：提供一种在尺寸减小的同时具有优异的可靠性的电路板，传感器模块和电子设备。传感器模块1包括：安装板4，其具有形成在下表面42上的模拟电路部分421和形成在上表面41上的数字电路部分411; 设置在安装板4的下表面侧的两个角速度传感器712,713的电路板2沿垂直于安装板4的方向放置; 以及底座3，其以与安装板4的下表面42相对并且支撑电路板2的方式布置。版权所有：（C）2013，JPO＆INPIT

4. 发明专利

JP2009303173A Frequency tuning method of saw device and method of manufacturing saw device 审中-公开
标题翻译： SAW器件的频率调谐方法及制造SAW器件的方法
公开(公告)号：JP2009303173A
公开(公告)日：2009-12-24
申请号：JP2008158429
申请日：2008-06-17
申请人： Epson Toyocom Corp , Seiko Epson Corp , エプソントヨコム株式会社 , セイコーエプソン株式会社
发明人： TAKADA YUTAKA , SAKUMA MASAYASU
IPC分类号： H03H3/10
摘要： PROBLEM TO BE SOLVED: To provide a frequency tuning method of a SAW device which improves frequency accuracy by minimizing a voltage standing wave ratio, and to provide a method of manufacturing the SAW device.
SOLUTION: The frequency tuning method of a SAW device is to carry out coarse frequency tuning that makes the insertion loss at the target frequency of a SAW device a predetermined value or lower, and thereafter to carry out fine frequency tuning that makes the voltage standing wave ratio at the target frequency of the SAW device minimum. The fine frequency tuning uses any one of the following: to minimize the sum of the voltage standing wave ratio measured in the input side of the SAW device and the voltage standing wave ratio measured in the output side; to minimize the voltage standing wave ratio measured in the input side; and to minimize the voltage standing wave ratio measured in the output side.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种SAW器件的频率调谐方法，其通过最小化电压驻波比来提高频率精度，并提供制造SAW器件的方法。解决方案：SAW器件的频率调谐方法是执行使SAW器件的目标频率处的插入损耗为预定值或更低的粗略的频率调谐，然后进行精细的频率调谐，使得在SAW器件的目标频率下的电压驻波比最小。微调频率调谐使用以下任何一种：最小化在SAW器件的输入侧测量的电压驻波比与在输出侧测量的电压驻波比的和; 以最小化在输入侧测量的电压驻波比; 并使输出侧测得的电压驻波比最小化。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2014228489A センサーユニットおよびその製造方法並びに電子機器および運動体有权
标题翻译：传感器单元及其制造方法，电子设备和移动体
公开(公告)号：JP2014228489A
公开(公告)日：2014-12-08
申请号：JP2013110293
申请日：2013-05-24
申请人：セイコーエプソン株式会社 , Seiko Epson Corp
发明人： KINOSHITA YUSUKE , KOBAYASHI SACHIHIRO , SAITO YOSHIKUNI , SAKUMA MASAYASU
IPC分类号： G01C19/5783 , H01L25/10 , H01L25/18
CPC分类号： B23K26/211 , B23K1/0016 , B23K1/0056 , H05K1/117 , H05K1/18 , H05K1/181 , H05K3/3405 , H05K2201/10015 , H05K2201/10022 , H05K2201/10151 , H05K2201/10189 , H05K2201/10446 , H05K2201/1053 , Y02P70/611
摘要：【課題】既存のジャイロパッケージを使用可能とし、小型で低背なセンサーユニットを提供する。【解決手段】センサーユニットはセンサーデバイス23を備える。センサーデバイス23は外面23aに第1の電極24が配置されている。基板12は、互いに表裏関係にある第1面12aおよび第2面12bと側面17とを備える。第1面12aの輪郭に沿って第1の導電端子22が配置されている。センサーデバイス23は、外面23aが基板12の側面17に沿って配置され、第1の電極24が第1の導電端子22に第1導電体26により接続され、かつ、第1面12a側に突出する外面23aの第1突出長さは、第2面12b側に突出する外面23aの第2突出長さよりも小さい。【選択図】図3
摘要翻译：要解决的问题：提供一种能够使现有的陀螺仪包在其中使用并且尺寸和高度减小的传感器单元。解决方案：传感器单元包括传感器装置23.传感器装置23具有设置在第一电极24上的第一电极24 其外表面23a。基板12具有彼此具有前后关系的第一表面12a和第二表面12b以及侧表面17.沿着第一表面12a的轮廓布置第一导电端子22。传感器装置23具有沿着基板12的侧面17配置的外表面23a，第一电极24通过第一导体26与第一导电端子22连接，外表面23a的第一突出长度突出朝向第一表面12a的距离小于朝向第二表面12b突出的外表面23a的第二突出长度。

6. 发明专利

JP2012251801A Module and electronic apparatus 有权
标题翻译：模块和电子设备
公开(公告)号：JP2012251801A
公开(公告)日：2012-12-20
申请号：JP2011122790
申请日：2011-05-31
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： SAKUMA MASAYASU , KOBAYASHI SACHIHIRO , KITAMURA SHOJIRO , KAYANO TAKEHITO , KOGAMI MICHIHARU
IPC分类号： G01C19/5628 , G01P15/08
CPC分类号： G01D11/30 , G01C19/5783 , G01D11/245 , G01P1/00 , G01P1/02 , G01P1/023 , G01P1/026 , G01P15/18
摘要： PROBLEM TO BE SOLVED: To provide a module and an electronic apparatus that have high reliability and are small in size and thickness, and that are capable of exhibiting superior detection accuracy.SOLUTION: A module 1 includes a sensor device 4, a mounting substrate 2 that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, and a supporting member 3 having a plurality of fixing faces 31-35, in which the sensor device 4 is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces 31-35, and the sensor device 4 is disposed on the supporting member 3 side.
摘要翻译：要解决的问题：提供具有高可靠性并且尺寸和厚度小的模块和电子设备，并且能够表现出优异的检测精度。解决方案：模块1包括传感器装置4，安装基板2，其具有多个安装面，彼此相邻的安装面之间的部分是可折叠的;以及支撑构件3，其具有多个固定面如图31-35所示，其中传感器装置4安装在至少一个安装面上，每个安装面沿着每个固定面31-35设置，并且传感器装置4设置在支撑构件3上侧。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013019746A Electronic device and electronic apparatus 有权
标题翻译：电子设备和电子设备
公开(公告)号：JP2013019746A
公开(公告)日：2013-01-31
申请号：JP2011152732
申请日：2011-07-11
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： SAKUMA MASAYASU , KOBAYASHI SACHIHIRO , KITAMURA SHOJIRO , KAYANO TAKEHITO
IPC分类号： G01C19/5628 , G01P15/08 , H01L23/02 , H01L23/04 , H01L23/08 , H01L25/04 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To provide an electronic device and an electronic apparatus capable of simply and accurately positioning an electronic component while achieving reduction in size.SOLUTION: An electronic device 1 comprises a mounting substrate 2, a pedestal 3 and a lid member 8. Then, the pedestal 3 has a first support part 32 which supports a first rigid substrate 21 included in the mounting substrate 2, and a second support part 33 which supports a second rigid substrate 22 included in the mounting substrate 2 so that the thickness direction thereof becomes perpendicular to the thickness direction of the first rigid substrate 21. Moreover, the lid member 8 has a third support part 82 which supports a third rigid substrate 23 included in the mounting substrate 2 inside thereof.
摘要翻译：要解决的问题：提供能够简单且准确地定位电子部件同时实现尺寸减小的电子设备和电子设备。电子设备1包括安装基板2，基座3和盖构件8.然后，基座3具有支撑安装基板2中包括的第一刚性基板21的第一支撑部32，以及第二支撑部33，其支撑包括在安装基板2中的第二刚性基板22，使得其厚度方向与第一刚性基板21的厚度方向垂直。此外，盖部件8具有第三支撑部82，支撑在其内部的安装基板2中包括的第三刚性基板23。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012251803A Module and electronic apparatus 有权
标题翻译：模块和电子设备
公开(公告)号：JP2012251803A
公开(公告)日：2012-12-20
申请号：JP2011122792
申请日：2011-05-31
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： SAKUMA MASAYASU , KOBAYASHI SACHIHIRO , KITAMURA SHOJIRO , KAYANO TAKEHITO , KOGAMI MICHIHARU
IPC分类号： G01C19/5783 , G01P1/02 , G01P15/08 , H05K1/14
CPC分类号： G01C19/5783
摘要： PROBLEM TO BE SOLVED: To provide a module which allows achieving an excellent reliability by suppressing generation of noise and has a high degree of freedom in arrangement of a sensor element and to provide an electronic apparatus.SOLUTION: A module 1 comprises: a first rigid substrate 21 provided with an analog circuit; a second rigid substrate 22 provided with a digital circuit; a third rigid substrate 23 provided with an angular velocity sensor 412; a first connection part 261 which connects the first rigid substrate 21 and the second rigid substrate 22 so as to electrically connect the analog circuit and the digital circuit and has flexibility; and a second connection part 262 which connects the first rigid substrate 21 and the third rigid substrate 23 so as to electrically connect the analog circuit and the angular velocity sensor 412 and has flexibility.
摘要翻译：要解决的问题：提供一种通过抑制噪声产生而获得优异的可靠性的模块，并且具有传感器元件的布置的高自由度并提供电子设备。解决方案：模块1包括：设置有模拟电路的第一刚性基板21; 设置有数字电路的第二刚性基板22; 设置有角速度传感器412的第三刚性基板23; 第一连接部261，其连接第一刚性基板21和第二刚性基板22，以便电连接模拟电路和数字电路，并具有灵活性; 以及第二连接部262，其连接第一刚性基板21和第三刚性基板23，以电连接模拟电路和角速度传感器412，并且具有灵活性。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2007096645A Microwave generating device and equipment using same 审中-公开
标题翻译：微波发生装置和使用相同的设备
公开(公告)号：JP2007096645A
公开(公告)日：2007-04-12
申请号：JP2005282116
申请日：2005-09-28
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MATSUMOTO YOSHIAKI , KARASAWA HIDEO , KONUKI MASAHIRO , SAKUMA MASAYASU
IPC分类号： H03B5/30 , H05B6/66
CPC分类号： H05B6/68
摘要： PROBLEM TO BE SOLVED: To provide a microwave generating device which is made compact and lightweight and generates no unnecessary radiation, and equipment using the same. SOLUTION: The microwave generating device 10 is equipped with a diamond SAW oscillator 20 which outputs a high-frequency signal, a first amplifier 16 which amplifies and outputs the high-frequency signal input from the diamond SAW oscillator 20, a high-frequency power source part 12 equipped with a power source 18 supplying electric power to the diamond SAW oscillator 20 and first amplifier 16, and a waveguide means 14 of radiating the high-frequency signal input from the high-frequency power source part 12 as a microwave. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种紧凑且重量轻并且不产生不必要的辐射的微波产生装置，以及使用该微波产生装置的设备。解决方案：微波发生装置10配备有输出高频信号的金刚石SAW振荡器20，放大并输出从金刚石SAW振荡器20输入的高频信号的第一放大器16，配备有向金刚石SAW振荡器20和第一放大器16供电的电源18的高频电源部12以及从高频电源部12输入的高频信号作为微波的波导装置14 。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2007095452A Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007095452A
公开(公告)日：2007-04-12
申请号：JP2005282112
申请日：2005-09-28
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KARASAWA HIDEO , MATSUMOTO YOSHIAKI , KONUKI MASAHIRO , SAKUMA MASAYASU , TAKADA YUTAKA
IPC分类号： H05B41/24 , H01J65/04
CPC分类号： H05B41/24
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device used for generating light by using microwaves without having undesired radiation and reduced in size and weight. SOLUTION: This light emitting device 10 has a structure provided with: a light emitter 12 filled with a gas emitting light by microwaves; a high-frequency power supply part 30 having a diamond SAW oscillator 40 for outputting a high-frequency signal output from the diamond SAW oscillator 40 to a subsequent stage; and a waveguide means 20 for radiating the high-frequency signal input from the high-frequency power supply part 30 toward the light emitter 12 as microwaves. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于通过使用微波而不产生不期望的辐射并且减小尺寸和重量而产生光的发光装置。解决方案：该发光器件10具有如下结构：发光体12，其通过微波填充气体发射的光; 具有用于将从金刚石SAW振荡器40输出的高频信号输出到后级的金刚石SAW振荡器40的高频电源部30; 以及用于将从高频电源部30输入的高频信号作为微波照射到发光体12的波导装置20。版权所有（C）2007，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式