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    • 1. 发明专利
    • Method for manufacturing very thin wall seamless metal pipe by cold-rolling
    • 通过冷轧制造非常薄壁无缝金属管的方法
    • JP2006326652A
    • 2006-12-07
    • JP2005154836
    • 2005-05-27
    • Sumitomo Metal Ind Ltd住友金属工業株式会社
    • HAYASHI CHIHIRO
    • B21B19/06B21B23/00B21B25/00
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of a very thin wall seamless metal pipe by a cold-rolling process using an inclined rolling method, which manufacturing method can remarkably extend the manufacturable range of the seamless metal pipe to the thin wall side.
      SOLUTION: The method for manufacturing the very thin wall seamless metal pipe employs an inclined rolling mill in a cold-rolling process of the seamless metal pipe. In the method, remarkable thickness reduction can be achieved by reducing the wall thickness, while extending the diameter of a mother pipe, using a plug or a tapered mandrel as an inner surface restricting tool. Especially, the very thin wall seamless metal pipe having a wall thickness of about 0.5 to 0.6 mm can be relatively easily obtained by reheating the small diameter thin wall seamless metal pipe manufactured by a hot-rolling process, and by hot-rolling the thin wall seamless metal pipe using the inclined rolling mill so as to extend its diameter, and by carrying out a cold-rolling operation again using the inclined rolling mill for the thin wall seamless metal pipe as a mother pipe so as to extend its diameter.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了通过使用倾斜轧制法的冷轧方法来提供非常薄壁无缝金属管的制造方法,该制造方法可以将无缝金属管的可制造范围显着地扩大到薄 墙边。 解决方案:制造非常薄壁无缝金属管的方法在无缝金属管的冷轧过程中采用倾斜轧机。 在该方法中,通过使用塞子或锥形心轴作为内表面限制工具,通过减小壁厚,同时延长母管的直径,可以实现显着的厚度减小。 特别地,通过对由热轧工艺制造的小直径薄壁无缝金属管进行再加热,可以相对容易地获得壁厚为约0.5至0.6mm的非常薄的壁无缝金属管,并且通过热轧薄壁 使用倾斜轧机的无缝金属管,以使其直径延伸,并且通过使用用于薄壁无缝金属管的倾斜轧机作为母管再次进行冷轧操作,以使其直径延伸。 版权所有(C)2007,JPO&INPIT
    • 4. 发明专利
    • METHOD AND APPARATUS FOR FABRICATING FIN TYPE HEAT SINK
    • JPH06224335A
    • 1994-08-12
    • JP845293
    • 1993-01-21
    • SUMITOMO METAL IND
    • SHINOHARA KENJIROHAYASHI CHIHIRO
    • H01L23/36
    • PURPOSE:To securely take out a molded article on which fin-shaped protrusions are formed by a casting method from a metal mold and hereby mold a pin fin type sink by fixing the molded article in the direction of the movement of the metal mold with use of a fixing member actuated in response to the operation of the metal mold upon taking out the molded article from the metal mold. CONSTITUTION:A flat plate raw arterial 11 is restricted in the direction of a certain flat plane (a). Then, a male type molding metal mold 12 having many molding holes formed therein is moved onto the upper surface of the raw material 11 and is pushed into the same to mold the raw material 11 and fin-shaped protrusions 13 (b). Further, the male type molding metal mold 12 is separated any from a molded article 16 on which the fin-shaped protrusions 13 are formed by moving the male type molding metal mold 12 in the state where the entire or part of an external edge of the molded article 11 by making use of a molded article fixing jig 14 which is capable of moving an external edge of a molded article 16 on which the fin-shaped protrusions are formed in the direction of the movement of the male type molding metal mold 12 (c). The molded article fixing jig 14 is moved and a knock out pin 15 is lifted whereby restriction to the molded article 16 is all released.
    • 8. 发明专利
    • MANUFACTURE OF INTEGRATED CIRCUIT PACKAGE
    • JPS63314854A
    • 1988-12-22
    • JP15083387
    • 1987-06-17
    • SUMITOMO METAL IND
    • KOJIMA MASAYASUHAYASHI CHIHIRO
    • H01L23/02H01L23/06
    • PURPOSE:To provide a semiconductor chip package having improved shock resistance and capable of quickly dissipating heat generated in the semiconductor chip, by eliminating any projecting part of the package which impedes transfer thereof while flattening the periphery on which a lead frame is mounted indepen dently from depth of a recess in which the semiconductor chip is mounted or of thicknesses of used metallic plates. CONSTITUTION:A package 16 for an integrated circuit has a double structure in which upper and lower plates 16a and 16b are joined with each other at an interface 40. Any part of the package 16 that may be brought into contact with a lead frame (not shown in the figure) to be carried thereon is electrically insulated with a metal oxide layer or the like. The insulated parts are the periphery 32 on which the lead frame is mounted, and the longer sides and the rear faces 33 of the upper and lower plates 16a, 16b to which the lead frame is put closed. Thicknesses of the upper and lower plates 16a and 16b are ta and tb, respectively, and lengths of long and short sides thereof are land b, respectively. The package 16 is thus allowed to have improved resistance to shock and to quickly dissipate any heat generated in a semiconductor chip.