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    • 2. 发明专利
    • ANGLE MEASUREMENT METHOD AND DEVICE THEREFOR
    • JPH0743131A
    • 1995-02-10
    • JP18837393
    • 1993-07-29
    • SHARP KK
    • SHIMONAKA ATSUSHIMORIOKA TATSUYAKASAI SHUSUKETANETANI MOTOTAKATAKIGUCHI HARUHISA
    • G01B11/26
    • PURPOSE:To measure the inclination angle of a measurement object with simple constitution by receiving two coherent beams having angles different from each other, and detecting a signal intensity change corresponding to the light interference fringe on a light receiving element. CONSTITUTION:Coherent beams emitted from a semiconductor laser (GaAlAs laser) 1 are collimated at a step 2, and incident on a translucent mirror 13. Approximately a half of incident beams are reflected on a plane 131, and the remanent thereof is transmitted through the mirror 13 for reflection with a measurement object 8. Furthermore, the reflected beams are respectively incident on a light receiving element 11 and superposed (i.e., shaded portion 14), thereby forming an interference fringe. When the laser 1 is actuated to generate triangular pulses, beat signal current is excited in the shaded portion 14 on the element 11. Also, the amplitude of the beat signal current is suddenly reduced, when the object 8 is inclined. The angle of the object 8 can, therefore, be detected from the variation of the amplitude. In this case, the element 11 is arrayed and positioned in three directions to enlarge the length thereof, thereby enabling light intensity to be maintained. Furthermore, an absolute angle of zero can be easily detected by processing signals from the three-directional element 11.
    • 6. 发明专利
    • SEMICONDUCTOR LASER
    • JPH04120788A
    • 1992-04-21
    • JP24171590
    • 1990-09-11
    • SHARP KK
    • INOGUCHI KAZUHIKOTAKIGUCHI HARUHISAATSUNUSHI FUMIHIROOKUMURA TOSHIYUKI
    • H01S5/00
    • PURPOSE:To form an active layer having a narrow width with high reproducibility by providing a double hetero structure multilayer film including a laser oscillation active layer having smaller width than that of a stripelike protrusion, and current constriction means formed on the surface region or the surface of a semiconductor substrate. CONSTITUTION:The sides (in planes {221} and {111}) of a stripelike protrusion 11 and the surfaces in plane (100) of an n-type InP substrate 10 at both sides are all covered with Fe-doped InP layers 14. Thereafter, an Al2O3 stripelike mask 17 is removed by using HF solution to obtain an n-type InP substrate 10 having a current constriction structure. In this case, the layer 14 has a high resistance, and is operated as a function of a semi-insulating current constriction layer. An Si-doped n-type InP thin film 12' and a nondoped GalnAsP thin film 13' are sequentially grown, a trapezoidal sectional shape perpendicular to the direction of a resonator is formed on the protrusion 11, and a multilayer film of a double hetero structure surrounded by a B surface in plane (111), i.e., multilayer films of the B surface in plane (111) grown from both ends of the protrusion 11 on its oblique surfaces are formed on the protrusion 11.
    • 10. 发明专利
    • SEMICONDUCTOR LASER DEVICE
    • JPH0252481A
    • 1990-02-22
    • JP20423188
    • 1988-08-17
    • SHARP KK
    • KUDO HIROAKITAKIGUCHI HARUHISASAKANE CHITOSESUGAWARA SATOSHI
    • H01S5/00H01S5/12H01S5/24
    • PURPOSE:To obtain a connection efficiency which is equivalent to or more than a conventional secondary diffraction grid also in a third diffraction grid by setting the ratio of width between projecting parts of recessed and projecting parts for a period of recesses and projecting areas within a specific range. CONSTITUTION:Periodical recesses and projecting parts are formed at the interface between an n-type light guiding layer 6 and an n-type clad layer 7 to form a diffraction grid 12. The periodical recessed and projecting parts of this diffraction grid 12 are periodically continuous in the direction and the groove formed by these periodical recessed and projecting parts extends in the direction. The period of the recessed and projecting parts is set so that the diffraction grid may be the third one. A connection efficiency (k) due to difference of a duty ratio (W/LAMBDA) when the period of the diffraction grid is set to LAMBDA(3000Angstrom ) and the width of a projecting part 12a of the diffraction grid is set so that the duty ratio (W/LAMBDA) is formed to be closer to 0.20, 0.5, and 0.8 with the height H of the diffraction grid 12 being 1000Angstrom . Namely, the ratio of width of the projecting part of recessed and projecting parts for the period of the recessed and projecting parts stays within the range of 0.20-0.25, 0.40-0.60, and 0.70-0.95. At this time, even in a third rectangular waveform diffraction grid, a sufficient connection efficiency applied to a semiconductor laser device can be obtained.