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    • 2. 发明专利
    • JPH05299781A
    • 1993-11-12
    • JP10679292
    • 1992-04-24
    • SHARP KK
    • HOSODA MASAHIROTSUNODA ATSUISATANI KENTAROSUGA YASUOTAKAHASHI KOUSEI
    • H01L33/06H01L33/14H01L33/30H01S5/00H01S3/18H01L33/00
    • PURPOSE:To provide a semiconductor device which is capable of reducing a drive current without increasing a drive voltage and being manufactured with a minimum process. CONSTITUTION:Amphoteric impurities are doped on a semiconductor layer formed on both sides of a mesa stripe section of a p-type clad layer 4. As a crystal surface of a mixed crystal differs on the side surfaces 10 of a mesa stripe section and other surfaces 11 excluding the mesa stripe section in the p-type clad layer, semiconductor laminated layers 6 and 7 formed on the p-type clad layer 4 are turned into p-type semiconductor layers 6a and 7b on the both side surfaces and n-type semiconductor layers 6a and 7a on the surfaces except for the mesa stripe section by impurities. Therefore, the width of the bottom of the mesa stripe section is limited by the n type semiconductor layers 6a and 7a so that a current injection width may be narrowed. Although this reduction in the current injection width reduces the injection current as well, an opening area in the upper part of the mesa stripe section is widened substantially. It is, therefore, possible to prevent an increase in the drive voltage.
    • 4. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR LASER ELEMENT
    • JPH04162584A
    • 1992-06-08
    • JP28809390
    • 1990-10-24
    • SHARP KK
    • HOSODA MASAHIROTAKAHASHI KOUSEISUGA YASUOTSUNODA ATSUISATANI KENTAROMATSUI KANEKI
    • H01S5/00
    • PURPOSE:To enhance the output of an element and to improve mass productivity by etching a part corresponding to the end of a resonator of an AlGaInP DH structure having an AlGaAs crystal on an uppermost layer until a lower AlGaInP clad layer is exposed, and then burying the etched region with the AlGaAs crystal having transparent composition for an oscillation wavelength by an MBE method. CONSTITUTION:An n-type (Al0.7Ga0.3)0.5In0.5P lower clad layer 11, a Ga0.5In0.5P active layer 12, a p-type (Al0.7Ga0.3)0.5PIn0.5P upper clad layer 13, and a P-type GaAs protective layer 14 are laminated on an n-type GaAs substrate 10 to form a DH structure, and a part 20 corresponding to a light emitting end face is dug so as to reach the lower clad layer. Then, this wafer is introduced into an MBE unit, and heated while irradiating it with an As molecular beam. In this case, P atoms are substituted with As atoms at the exposed lower clad layer 31, the side face 32 to form a modified layer. Then, a p-type Al0.55Ge0.45As window layer 15 transparent for an oscillation wavelength is grown until a groove 20 is buried, and a p-type GaAs contact layer 16 is laminated.
    • 6. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR LASER ELEMENT
    • JPS63271991A
    • 1988-11-09
    • JP10561187
    • 1987-04-28
    • SHARP KK
    • SUYAMA NAOHIROTAKAHASHI KOUSEIKONDO MASAFUMIHAYAKAWA TOSHIRO
    • H01S5/00
    • PURPOSE:To enable forming a junction region of a low resistance electrode and a semiconductor without the diffusion of impurities by burying a multilayered crystal structure by growing a plurality of buried layers on the mesa type side of the multilayered crystal structure. CONSTITUTION:After a growth layer is formed with a multilayered structure consisting of at least the first clad layer 2, an active layer 3, the second clad layer 4, a cap layer 5 and a growth blocking layer 6 at the time of the first growth, when the multilayered structure is etched to from a mesa, the width of a mesa is made narrower by selectively etching the cap layer 5 excessively than the adjacent second clad layer 4 and the growth blocking layer 6. At the time of burying and growing, the interface of the last layer 13 of a plurality of buried layers and a layer 12 immediately before the last layer 13 is made nearly coincide with the interface of the second clad layer 4 and the cap layer 5 of a mesa region and simultaneously, the buried last layer 13 and the cap layer 5 of the mesa region are formed to be made a continuous one layer. This enables forming a low resistance electrode in a buried type semiconductor laser without the diffusion process of a impurities and obtaining a laser oscillation at a low voltage.
    • 8. 发明专利
    • SEMICONDUCTOR LASER
    • JPS63150985A
    • 1988-06-23
    • JP29817486
    • 1986-12-15
    • SHARP KK
    • HAYAKAWA TOSHIROSUYAMA NAOHIROTAKAHASHI KOUSEIKONDO MASAFUMI
    • H01S5/00H01S5/227
    • PURPOSE:To extremely reduce a current to an ultralow value by forming a second conductivity type semiconductor layer of the thickness sufficient to compensate a generated step on a first conductivity type semiconductor substrate having a mesa region for narrowing a current, and burying an oscillation region with a high resistance layer and a multilayer buried layer including the first conductivity type semiconductor layer on the layer. CONSTITUTION:A stripelike mesa 20 is formed on a P-type GaAs substrate 11. Then, the top surface of the mesa 20 is exposed on a tellurium (Te)-doped N-type GaAs current blocking layer 12. A beryllium-doped clad layer 13, a GRIN layer (optical guide layer) 14, an undoped quantum well layer (active region) 15, a GIRN layer (optical guide layer) 16, a silicon (Si)-doped clad layer 17, an Si-doped cap layer 18 are sequentially continuously grown. Here, an undoped buried layer 21, a magnesium (Mg)-doped P-type buried layer 22, and a tellurium-doped N-type cap layer 23 are so sequentially grown as to bury the oscillation regions 13-18 formed in a mesa stripelike state by so etching as to arrive at the surface of the layer 12. An AuGe/Ni layer is deposited thereon, and an AuZn layer is deposited to be alloyed on the substrate 11.
    • 9. 发明专利
    • SEMICONDUCTOR LASER ELEMENT
    • JPS62193192A
    • 1987-08-25
    • JP3572186
    • 1986-02-19
    • SHARP KK
    • TAKAHASHI KOUSEIHAYAKAWA TOSHIROSUYAMA NAOHIROKONDO MASAFUMIYAMAMOTO SABURO
    • H01S5/00H01S5/20H01S5/22H01S5/34H01S5/343
    • PURPOSE:To entrap intensive light while improving the carrier injecting efficiency, by constituting at least one of optical guide layers by overlaying alternately two specific types of AlGaAs layers such that the an optical refractive index thereof is increased progressively toward the outside. CONSTITUTION:A clad layer of N-type AlGaAs (x=0.7) 22, a GRIN guide layer of non-doped AlAs/GaAs superlattice 23, a quantum well active layer of non-doped AlGaAs (x=0.2) 24, a GRIN guide layer of non-doped A As/GaAs superlattice 25, a clad layer of P-type AlGaAs (x=0.7) 26, a cap layer of P-type GaAs 27 and a current blocking layer of N-type AlGaAs 28 are grown on an N-type GaAs substrate 21 sequentially in that order. an average of crystal mixing ratios, xeff=LB/(LB+LZ) of a superlattice in which the AlAs layers 26 having a thickness LB and the GaAs layers 28 having a thickness LZ are overlaid alternately is fixed, and the crystal mixing ratio xeff is increased progressively from the region contacted with the active layer toward the outside so as to increase the optical refractive index according thereto. Laser beams are thereby entrapped and, at the same time therewith, the carrier injecting efficiency can be improved.
    • 10. 发明专利
    • SEMICONDUCTOR LASER ELEMENT
    • JPS6297390A
    • 1987-05-06
    • JP24018585
    • 1985-10-23
    • SHARP KK
    • SUYAMA NAOHIROTAKAHASHI KOUSEIYAMAMOTO SABUROHAYAKAWA TOSHIROKONDO MASAFUMI
    • H01S5/00
    • PURPOSE:To form a semiconductor laser element having a refractive index waveguide mechanism, which can be manufactured by an MBE method, when a super-lattice structure is grown on a substrate having a stripe shaped groove, by utilizing tendency that the super-lattice structure offsets groove-shaped irregularities when the width of the groove is narrowed. CONSTITUTION:The pitch of grooves on an irregular surface 2 is made very small. The average thickness of a lightguide layer 4 directly on the irregular surface 2 is thicker than the parts of the lightguide layer 4 at the outer flat surface. Therefore, the refractive index distribution in the parallel direction with an active layer 7 is large at a part directly on the irregular surface 2. The distribution on both sides is small. Thus, a refractive index waveguide is formed within the active layer 7. In this structure, when the thicknesses of a GaAs layer 6 and AlGaAs 5, which constitute the super-lattice structure of the lightguide layer 4, are selected to be suitable values, the equivalent forbidden band width caused by the thickness of the lightguide layer 4 can be made small directly on the irregular surface 2 and can be made large at the outside other than said part. Thus carriers can be effectively confined within the region of the active layer directly on the irregular surface 2.