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1. 发明专利

JP2008210931A Photoelectric conversion module 有权
标题翻译：光电转换模块
公开(公告)号：JP2008210931A
公开(公告)日：2008-09-11
申请号：JP2007045142
申请日：2007-02-26
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： MAEDA FUMIHIDE , YAMADA OSAMU , AKASHI MITSUHISA , OTAKE TOSHIKAZU , ISHII HIROYOSHI
IPC分类号： H05K9/00 , H01L31/02
摘要： PROBLEM TO BE SOLVED: To reduce an assembling man-hour by facilitating the handling of an encapsulant provided between an upper case unit and a lower case unit upon combining the upper case unit and the lower case unit for a photoelectric conversion module. SOLUTION: A gasket groove 15 recessed from the side of a bottom plate 21 toward the side of a ceiling plate 11 and into which a part of a conductive gasket 30 can be entered in a state that the wide surface 33 of the conductive gasket 30 is substantially parallel to the side plate 12 is formed on the side plate 12 of the upper case unit 10. A slanted pushing surface 25 for pushing the conductive gasket 30 into the gasket groove 15 is formed on the side plate 22 of the lower case unit 20. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过组合上壳体单元和用于光电转换模块的下壳单元，便于处理设置在上壳单元和下壳单元之间的密封剂的装配工时。解决方案：从底板21的侧面朝向天花板板11的侧面凹陷的垫圈槽15，并且导电垫片30的一部分可以在导电性的垫片30基本上平行于在上壳体单元10的侧板12上形成的侧板12.在下侧的侧板22上形成用于将导电垫片30推入垫圈槽15的倾斜的推压表面25 案例单位20.版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007163739A Optical transmission module 有权
标题翻译：光传输模块
公开(公告)号：JP2007163739A
公开(公告)日：2007-06-28
申请号：JP2005358808
申请日：2005-12-13
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： ISHII HIROYOSHI , OTAKE TOSHIKAZU , YAMADA OSAMU , MAEDA FUMIHIDE , MOTOHIRO SATOSHI
IPC分类号： G02B6/42
CPC分类号： G02B6/3897 , G02B6/4292
摘要： PROBLEM TO BE SOLVED: To solve a such problem that when an optical transmission plug is connected to an optical transmission module, and any tension is applied to an optical fiber coming from the optical transmission plug, a stress is imparted to an optically coupled part of the optical transmission module, and optical transmission characteristics are deteriorated as a result.
SOLUTION: The optical transmission module having a freely movable communication module performs constantly stable optical transmission through tacking movement of an optical coupling surface and an optical axial center, when any tension is added to the optical cable after the optical transmission plug is connected.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题为了解决这样的问题，当光传输插头连接到光传输模块，并且任何张力被施加到来自光传输插头的光纤时，应力被赋予光学光传输模块的耦合部分，并且光传输特性劣化。解决方案：具有可自由移动的通信模块的光传输模块，当光传输插头连接后，当光缆被附加到任何张力时，通过光耦合表面和光轴向中心的移动来执行恒定的光传输。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2004085971A Optical transmission module 审中-公开
公开(公告)号：JP2004085971A
公开(公告)日：2004-03-18
申请号：JP2002248186
申请日：2002-08-28
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： ONO KATSUYA , KUROIWA TSUTOMU , YAMADA OSAMU , OTAKE TOSHIKAZU , TOKITA SHIGERU
IPC分类号： G02B6/42 , H01S5/022 , H01S5/024
CPC分类号： G02B6/4201 , G02B6/421 , G02B6/4246 , G02B6/4292
摘要： PROBLEM TO BE SOLVED: To provide a isolator built-in receptacle type optical transmission module having easy-to-assemble structure that realizes high-speed signal transmission and efficiently radiates the heat generated from the coaxial can package.
SOLUTION: The optical transmission module is constituted by wiring and connecting a coaxial can package in which high-speed signal transmission wiring whose characteristic impedance matches is formed on a ceramic board into which a coaxial can stem penetrates and a printed circuit board on which a peripheral circuit is mounted using a flexible printed circuit board in which the high-speed signal transmission wiring is formed in the same manner, and interposing, on the opposite side, an elastic conductive heat-conducting material or an insulating heat-conducting material between the coaxial can package and a housing in which a radiating fin is formed and the elastic conductive heat-conducting material or an insulating heat-conducting material between a circuit component mounted on the printed circuit board and the housing in which the radiating fin is formed. The module forms a fitting structure in each of a ferule and a receptacle portion of a transmission module or receiving module and can rotate to the direction of an optical axis.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2012094687A Optical transceiver 有权
标题翻译：光学收发器
公开(公告)号：JP2012094687A
公开(公告)日：2012-05-17
申请号：JP2010240822
申请日：2010-10-27
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： OMORI KOICHI , ISHII HIROYOSHI , OTAKE TOSHIKAZU , YAMADA OSAMU
IPC分类号： H05K1/18 , G02F1/03 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an optical transceiver that suppresses stress generated in an electrical connection part between an outer lead of an electro-optical component and a circuit board.SOLUTION: The optical transceiver includes: an electro-optical component 10 having an outer lead 12 for electrical connection; a circuit board 22 on which the outer lead 12 is soldered; an adhesion part 26 adhering the electro-optical component 10 to the circuit board 22; and a fixing part 28 fixing the electro-optical component 10 to the circuit board 22 strongly in comparison to the adhesion part 26. The fixing part 28 is provided away from the part on which the outer lead 12 is soldered in comparison to the adhesion part 26, and at least a part of the adhesion part 26 is provided near the part on which the outer lead 12 is soldered in comparison to fixing part 28.
摘要翻译：解决的问题：提供抑制电光部件的外引线与电路基板之间的电连接部产生的应力的光收发器。解决方案：光收发器包括：电光部件10，具有用于电连接的外引线12; 外引线12焊接在其上的电路板22; 将电光部件10粘接到电路基板22的粘接部26; 以及固定部28，与粘接部26相比，将电光部件10牢固地固定在电路基板22上。固定部28与粘接部26相比被设置为远离焊接有外引线12的部分 26，并且粘合部26的至少一部分设置在与固定部28相比焊接外部引线12的部分附近。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2005101026A Junction structure of flexible substrate, manufacturing method thereof, and high-speed optical transmission module 审中-公开
标题翻译：柔性基板的结构，其制造方法和高速光传输模块
公开(公告)号：JP2005101026A
公开(公告)日：2005-04-14
申请号：JP2003329385
申请日：2003-09-22
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： ONO KATSUYA , KATAOKA KOICHI , YAMADA OSAMU , URA NOBUYUKI , OKAYAMA SHINICHI
IPC分类号： H05K1/11 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide the junction structure of a flexible substrate that prevents excessive solder from being pushed out of an electrode pad in thermocompression bonding, secures a required amount of solder for junction, can obtain sufficient junction strength, and does not decrease high-frequency characteristics; and to provide a method for manufacturing the junction structure and a high-speed optical transmission module.
SOLUTION: When the thermocompression bonding is made via solder by using a heating/pressing tool 11, or the like from a part on a flexible substrate 1 after a group of electrode pads 9 provided on a circuit board 10 and a group of solder terminals 5 provided on the flexible substrate 1 are overlapped, a stopper structure made of a rib 8 via a dam 7 is formed at the tip of the flexible substrate. Thus press force is suppressed by allowing the rib to come into contact with the part on the circuit board in the thermocompression bonding, a solder well gap is formed between the group of electrode pads 9 on the circuit board 10 and the group of solder terminals 5 on the flexible substrate 1, hence the excessive solder is prevented from being pushed out of the electrode pad by thermocompression bonding, a required amount of solder is secured for junction, and sufficient junction strength is obtained.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供柔性基板的接合结构，防止在热压接中将过度的焊料从电极焊盘推出，确保所需量的用于接合的焊料，可以获得足够的接合强度，并且不降低高频特性; 并提供一种用于制造接合结构和高速光传输模块的方法。解决方案：在设置在电路板10上的一组电极焊盘9和一组电极板9之后，通过使用加热/加压工具11等从柔性基板1上的部分上的部件进行热压接，设置在柔性基板1上的焊接端子5重叠，在柔性基板的前端形成有通过堤坝7由肋8制成的止动结构。因此，通过在热压接中允许肋与电路板上的部分接触来抑制压力，在电路板10上的一组电极焊盘9和焊接端子组5之间形成焊料间隙在柔性基板1上，防止了通过热压接而将过量的焊料从电极焊盘推出，确保了用于接合的所需量的焊料，并且获得了足够的接合强度。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2011221541A Photoelectric conversion module 审中-公开
标题翻译：光电转换模块
公开(公告)号：JP2011221541A
公开(公告)日：2011-11-04
申请号：JP2011112123
申请日：2011-05-19
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： MAEDA FUMIHIDE , YAMADA OSAMU , AKASHI MITSUHISA , OTAKE TOSHIKAZU , ISHII HIROYOSHI
IPC分类号： G02B6/42 , G02B6/00 , H01L31/0232 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To reduce an assembly man-hour by facilitating the handling of an encapsulant provided between an upper case part and a lower case part of a photoelectric conversion module when both of them are combined.SOLUTION: A gasket groove 15 which is recessed from the side of a bottom plate 21 toward the side of a ceiling plate 11 and into which a part of a conductive gasket 30 can be put in a state that a wide surface 33 of the conductive gasket 30 is substantially parallel to a side plate 12 is formed on a side plate 12 of an upper case part 10. A slanted pushing surface 25 for pushing the conductive gasket 30 in the gasket groove 15 is formed on a side plate 22 of a lower case part 20.
摘要翻译：要解决的问题：当两者组合时，通过促进设置在光电转换模块的上壳体部分和下壳体部分之间的密封剂来减少装配工时。解决方案：从底板21侧朝向天花板板11的侧面凹陷的衬垫槽15，导电垫片30的一部分能够被放置在其中，宽的表面33 导电垫圈30基本上平行于在上壳体部件10的侧板12上形成的侧板12.在垫片槽15中的导电垫圈30的推压表面25形成在侧板22上（C）2012，JPO＆INPIT

7. 发明专利

JP2011009509A Electronic apparatus and electrical connection method 有权
标题翻译：电子装置和电气连接方法
公开(公告)号：JP2011009509A
公开(公告)日：2011-01-13
申请号：JP2009152213
申请日：2009-06-26
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： YAMADA OSAMU
IPC分类号： H05K3/34 , H01L21/60 , H05K1/14 , H05K3/36
CPC分类号： H01L2224/16225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152
摘要： PROBLEM TO BE SOLVED: To improve connection by reducing a connection failure occurring at a coupling portion which electrically connects two electrodes arranged on different two substrates and opposing each other.SOLUTION: This electronic apparatus includes: a first substrate 3 having a first electrode 50; a second substrate 4 formed on the surface with a second electrode 51 opposite to the first electrode 50; and a coupling member 2 pinched between the first electrode 50 and the second electrode 51 for connecting both the substrates. The coupling member 2 includes: an extended shell or flat extended shell resin core; and a conductive film coating the resin core, and the resin core has an air gap internally.
摘要翻译：要解决的问题：通过减少在布置在不同的两个基板上彼此相对的两个电极电连接的耦合部分处发生的连接故障来改善连接。解决方案：该电子设备包括：具有第一电极50的第一基板3; 形成在与第一电极50相对的第二电极51的表面上的第二基板4; 以及夹持在第一电极50和第二电极51之间的连接构件2，用于连接两个基板。联接构件2包括：延伸壳或扁平延伸的壳树脂芯; 以及涂覆树脂芯的导电膜，并且树脂芯在内部具有气隙。

8. 发明专利

JP2008028309A Optical transmission module 有权
标题翻译：光传输模块
公开(公告)号：JP2008028309A
公开(公告)日：2008-02-07
申请号：JP2006201888
申请日：2006-07-25
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： YOSHIMOTO KENJI , YAMADA OSAMU , OTAKE TOSHIKAZU , ISHII HIROYOSHI , MINEKAWA ISATO
IPC分类号： H01S5/022 , G02B6/42 , H01L31/0232
摘要： PROBLEM TO BE SOLVED: To provide an optical transmission module of small size and high reliability, on which an optical module is mounted. SOLUTION: The optical module 1 is mounted on a circuit board 3 via a base stem 2, and the circuit board 3 is fixed to a case 4. The lead 1c of the optical module 1 is connected, by soldering parallel to a connection pad 3a of the circuit board 3 for electrical connection. The connection surface 3b of the base stem 2 and the circuit board 3 is substantially identical with the surface of the lead connection pad 3a of the circuit board 3. Thus, the thermal stress of the lead 1c in the substrate thickness direction is relaxed for the actual optical transmission module of small size and high reliability. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供安装有光学模块的小尺寸和高可靠性的光传输模块。解决方案：光模块1通过基座2安装在电路板3上，电路板3固定在壳体4上。光模块1的引线1c通过与用于电连接的电路板3的连接垫3a。基座杆2与电路基板3的连接面3b与电路基板3的引线连接焊盘3a的表面基本相同。因此，导线1c在基板厚度方向上的热应力被放宽实际光传输模块体积小，可靠性高。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007184400A Optical transmission module and semiconductor device 有权
标题翻译：光传输模块和半导体器件
公开(公告)号：JP2007184400A
公开(公告)日：2007-07-19
申请号：JP2006001307
申请日：2006-01-06
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： MAEDA FUMIHIDE , YAMADA OSAMU , MOTOHIRO SATOSHI , HAYASHI TAKAYUKI , AKASHI MITSUHISA , TAKANO MITSUHIRO , NAKAGAWA YASUSHI
IPC分类号： H01S5/022 , H01L31/02 , H05K1/18
CPC分类号： H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve the reliability of temperature cycle of an optical transmission module, where a coaxial ceramic BGA solder ball IC is mounted.
SOLUTION: The fillet of an underfill is optimized so as to have catenarian profile as a whole by arranging a flow prevention frame 5 for an underfill 6 and optimizing the size, the Young's modulus of the underfill is set to 5 Gpa or lower, and thermal expansion coefficient is set to 20-35 ppm/°C. The entire circumference of the solder ball mounting surface is chamfered by 0.5 mm or larger, or round-chamfered by 0.2 mm or larger.
COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2003249711A OPTICAL COMMUNICATION MODULE 审中-公开
公开(公告)号：JP2003249711A
公开(公告)日：2003-09-05
申请号：JP2002049205
申请日：2002-02-26
申请人： OPNEXT JAPAN INC
发明人： MARUYAMA SHIGENOBU , KAWAMOTO KAZUTAMI , FURUICHI HIROO , YOSHIDA TORU , YOSHIDA ISAMU , ONO KATSUYA , YAMADA OSAMU , IBE MASARU , TOKITA SHIGERU , TONOZUKA TAROU
IPC分类号： H01S5/022 , H01L31/02 , H04B10/00 , H04B10/40 , H04B10/50 , H04B10/60 , H04B10/04 , H04B10/06 , H04B10/14 , H04B10/26 , H04B10/28
摘要： PROBLEM TO BE SOLVED: To increase the transmission capacity of a receptacle type optical communication module. SOLUTION: The optical communication module comprises a high-speed signal transmission wiring matched at characteristic impedance to about 50 Ω, solder connectors of a transmission can package and a receiving can package having solder connectors at one end of the wiring, and the solder connector at one end of the wiring on a ceramic board through a can stem, to place a peripheral circuit and a communication control circuit of the module in a structure in which the wiring matched at the impedance to about 50 Ω and a flexible circuit board having solder connectors at both ends of the wiring are connected between the module and the solder connector on the printed board having the connector for connecting to a mother board. COPYRIGHT: (C)2003,JPO

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