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1. 发明专利

JP2004085971A Optical transmission module 审中-公开
公开(公告)号：JP2004085971A
公开(公告)日：2004-03-18
申请号：JP2002248186
申请日：2002-08-28
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： ONO KATSUYA , KUROIWA TSUTOMU , YAMADA OSAMU , OTAKE TOSHIKAZU , TOKITA SHIGERU
IPC分类号： G02B6/42 , H01S5/022 , H01S5/024
CPC分类号： G02B6/4201 , G02B6/421 , G02B6/4246 , G02B6/4292
摘要： PROBLEM TO BE SOLVED: To provide a isolator built-in receptacle type optical transmission module having easy-to-assemble structure that realizes high-speed signal transmission and efficiently radiates the heat generated from the coaxial can package.
SOLUTION: The optical transmission module is constituted by wiring and connecting a coaxial can package in which high-speed signal transmission wiring whose characteristic impedance matches is formed on a ceramic board into which a coaxial can stem penetrates and a printed circuit board on which a peripheral circuit is mounted using a flexible printed circuit board in which the high-speed signal transmission wiring is formed in the same manner, and interposing, on the opposite side, an elastic conductive heat-conducting material or an insulating heat-conducting material between the coaxial can package and a housing in which a radiating fin is formed and the elastic conductive heat-conducting material or an insulating heat-conducting material between a circuit component mounted on the printed circuit board and the housing in which the radiating fin is formed. The module forms a fitting structure in each of a ferule and a receptacle portion of a transmission module or receiving module and can rotate to the direction of an optical axis.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2005203104A Connecting structure of hard circuit substrate and flexible board, method of connecting and circuit module using the same 有权
标题翻译：硬电路基板和柔性板的连接结构，使用其连接和电路模块的方法
公开(公告)号：JP2005203104A
公开(公告)日：2005-07-28
申请号：JP2004003746
申请日：2004-01-09
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： KATAOKA KOICHI , ONO KATSUYA , OKAYAMA SHINICHI , URA NOBUYUKI , GOTO FUMITOSHI , KAGAMI YUTAKA
IPC分类号： H01R43/02 , H01R4/02 , H05K1/14 , H05K3/34 , H05K3/36 , H01R12/06
CPC分类号： H01R12/62 , H01R4/02 , H05K3/3452 , H05K3/3473 , H05K3/363 , H05K2201/09781 , H05K2201/09909 , H05K2201/2036
摘要： PROBLEM TO BE SOLVED: To provide a connecting structure which can obtain necessary solder connecting strength, and can prevent adjacent connecting terminals from being short-circuited in the connecting structure of a hard circuit substrate having a plurality of connecting terminals and a flexible board, and to provide a method of connecting. SOLUTION: A flexible board 2 sandwiching a conductive pattern formed at the end of the connecting terminal of the same shape as the connecting terminals by an insulating flexible resin is superposed on a hard circuit substrate 1 having a plurality of the connecting terminals, and solder connected by heat press bonding. In such a structure, a solder resist 8 is provided on the insulating flexible resin on the flexible board, and further solder connected by using solder plating performed by controlling the amount of occlusion gas on one side of the hard circuit substrate and the flexible board or on both electrodes. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够获得必要的焊料连接强度的连接结构，并且可以防止相邻的连接端子在具有多个连接端子的硬质电路基板的连接结构中短路，并且可挠性并提供一种连接方法。解决方案：通过绝缘柔性树脂将形成在与连接端子相同形状的连接端子端部处的导电图案夹在柔性板2上，叠置在具有多个连接端子的硬电路基板1上，并通过热压接合进行焊接。在这样的结构中，在柔性基板上的绝缘性柔性树脂上设置阻焊剂8，通过控制硬质电路基板和柔性基板的一侧上的吸留气体的量，在两个电极上。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2005101026A Junction structure of flexible substrate, manufacturing method thereof, and high-speed optical transmission module 审中-公开
标题翻译：柔性基板的结构，其制造方法和高速光传输模块
公开(公告)号：JP2005101026A
公开(公告)日：2005-04-14
申请号：JP2003329385
申请日：2003-09-22
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： ONO KATSUYA , KATAOKA KOICHI , YAMADA OSAMU , URA NOBUYUKI , OKAYAMA SHINICHI
IPC分类号： H05K1/11 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide the junction structure of a flexible substrate that prevents excessive solder from being pushed out of an electrode pad in thermocompression bonding, secures a required amount of solder for junction, can obtain sufficient junction strength, and does not decrease high-frequency characteristics; and to provide a method for manufacturing the junction structure and a high-speed optical transmission module.
SOLUTION: When the thermocompression bonding is made via solder by using a heating/pressing tool 11, or the like from a part on a flexible substrate 1 after a group of electrode pads 9 provided on a circuit board 10 and a group of solder terminals 5 provided on the flexible substrate 1 are overlapped, a stopper structure made of a rib 8 via a dam 7 is formed at the tip of the flexible substrate. Thus press force is suppressed by allowing the rib to come into contact with the part on the circuit board in the thermocompression bonding, a solder well gap is formed between the group of electrode pads 9 on the circuit board 10 and the group of solder terminals 5 on the flexible substrate 1, hence the excessive solder is prevented from being pushed out of the electrode pad by thermocompression bonding, a required amount of solder is secured for junction, and sufficient junction strength is obtained.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供柔性基板的接合结构，防止在热压接中将过度的焊料从电极焊盘推出，确保所需量的用于接合的焊料，可以获得足够的接合强度，并且不降低高频特性; 并提供一种用于制造接合结构和高速光传输模块的方法。解决方案：在设置在电路板10上的一组电极焊盘9和一组电极板9之后，通过使用加热/加压工具11等从柔性基板1上的部分上的部件进行热压接，设置在柔性基板1上的焊接端子5重叠，在柔性基板的前端形成有通过堤坝7由肋8制成的止动结构。因此，通过在热压接中允许肋与电路板上的部分接触来抑制压力，在电路板10上的一组电极焊盘9和焊接端子组5之间形成焊料间隙在柔性基板1上，防止了通过热压接而将过量的焊料从电极焊盘推出，确保了用于接合的所需量的焊料，并且获得了足够的接合强度。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2003249711A OPTICAL COMMUNICATION MODULE 审中-公开
公开(公告)号：JP2003249711A
公开(公告)日：2003-09-05
申请号：JP2002049205
申请日：2002-02-26
申请人： OPNEXT JAPAN INC
发明人： MARUYAMA SHIGENOBU , KAWAMOTO KAZUTAMI , FURUICHI HIROO , YOSHIDA TORU , YOSHIDA ISAMU , ONO KATSUYA , YAMADA OSAMU , IBE MASARU , TOKITA SHIGERU , TONOZUKA TAROU
IPC分类号： H01S5/022 , H01L31/02 , H04B10/00 , H04B10/40 , H04B10/50 , H04B10/60 , H04B10/04 , H04B10/06 , H04B10/14 , H04B10/26 , H04B10/28
摘要： PROBLEM TO BE SOLVED: To increase the transmission capacity of a receptacle type optical communication module. SOLUTION: The optical communication module comprises a high-speed signal transmission wiring matched at characteristic impedance to about 50 Ω, solder connectors of a transmission can package and a receiving can package having solder connectors at one end of the wiring, and the solder connector at one end of the wiring on a ceramic board through a can stem, to place a peripheral circuit and a communication control circuit of the module in a structure in which the wiring matched at the impedance to about 50 Ω and a flexible circuit board having solder connectors at both ends of the wiring are connected between the module and the solder connector on the printed board having the connector for connecting to a mother board. COPYRIGHT: (C)2003,JPO

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