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1. 发明专利

JP2013008724A High dielectric insulating heat dissipation sheet and method for producing the same 审中-公开
标题翻译：高介电绝热散热片及其制造方法
公开(公告)号：JP2013008724A
公开(公告)日：2013-01-10
申请号：JP2011138558
申请日：2011-06-22
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAKAYAMA YOSHINARI , KITAGAWA DAISUKE , MATSUSHIMA RYOICHI , UOTA TOSHIO , KIYOHARA SUSUMU
IPC分类号： H01L23/36 , C08K3/24 , C08K7/00 , C08L101/12 , H01B17/56 , H01G4/20 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a high dielectric insulating sheet having high heat dissipation properties and a high dielectric constant.SOLUTION: The high dielectric insulating heat dissipation sheet includes a solvent-soluble polymer, and high dielectric constant particulates and thermally conductive particulates dispersed in the solvent-soluble polymer. The thermally conductive particulates are non-spherical. An angle between the major axis direction of the thermally conductive particulates and the thickness direction of the high dielectric insulating heat dissipation sheet is 60° or less on average.
摘要翻译：要解决的问题：提供具有高散热性和高介电常数的高介电绝缘片。解决方案：高介电绝缘散热片包括溶剂可溶性聚合物，分散在溶剂可溶性聚合物中的高介电常数微粒和导热颗粒。导热颗粒是非球形的。导热性微粒的长轴方向与高介电绝缘散热片的厚度方向的平均角度为60°以下。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013087204A Thermal-conductive sheet, led mounting substrate, and led module 有权
标题翻译：导热片，LED安装基板和LED模组
公开(公告)号：JP2013087204A
公开(公告)日：2013-05-13
申请号：JP2011229438
申请日：2011-10-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAKAYAMA YOSHINARI , HIDA TAKAFUMI , KITAGAWA DAISUKE , TAGAWA KENICHI , NAGASAKI KUNIO , MATSUSHIMA RYOICHI , KIYOHARA SUSUMU , UOTA TOSHIO
IPC分类号： C08L101/00 , C08F2/44 , C08J7/00 , C08K3/28 , C08K7/06 , C08L27/12 , C08L33/08 , C08L33/10 , C09K5/08 , H01L33/64
CPC分类号： H01L33/641 , C08L33/08 , C08L33/10 , C08L2203/20 , C09D127/12 , C09K5/14 , H01L23/3737 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , Y10T428/25 , C08L27/12 , C08L27/16 , C08K3/38 , C08K3/04 , C08F2220/1858 , C08F220/06
摘要： PROBLEM TO BE SOLVED: To provide a thermal-conductive sheet having excellent heat dissipation characteristics, in which a thermal-conductive filler is dispersed in a polymer matrix.SOLUTION: There is provided a thermal-conductive sheet in which a non-spherical thermal-conductive filler is dispersed in a polymer matrix, wherein at least a portion of the thermal-conductive filler is oriented in the thickness direction of the sheet and, when the portion of the thermal-conductive filler that has the highest degree of orientation in the thickness direction of the sheet is the orientation center and the axis passing through the orientation center and perpendicular to the sheet surface is the central axis of orientation, the thermal-conductive sheet has a portion in which the thermal-conductive filler is oriented toward one point on the central axis of orientation, and the degree of orientation of the thermal-conductive filler in the thickness direction of the sheet decreases progressively toward the peripheral edge of the sheet from the center of orientation.
摘要翻译：要解决的问题：提供具有优异的散热特性的导热片，其中导热填料分散在聚合物基质中。解决方案：提供了一种导热片，其中非球形导热填料分散在聚合物基质中，其中导热填料的至少一部分在片材的厚度方向上取向并且当在片材的厚度方向上具有最高取向度的导热填料的部分是取向中心并且通过取向中心并且垂直于片材表面的轴线是取向的中心轴线时，导热片具有导热填料朝向取向中心轴的一个点的部分，并且导热填料在片材厚度方向上的取向程度朝着周边逐渐减小从方向中心的边缘。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2010180070A High permittivity insulation sheet, and method for producing the same 有权
标题翻译：高耐受性绝缘片及其制造方法
公开(公告)号：JP2010180070A
公开(公告)日：2010-08-19
申请号：JP2009022507
申请日：2009-02-03
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KITAGAWA DAISUKE , WANO TAKASHI , MATSUSHIMA RYOICHI , TAKAYAMA YOSHINARI , UOTA TOSHIO , KIYOHARA SUSUMU
IPC分类号： C04B35/622 , C04B35/46 , C04B35/49 , H01G4/12 , H01G4/30 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a high permittivity insulation sheet with satisfactory flexibility, heat resistance and permittivity. SOLUTION: By the production method comprising: a stage (A) where a plurality of sheet-shaped formed bodies comprising polytetrafluoroethylene, high permittivity particles and a forming assistant are superimposed, and rolling is performed; and a stage (B) where, from the obtained rolled sheet, the forming assistant is removed, a high permittivity insulation sheet is produced. Preferably, the production method, after the stage (A), further comprises a stage (D) where a plurality of rolled sheets of the sheet-shaped formed bodies are superimposed, and rolling is performed, or, at least one rolled sheet in the sheet-shaped formed bodies and at least one sheet-shaped formed body comprising polytetrafluoroethylene, high permittivity particles and a forming assistant are superimposed, and rolling is performed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供具有令人满意的柔性，耐热性和介电常数的高介电常数绝缘片。＆lt; P＆gt;解决方案：通过包括以下步骤的制造方法：叠置多个包含聚四氟乙烯，高介电常数粒子和成形助剂的片状成形体的工序（A），进行轧制; 以及从所得到的轧制板上除去成形助剂的工序（B），制作高介电常数绝缘片。优选的是，在工序（A）之后的制造方法中，还具备叠层了多个成形体的多个轧制板，进行轧制的工序（D），或者，在片状成形体和至少一个包含聚四氟乙烯，高介电常数粒子和成形助剂的片状成形体重叠，进行轧制。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009010296A Heat-conductive adhesive film and method for producing the same 审中-公开
标题翻译：导热胶粘剂及其制造方法
公开(公告)号：JP2009010296A
公开(公告)日：2009-01-15
申请号：JP2007172623
申请日：2007-06-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKATSUKA YASUO , KIYOHARA SUSUMU , DODA KAZUSUKE
IPC分类号： H01L23/36 , C08K7/00 , C08L101/00 , C09J7/00 , C09J11/04
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat-conductive adhesive film superior in thermal conductivity. SOLUTION: A heat-conductive adhesive film 10 of the present invention is designed so that flat non-magnetic fillers 3, and needle-shaped non-magnetic fillers 5 are dispersed in a binder resin 1 at random, wherein the content of the needle-shaped non-magnetic fillers 5 is lower than 25 vol.%, with an overall volume of fillers as reference. Thus, thermal conductivity can be further improved by containing composite fillers of different shapes in the binder resin, as compared with the case in which fillers are contained singly. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供导热性优异的导热粘合剂膜。解决方案：本发明的导热粘合膜10被设计成使得平坦的非磁性填料3和针状非磁性填料5随机分散在粘合剂树脂1中，其中，针状非磁性填充剂5低于25体积％，填充剂的总体积为参考。因此，与单独含有填料的情况相比，通过在粘合剂树脂中含有不同形状的复合填料，能够进一步提高导热性。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2007066587A Composite material and its manufacturing method 审中-公开
标题翻译：复合材料及其制造方法
公开(公告)号：JP2007066587A
公开(公告)日：2007-03-15
申请号：JP2005248459
申请日：2005-08-29
申请人： Hitachi Ltd , Nitto Denko Corp , 日東電工株式会社 , 株式会社日立製作所
发明人： NAKATSUKA YASUO , KIYOHARA SUSUMU , TAN MICHIO , SATSUU YUUICHI
IPC分类号： H01B3/00
摘要： PROBLEM TO BE SOLVED: To provide a composite material which is useful for forming a reactive element directly on the surface or in the inside of a printed-circuit board and has a high dielectric constant, a low dielectric dissipation factor, and a high volume resistivity, and to provide its manufacturing method. SOLUTION: The composite material has inorganic particles 10 dispersed in an organic resin matrix 5, and the inorganic particles 10 are particles which are made by surface treating an insulator particle 20 by a silane-coupling agent and has an average particle size of 1 μm or smaller, and the insulator particle 20 has a surface layer 2 containing oxide. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种复合材料，其用于在印刷电路板的表面或内部直接形成反应性元件，并且具有高介电常数，低介电损耗因数和高体积电阻率，并提供其制造方法。解决方案：复合材料具有分散在有机树脂基体5中的无机颗粒10，无机颗粒10是通过硅烷偶联剂对绝缘体颗粒20进行表面处理制成的颗粒，其平均粒径为 1μm以下，绝缘子粒子20具有含有氧化物的表面层2。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2010036499A Composite film and manufacturing method therefor 有权
标题翻译：复合膜及其制造方法
公开(公告)号：JP2010036499A
公开(公告)日：2010-02-18
申请号：JP2008203467
申请日：2008-08-06
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAKAYAMA YOSHINARI , KIYOHARA SUSUMU
IPC分类号： B29C41/24 , B29L7/00 , C08J5/18 , C08K3/00 , C08L101/02
摘要： PROBLEM TO BE SOLVED: To provide a composite material having a thickness-directional high thermal conductivity, without filling highly densely a heat-conductive filler, in the composite material of the heat-conductive filler and a matrix resin.
SOLUTION: This manufacturing method of this composite film includes a process for injecting and applying a dispersion containing a photocurable resin and a dielectric filler dispersed into the resin, onto a moving support body, and a process for curing the photocurable resin, and the composite film is manufactured by a method of applying an electric field by two electrodes provided in an upstream and a downstream along a moving direction of the support body with the dispersion in a nozzle therebetween.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：在导热填料和基质树脂的复合材料中，提供具有厚度方向性高导热性，而不高密度地填充导热性填料的复合材料。解决方案：该复合膜的制造方法包括将含有分散在树脂中的光固化树脂和介电填料的分散体注入和涂布到移动的支撑体上的方法和用于固化光固化树脂的方法，以及复合膜通过沿着支撑体的移动方向设置在上游侧和下游侧的两个电极施加电场的方法制造，其间具有喷嘴。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2008285633A Composite dielectric and use thereof 有权
标题翻译：复合电介质及其用途
公开(公告)号：JP2008285633A
公开(公告)日：2008-11-27
申请号：JP2007134704
申请日：2007-05-21
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ABE MASAO , KIYOHARA SUSUMU
IPC分类号： C08L79/00 , C08K3/22 , H01B3/00 , H01B3/30 , H01B17/56 , H01B19/00 , H01G4/20
摘要： PROBLEM TO BE SOLVED: To provide a composite dielectric sheet comprising a dielectric ceramic powder with a tanδ suppressed to a low value, while raising the dielectric constant, and to provide the use thereof. SOLUTION: The composite dielectric is obtained by dispersing the dielectric ceramic powder in a polyaniline having general formula (I) (wherein, m and n represent each the molar fraction of a quinonediimine structural unit and a phenylenediamine structural unit in a repeating unit, respectively; 0≤m≤1; 0≤n≤1; and m+n is 1) as the repeating unit. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种复合电介质片，其包括具有抑制为低值的tanδ的介电陶瓷粉末，同时提高介电常数，并提供其用途。解决方案：复合电介质通过将介电陶瓷粉末分散在具有通式（I）的聚苯胺中（其中，m和n分别代表醌二亚胺结构单元的摩尔分数和重复单元中的苯二胺结构单元，0≤m≤1;0≤n≤1; m + n为1）作为重复单元。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2008000686A Dispersing method and apparatus, re-dispersing method and apparatus, and cracking method and apparatus for dispersoid 有权
标题翻译：分散方法和装置，再分散方法和装置，以及破碎方法和装置
公开(公告)号：JP2008000686A
公开(公告)日：2008-01-10
申请号：JP2006172642
申请日：2006-06-22
申请人： Kyoto Institute Of Technology , Nitto Denko Corp , 国立大学法人京都工芸繊維大学 , 日東電工株式会社
发明人： NAKATSUKA YASUO , KIYOHARA SUSUMU , TAN MICHIO , IKEDA KENICHI , TANAKA KATSUSHI , AKIYAMA RYUICHI
IPC分类号： B01F3/12 , B01F13/00 , B01F13/10 , C01B31/02 , C01G23/00 , C09C1/48 , C09C3/04
CPC分类号： B01F3/1235 , B01F3/1221 , B01F3/22 , B01F3/2238 , B01F7/00341 , B01F7/162
摘要： PROBLEM TO BE SOLVED: To provide a method for dispersing a dispersoid uniformly in a dispersion medium.
SOLUTION: The method for dispersing the dispersoid comprises a step of applying an electric field to a mixture containing the dispersion medium and the dispersoid. An apparatus for dispersing the dispersoid is provided with: a vessel 3 for housing the mixture 2 containing the dispersion medium and the dispersoid; and an electric field applying means 4 having a pair of counter electrodes 5a, 5b for applying the electric field to the mixture 2. Such the apparatus for dispersing the dispersoid can be used in the method for dispersing the dispersoid.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种将分散质均匀分散在分散介质中的方法。分散质的分散方法包括对含有分散介质和分散质的混合物施加电场的步骤。用于分散分散质的装置设有：用于容纳含有分散介质和分散质的混合物2的容器3; 以及具有用于向混合物2施加电场的一对对置电极5a，5b的电场施加装置4.这种用于分散分散质的装置可用于分散分散体的分散方法。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007332224A Sheetlike composite material and method for producing the same 有权
标题翻译：片材复合材料及其制造方法
公开(公告)号：JP2007332224A
公开(公告)日：2007-12-27
申请号：JP2006163909
申请日：2006-06-13
申请人： Kyoto Institute Of Technology , Nitto Denko Corp , 国立大学法人京都工芸繊維大学 , 日東電工株式会社
发明人： NAKATSUKA YASUO , KIYOHARA SUSUMU , TAN MICHIO , IKEDA KENICHI , TANAKA KATSUSHI , AKIYAMA RYUICHI
IPC分类号： C08L101/00 , C08K7/00 , H01B3/00 , H01B5/16 , H01R11/01
CPC分类号： B29C70/62 , B29C70/882 , B29K2105/18 , B29K2705/00 , B29K2709/02 , B29K2995/0006 , B29K2995/0013 , B29L2031/3061 , H01G4/206 , H05K1/0373 , H05K1/162 , H05K2201/0209 , H05K2201/0251 , H05K2203/105 , Y10T428/249994
摘要： PROBLEM TO BE SOLVED: To obtain a sheetlike composite material in which a filler is oriented in a fixed direction in an organic resin matrix by an electric field. SOLUTION: The sheetlike composite material 10 comprises a filler 1 and an organic resin 3. The filler 1 is aggregated in a dendritic state in the organic resin matrix and oriented in the thickness direction. Consequently the sheetlike composite material has greatly improved properties such as dielectric characteristics, conductivity, thermal conductivity, etc., in comparison with a conventional composite material in which a filler is simply dispersed. COPYRIGHT: (C)2008,JPO&INPIT

10. 发明专利

JPH11113245A THYRISTOR VALVE MODULE AND INSULATING BOLT FOR USE THEREIN 失效
公开(公告)号：JPH11113245A
公开(公告)日：1999-04-23
申请号：JP28276397
申请日：1997-09-29
申请人： NITTO DENKO CORP , MITSUBISHI ELECTRIC CORP
发明人： NISHIDA AKIHIRO , NAKANISHI MASARU , KIYOHARA SUSUMU , TAN MICHIO , FUKUSHIMA AKIO
IPC分类号： H01B17/56 , H02M1/00
摘要： PROBLEM TO BE SOLVED: To prevent corona discharge at cooling fins even during use at high voltage, by installing an electrical stress relaxing section at both the ends of each guard electrode, and electrically connecting the electrical stress reducing section with the respective cooling fins. SOLUTION: A module is formed by alternately placing thyristors 1 and cooling fins 2, installing valve reactors or the like in series, clamping them between retaining members 3 of insulator, and fastening them together using insulating bolts 4. A width L of each guard electrode 44 is made larger than a distance L' between the guard electrodes 44, and electrical stress reducing sections 45 are formed at both ends. The cooling fins 2 are electrically connected with the guard electrodes 45 using bonding wires W. Therefore, the potential of the cooling fins 2 is applied to each guard electrode 44, and thyristor voltage is exerted on between the guard electrodes 44 with creeping electrical stress acting on the surface of the resin insulating layer. Since the electrical stress reducing sections 45 are formed at the guard electrode ends, the creeping electrical stress can be reduced. As a result, the occurrence of corona discharge at the surfaces of the cooling fins can be sufficiently prevented even at high voltage.

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