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1. 发明专利

JP2008000686A Dispersing method and apparatus, re-dispersing method and apparatus, and cracking method and apparatus for dispersoid 有权
标题翻译：分散方法和装置，再分散方法和装置，以及破碎方法和装置
公开(公告)号：JP2008000686A
公开(公告)日：2008-01-10
申请号：JP2006172642
申请日：2006-06-22
申请人： Kyoto Institute Of Technology , Nitto Denko Corp , 国立大学法人京都工芸繊維大学 , 日東電工株式会社
发明人： NAKATSUKA YASUO , KIYOHARA SUSUMU , TAN MICHIO , IKEDA KENICHI , TANAKA KATSUSHI , AKIYAMA RYUICHI
IPC分类号： B01F3/12 , B01F13/00 , B01F13/10 , C01B31/02 , C01G23/00 , C09C1/48 , C09C3/04
CPC分类号： B01F3/1235 , B01F3/1221 , B01F3/22 , B01F3/2238 , B01F7/00341 , B01F7/162
摘要： PROBLEM TO BE SOLVED: To provide a method for dispersing a dispersoid uniformly in a dispersion medium.
SOLUTION: The method for dispersing the dispersoid comprises a step of applying an electric field to a mixture containing the dispersion medium and the dispersoid. An apparatus for dispersing the dispersoid is provided with: a vessel 3 for housing the mixture 2 containing the dispersion medium and the dispersoid; and an electric field applying means 4 having a pair of counter electrodes 5a, 5b for applying the electric field to the mixture 2. Such the apparatus for dispersing the dispersoid can be used in the method for dispersing the dispersoid.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种将分散质均匀分散在分散介质中的方法。分散质的分散方法包括对含有分散介质和分散质的混合物施加电场的步骤。用于分散分散质的装置设有：用于容纳含有分散介质和分散质的混合物2的容器3; 以及具有用于向混合物2施加电场的一对对置电极5a，5b的电场施加装置4.这种用于分散分散质的装置可用于分散分散体的分散方法。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007332224A Sheetlike composite material and method for producing the same 有权
标题翻译：片材复合材料及其制造方法
公开(公告)号：JP2007332224A
公开(公告)日：2007-12-27
申请号：JP2006163909
申请日：2006-06-13
申请人： Kyoto Institute Of Technology , Nitto Denko Corp , 国立大学法人京都工芸繊維大学 , 日東電工株式会社
发明人： NAKATSUKA YASUO , KIYOHARA SUSUMU , TAN MICHIO , IKEDA KENICHI , TANAKA KATSUSHI , AKIYAMA RYUICHI
IPC分类号： C08L101/00 , C08K7/00 , H01B3/00 , H01B5/16 , H01R11/01
CPC分类号： B29C70/62 , B29C70/882 , B29K2105/18 , B29K2705/00 , B29K2709/02 , B29K2995/0006 , B29K2995/0013 , B29L2031/3061 , H01G4/206 , H05K1/0373 , H05K1/162 , H05K2201/0209 , H05K2201/0251 , H05K2203/105 , Y10T428/249994
摘要： PROBLEM TO BE SOLVED: To obtain a sheetlike composite material in which a filler is oriented in a fixed direction in an organic resin matrix by an electric field. SOLUTION: The sheetlike composite material 10 comprises a filler 1 and an organic resin 3. The filler 1 is aggregated in a dendritic state in the organic resin matrix and oriented in the thickness direction. Consequently the sheetlike composite material has greatly improved properties such as dielectric characteristics, conductivity, thermal conductivity, etc., in comparison with a conventional composite material in which a filler is simply dispersed. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：通过电场获得填料在有机树脂基体中沿固定方向取向的片状复合材料。解决方案：片状复合材料10包括填料1和有机树脂3.填料1在有机树脂基体中以枝状状聚集并在厚度方向上取向。因此，与其中填充剂简单分散的常规复合材料相比，片状复合材料具有诸如介电特性，导电性，导热性等的极大改善的性能。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2003062439A Gas separation membrane and method for manufacturing the same 审中-公开
标题翻译：气体分离膜及其制造方法
公开(公告)号：JP2003062439A
公开(公告)日：2003-03-04
申请号：JP2001253106
申请日：2001-08-23
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIMAZU AKIRA , IKEDA KENICHI
IPC分类号： B01D71/64 , B01D53/22 , C08G73/10
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a gas separation membrane having excellent permeability while keeping practically high selectivity preferably with respect to acidic gas, and the gas separation membrane obtained thereby.
SOLUTION: The method for manufacturing the gas separation membrane includes a process for developing a film forming liquid, which contains 3-40 wt.% of a fluorine-containing polyimide resin, 40-95 wt.% of a glycol-based solvent with a boiling point of 120°C or higher, 1-40 wt.% of a non-alcoholic solvent with a boiling point of 85°C or lower and 1-40 wt.% of an alcoholic solvent, in a hollow or flat membrane form, a process for evaporating the solvent component from the surface of the film forming liquid and a process for immersing the developed membrane in a coagulation liquid to perform desolvation.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种制造具有优异渗透率的气体分离膜的方法，同时优选相对于酸性气体保持几乎高的选择性，以及由此获得的气体分离膜。解决方案：气体分离膜的制造方法包括显影成膜液的方法，该方法含有3-40重量％的含氟聚酰亚胺树脂，40-95重量％的二醇系溶剂，沸点为120℃以上，1-40重量％沸点为85℃以下的非醇溶剂和1-40重量％的醇溶剂，在中空或扁平膜形式，用于从成膜液体的表面蒸发溶剂成分的方法以及将显影膜浸入凝固液中进行去溶剂化的方法。

4. 发明专利

JP2006040954A Organic-inorganic complex and its manufacturing method 审中-公开
标题翻译：有机无机复合材料及其制造方法
公开(公告)号：JP2006040954A
公开(公告)日：2006-02-09
申请号：JP2004214674
申请日：2004-07-22
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IKEDA KENICHI , NAKATSUKA YASUO , MAEKAWA OSAMU , MASAKI TOSHIAKI , TADA MASATAKA
IPC分类号： H01L21/60 , C08J9/36 , C08L67/00 , C08L69/00 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide an organic-inorganic complex which is applicable to other uses by obtaining an anisotropic conductive sheet in the form which is totally different from a conventional one, and also to provide a manufacturing method of the complex.
SOLUTION: The organic-inorganic complex 1 has a separation film 10 where a plurality of through holes 11 are formed in a film formed of organic resin and inorganic particles 12 with which the through holes 11 are filled. The suitable manufacturing method of the organic-inorganic complex 1 has a process for making suspension 3 including the inorganic particles and solvent exist on one main face side of the separation film 10 where a plurality of through holes 11 are formed in the film formed of organic resin, for making solvent of suspension pass from the other main face side of the separation film 10 and sucking the inorganic particles through an auxiliary film 2 where they are substantially prevented from passing so as to fill the through holes 11 of the separation film 10 with the inorganic particles 12.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：待解决的问题：通过获得与传统方式完全不同的形式的各向异性导电片，提供适用于其它用途的有机 - 无机络合物，并提供复合物的制造方法。有机 - 无机络合物1具有分离膜10，其中在由有机树脂形成的膜中形成有多个通孔11和填充有通孔11的无机颗粒12。有机 - 无机配合物1的合适的制造方法具有在分离膜10的一个主面上形成包含无机颗粒和溶剂的悬浮液3的方法，其中在由有机 - 无机复合物形成的膜中形成多个通孔11 用于制造悬浮溶剂的树脂从分离膜10的另一个主面侧通过，并且通过辅助膜2吸附无机颗粒，在辅助膜2中基本上防止其通过，从而填充分离膜10的通孔11，无机颗粒12.版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2003017862A Manufacturing method of multilayer interconnection board 审中-公开
标题翻译：多层互连板的制造方法
公开(公告)号：JP2003017862A
公开(公告)日：2003-01-17
申请号：JP2001200332
申请日：2001-07-02
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KAWASHIMA TOSHIYUKI , TAWARA SHINJI , IKEDA KENICHI
IPC分类号： H05K3/42 , H05K3/40 , H05K3/46
CPC分类号： H05K3/462 , H05K3/4069 , H05K3/4614 , H05K3/4623 , H05K3/4626 , H05K2201/0116 , H05K2201/09536 , H05K2201/10378 , H05K2203/1147 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165 , Y10T428/31511
摘要： PROBLEM TO BE SOLVED: To provide the manufacturing method, of multilayer interconnection boards, that is advantageous for mass production, since a gap for forming an insulating layer is controlled easily, can thin the entire board, and is also advantageous to the planarization of a board surface; and to provide the multiplayer interconnection boards obtained by the manufacturing method. SOLUTION: The manufacturing method of multiplayer interconnection boards includes a process of heating and pressurizing a laminate for integration, while a plurality of double-sided wiring boards 10, where a wiring pattern 12 is formed on both the surface of an insulating layer 11 are being laminated via a prepreg 1 where a thermosetting resin, is immersed to a resin porous film.
摘要翻译：要解决的问题：为了提供有利于批量生产的多层互连板的制造方法，由于用于形成绝缘层的间隙容易地被控制，所以可以使整个板薄，并且还有利于平坦化板面; 并提供通过制造方法获得的多人互连板。解决方案：多层互连板的制造方法包括对层叠体进行加热和加压的一体化方法，而在绝缘层11的两表面上形成布线图案12的多个双面布线板10是通过将热固性树脂浸渍到树脂多孔膜中的预浸料坯1层压。

6. 发明专利

JP2003008233A Multilayer wiring board 审中-公开
标题翻译：多层接线板
公开(公告)号：JP2003008233A
公开(公告)日：2003-01-10
申请号：JP2001184567
申请日：2001-06-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MOTOGAMI MITSURU , KAWASHIMA TOSHIYUKI , TAWARA SHINJI , IKEDA KENICHI
IPC分类号： H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board, in which the density of a signal layer can be increased, because it is superior in high-frequency characteristics and a noise-resistant properties, and which hardly influences the matching of a characteristic impedance.
SOLUTION: In the multilayer wiring board comprising a structure in which a ground layer 1 or a power supply layer and the signal layer 3 are arranged via an insulation layer 2, the insulation layer 2 is constituted of a porous layer whose porosity is different in its thickness direction, and a face 2a on a side on which the porosity of the porous film is high is arranged on the side of the signal layer 3.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供信号层的密度可以提高的多层布线基板，因为它具有优异的高频特性和抗噪声性能，并且几乎不影响特性阻抗的匹配。解决方案：在包括通过绝缘层2布置接地层1或电源层和信号层3的结构的多层布线板中，绝缘层2由孔隙率不同的多孔层构成厚度方向和多孔膜的孔隙率高的一侧的面2a配置在信号层3侧。

7. 发明专利

JP2006093020A Manufacturing method of anisotropic conductive sheet 有权
标题翻译：非线性导电片的制造方法
公开(公告)号：JP2006093020A
公开(公告)日：2006-04-06
申请号：JP2004279902
申请日：2004-09-27
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MASAKI TOSHIAKI , IKEDA KENICHI , MAEKAWA OSAMU , NAKATSUKA YASUO , TADA MASATAKA
IPC分类号： H01R43/00 , H01B13/00 , H01R11/01
CPC分类号： H01R43/007 , H01L24/29 , H01L24/83 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/29355 , H01L2224/2936 , H01L2224/29439 , H01L2224/29444 , H01L2224/73204 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To lessen conductive magnetic particles left in insulating resin in manufacturing an anisotropic conductive sheet in which conductive magnetic particles are locally assembled. SOLUTION: Insulating resin 1 in a fluid state is arranged in a sheet-shaped molding die space, and conductive magnetic particles 2 are left dispersed in the insulating resin 1. A first magnetic field G1 is made to act in a sheet thickness direction on the die space at a position where a conductive path is to be formed, and the conductive magnetic particles 2a are locally assembled to form the conductive path. At the same time, a second magnetic field G2 is made to act on an intermediate region in the sheet thickness direction to move the magnetic field G2 in a lateral direction, whereby, the conductive magnetic particles 2b left in the intermediate region are moved to join the assembly at the conductive path. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了减少制造导电性磁性颗粒局部组装的各向异性导电片的绝缘树脂中残留的导电磁性颗粒。解决方案：将流体状态的绝缘树脂1布置在片状成型模具空间中，并将导电磁性颗粒2分散在绝缘树脂1中。使第一磁场G1作用在片材厚度在要形成导电路径的位置处的模具空间上的方向，并且导电磁性颗粒2a被局部组装以形成导电路径。同时，使第二磁场G2作用于板厚方向的中间区域，以沿横向方向移动磁场G2，从而使中间区域中留下的导电磁性粒子2b移动到在导电路径处的组件。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005026533A Cleaning sheet and method of cleaning substrate processor 审中-公开
标题翻译：清洁片和清洁基板处理器的方法
公开(公告)号：JP2005026533A
公开(公告)日：2005-01-27
申请号：JP2003191631
申请日：2003-07-04
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MARUOKA NOBUAKI , IKEDA KENICHI
IPC分类号： B08B1/02 , C09J7/02 , C09J201/00 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a cleaning sheet which is surely carried into a device without changing the temperature of a chuck table etc. to simply and surely remove contamination stuck to the table etc., from which the collected contamination is removed (desorbed) easily after being used for cleaning, and which shows a high contamination-removing function even after repeated use.
SOLUTION: The cleaning sheet has a cleaning layer consisting of polymeric material with shape memory ability about temperature. In particular, the cleaning sheet of the constitution has a cleaning layer on one surface of a supporter. Furthermore, the cleaning sheet of the constitution has a cleaning layer on one surface of a supporter and an adhesive layer on the other surface. In addition, a carrying member with a cleaning function is provided with the cleaning sheet of the respective constitution on a carrying member through the adhesive layer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种清洁片，其可靠地携带在设备中而不改变卡盘台的温度等，以简单且可靠地去除粘附在桌子等上的污染物，从中收集的污物被去除（解吸）容易，即使在重复使用后也显示出高的污染去除功能。解决方案：清洁片具有由具有关于温度的形状记忆能力的聚合材料组成的清洁层。特别地，构成的清洁片在支撑体的一个表面上具有清洁层。此外，构成的清洁片在支撑体的一个表面上具有清洁层，在另一个表面上具有粘合剂层。此外，具有清洁功能的承载构件在承载构件上通过粘合剂层设置有各自构造的清洁片。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2003078244A Multilayer wiring substrate and method of manufacturing the same 审中-公开
标题翻译：多层布线基板及其制造方法
公开(公告)号：JP2003078244A
公开(公告)日：2003-03-14
申请号：JP2002003067
申请日：2002-01-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IKEDA KENICHI , KAWASHIMA TOSHIYUKI , TAWARA SHINJI , OUCHI KAZUO
IPC分类号： H05K1/11 , H05K1/18 , H05K3/40 , H05K3/46
CPC分类号： H05K3/4617 , H05K1/185 , H05K3/4611 , H05K3/4647 , H05K3/4652 , H05K2201/0116 , H05K2201/0154 , H05K2201/0355 , H05K2203/0384 , H05K2203/0733 , H05K2203/1147 , Y10T29/49155 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring substrate, with which even a multilayer wiring substrate having a high count of laminated layers can be easily manufactured by simultaneously performing a unifying process to form a laminate, and problems on adhesion strength between insulating layers and problems on aligning accuracy in lamination hardly occur in the obtained multilayer wiring substrate, and to provide a multilayer wiring substrate obtained by the method. SOLUTION: This method of manufacturing a multilayer wiring substrate contains a process of impregnating a porous laminate 30, which comprises porous layers 11 of two or more layers and a wiring layer 20 interposed between the porous layers 11 and formed on either of the porous layers 11, with a raw- material composite R of thermosetting resin, and making the resin half-cured or completely cured.
摘要翻译：要解决的问题：提供一种多层布线基板的制造方法，通过同时进行一体化处理以形成层叠体，即使是能够容易地制造具有高层叠层数的多层布线基板，也存在粘合强度问题在所得到的多层布线基板中几乎不发生绝缘层与层叠对准精度的问题，提供通过该方法得到的多层布线基板。解决方案：这种制造多层布线基板的方法包括浸渍多孔层压体30的方法，该多孔层压体30包括两层或多层多孔层11和布置在多孔层11之间的布线层20，并形成在多孔层11 使用热固性树脂的原料复合物R，并使树脂半固化或完全固化。

10. 发明专利

JP2003017826A Wiring board 审中-公开
标题翻译：接线板
公开(公告)号：JP2003017826A
公开(公告)日：2003-01-17
申请号：JP2001196007
申请日：2001-06-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MOTOGAMI MITSURU , KAWASHIMA TOSHIYUKI , TAWARA SHINJI , IKEDA KENICHI
IPC分类号： H05K1/16 , H01G4/33 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a wiring board, which has a laminated structure that is simple, manufactured through a simple manufacturing process, equipped with a capacitor which can be reduced in size, and capable of improving a wiring unit in high-frequency characteristics and noise resistance properties. SOLUTION: A wiring board is equipped with a laminated structure provided with a capacitor-forming unit 21, where at least either of conductor layers 20 and 30 formed on both the sides of an insulation layer 10 forms the electrode of a capacitor and a wiring unit 22, which wires a circuit. The insulation layer 10 is formed of a composite porous film 11, and an insulation layer 10a, interposed in the capacitor-forming unit 21, is made to have a higher dielectric constant than an insulating layer 10b interposed in the wiring unit 22, depending on whether or not the porous film 11 filled up with a filler or by the kind of the filler filling the porous film 11.
摘要翻译：要解决的问题：为了提供一种布线板，其具有简单的层叠结构，其通过简单的制造工艺制造，其具有能够减小尺寸的电容器，并且能够改善高频特性的布线单元和抗噪声性能。解决方案：布线板配备有设置有电容器形成单元21的层叠结构，其中形成在绝缘层10两侧的导体层20和30中的至少一个形成电容器的电极和布线单元 22，它连接电路。绝缘层10由复合多孔膜11形成，并且设置在电容器形成单元21中的绝缘层10a具有比插入在布线单元22中的绝缘层10b更高的介电常数，这取决于多孔膜11是否填充有填料，或填充多孔膜11的填料种类。

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