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1. 发明专利

JP2009010296A Heat-conductive adhesive film and method for producing the same 审中-公开
标题翻译：导热胶粘剂及其制造方法
公开(公告)号：JP2009010296A
公开(公告)日：2009-01-15
申请号：JP2007172623
申请日：2007-06-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKATSUKA YASUO , KIYOHARA SUSUMU , DODA KAZUSUKE
IPC分类号： H01L23/36 , C08K7/00 , C08L101/00 , C09J7/00 , C09J11/04
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat-conductive adhesive film superior in thermal conductivity. SOLUTION: A heat-conductive adhesive film 10 of the present invention is designed so that flat non-magnetic fillers 3, and needle-shaped non-magnetic fillers 5 are dispersed in a binder resin 1 at random, wherein the content of the needle-shaped non-magnetic fillers 5 is lower than 25 vol.%, with an overall volume of fillers as reference. Thus, thermal conductivity can be further improved by containing composite fillers of different shapes in the binder resin, as compared with the case in which fillers are contained singly. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供导热性优异的导热粘合剂膜。解决方案：本发明的导热粘合膜10被设计成使得平坦的非磁性填料3和针状非磁性填料5随机分散在粘合剂树脂1中，其中，针状非磁性填充剂5低于25体积％，填充剂的总体积为参考。因此，与单独含有填料的情况相比，通过在粘合剂树脂中含有不同形状的复合填料，能够进一步提高导热性。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2006041044A Multilayer flexible wiring circuit board 审中-公开
标题翻译：多层柔性布线电路板
公开(公告)号：JP2006041044A
公开(公告)日：2006-02-09
申请号：JP2004216268
申请日：2004-07-23
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： YAMAGUCHI KOICHI , MOTOGAMI MITSURU , DODA KAZUSUKE
IPC分类号： H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer flexible wiring circuit board that can secure excellent flexibility in spite of high-density wiring, reduces fatigue of a conductor layer in flexing to prevent a wire from being broken, and realize high-level flexure resistance.
SOLUTION: Two flexible wiring circuit boards 2 are prepared which each have a conductor layer 3, a base insulating layer 4 laminated on one surface of the conductor layer 3, and a cover insulating layer 5 laminated on the other surface of the conductor layer 3. These layers are stacked partially across a laminated adhesive layer 8 to form an air gap 9 while base insulating layers 4 face each other, and reinforcing layers 10 are formed on external surfaces of cover insulating layers 5 at positions corresponding to ends of the air gap 9 in the flexing direction A. This multilayer flexible wiring circuit board 1 has the reinforcing plates 10 capable of receiving stress concentrating on the ends of the air gap 9 when the multilayer flexible circuit board flexes.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供尽管高密度布线可以确保优异的柔性的多层挠性布线电路板，减少了导体层弯曲时的疲劳，防止电线断裂，并实现高级抗弯曲性。解决方案：制备两个柔性布线电路板2，每个柔性布线电路板2具有层叠在导体层3的一个表面上的导体层3，基底绝缘层4和层叠在导体的另一个表面上的覆盖绝缘层5 这些层部分地层叠在层压粘合剂层8上，以形成气隙9，同时基底绝缘层4彼此面对，并且在盖绝缘层5的外表面上形成增强层10，空气间隙9沿弯曲方向A.该多层柔性布线电路板1具有能够在多层柔性电路板弯曲时在气隙9的端部上接收应力集中的加强板10。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005244004A Multilayer flexible wiring circuit board 审中-公开
标题翻译：多层柔性布线电路板
公开(公告)号：JP2005244004A
公开(公告)日：2005-09-08
申请号：JP2004053126
申请日：2004-02-27
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： YAMAGUCHI KOICHI , DODA KAZUSUKE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer flexible wiring circuit board having high density wiring and capable of attaining high bending resistance against bendings to both directions.
SOLUTION: Two flexible wiring circuit boards 2 are prepared each of which is formed with conductive layers 3, a base insulating layer 4 laminated on one surface of the conductive layer 3, and a cover insulating layer 5 laminated on the other surface of the conductive layer 3. In each flexible wiring circuit board 2, the thickness Y of the cover insulating layer 5 (and an outside adhesive layer 7) is formed so as to be thicker than the thickness X of the base insulating layer 4 (and an inside adhesive layer 6). The two flexible wiring circuit boards 1 are laminated partially through a laminated adhesive layer 8 so as to form an air gap 9 in the opposed state of respective base insulating layers 4. In the formed multilayer flexible wiring circuit board 1, high bending resistance against bendings to both the directions can be attained while securing high density wiring by the two conductive layer 3.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有高密度布线的多层柔性布线电路板，能够抵抗两个方向的弯曲获得高抗弯曲性。解决方案：制备两个柔性布线电路板2，每个柔性布线电路板2形成有导电层3，层压在导电层3的一个表面上的基底绝缘层4和层压在导电层3的另一个表面上的覆盖绝缘层5 导电层3.在每个柔性布线电路板2中，覆盖绝缘层5（和外部粘合层7）的厚度Y形成为比基底绝缘层4的厚度X厚（和在粘合剂层6内）。两个柔性布线电路板1部分地通过层压粘合剂层8层叠，以便在各个基底绝缘层4的相对状态下形成气隙9.在形成的多层柔性布线电路板1中，抗弯曲性高在通过两个导电层3确保高密度布线的同时可以获得两个方向。（C）2005年，JPO和NCIPI

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