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1. 发明专利

JP2010110153A Molded motor 有权
标题翻译：模具电机
公开(公告)号：JP2010110153A
公开(公告)日：2010-05-13
申请号：JP2008280923
申请日：2008-10-31
申请人： Panasonic Corp , パナソニック株式会社
发明人： TAKADA MASAYUKI
IPC分类号： H02K3/50 , H02K3/44 , H02K15/12
CPC分类号： H02K5/08 , H02K3/44 , H02K3/50 , H02K11/33 , H05K3/284 , H05K3/3447 , H05K2201/0251 , H05K2201/09063 , H05K2203/1316
摘要： PROBLEM TO BE SOLVED: To provide a molded motor having high quality in that the motor is durable against stress concentration due to shrinkage in molding and a tension stress in mold release, and peeling is prevented in an interface between a resin and a substrate. SOLUTION: A round hole 8 is opened between each of lands 7 and is filled with a thermosetting resin 12, a glass fiber in the thermosetting resin 12 which the round hole 8 is filled with is almost oriented in the plate thickness direction of a printed board 14, and thus, the mold motor is durable against stress concentration due to shrinkage in molding and a tension stress in mold release, and peeling is prevented from being generated in the interface between the thermosetting resin 12 and the printed board 14. In this way, the molded motor 1 is provided which ensures the high quality wherein tracking never occurs even when the motor is used in a space of high temperature and high humidity. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有高质量的模制电动机，因为电动机耐受由于模制中的收缩引起的应力集中和脱模中的拉伸应力，并且在树脂和树脂之间的界面中防止了剥离基质。解决方案：在每个焊盘7之间打开圆孔8，并且填充有热固性树脂12，填充有圆形孔8的热固性树脂12中的玻璃纤维几乎定向在板厚方向印刷电路板14，因此，模制电机耐模压成形时的应力集中和脱模时的拉伸应力耐久性，防止在热固性树脂12与印刷电路板14的界面产生剥离。以这种方式，提供了模制电动机1，其确保即使在高温高湿空间中使用电动机时也不发生跟踪的高质量。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009194039A Flexible substrate and its manufacturing method 有权
标题翻译：柔性基板及其制造方法
公开(公告)号：JP2009194039A
公开(公告)日：2009-08-27
申请号：JP2008030941
申请日：2008-02-12
申请人： Rohm Co Ltd , ローム株式会社
发明人： OKU YOSHIAKI
IPC分类号： H05K1/03 , B32B17/12
CPC分类号： H05K1/0306 , H05K1/0393 , H05K2201/0108 , H05K2201/0251 , H05K2201/0284 , Y10T428/31634
摘要： PROBLEM TO BE SOLVED: To provide a light-permeable flexible substrate with a low coefficient of thermal expansion and an improved gas barrier property, and its manufacturing method. SOLUTION: The flexible substrate 10 includes a substrate 1 formed of cellulose-based nanofibers and low-melting glass 2 provided to be impregnated in the substrate 1. In addition, the other flexible substrate 10 includes a substrate 1 formed of cellulose-based nanofibers and low-melting glass joined to one of principal planes of the substrate 1. A glass-transition temperature of the low-melting glass 2 is 300°C or lower. The flexible substrate 10 is light-permeable. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有低热膨胀系数和改进的气体阻隔性的透光柔性基板及其制造方法。解决方案：柔性基板10包括由纤维素基纳米纤维形成的基板1和浸渍在基板1中的低熔点玻璃2.此外，另一方面，柔性基板10包括由纤维素系纳米纤维形成的基板1，与基板1的主面接合的低熔点玻璃基板。低熔点玻璃2的玻璃化转变温度为300℃以下。柔性基板10是透光的。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JPWO2006038262A1 ソルダーレジスト塗料、その硬化物及びその被膜を備えたプリント配線板有权
公开(公告)号：JPWO2006038262A1
公开(公告)日：2008-05-15
申请号：JP2005509258
申请日：2004-09-30
申请人：セラミッション株式会社
发明人：正和竹本 , 正和竹本 , 内藤　貴 , 貴内藤 , 竜三金子 , 竜三金子
IPC分类号： H05K3/28
CPC分类号： H05K3/285 , H05K2201/0209 , H05K2201/0239 , H05K2201/0251 , H05K2203/161
摘要：【課題】耐熱性が高く、部品実装時には鉛フリー半田による高温度実装にも耐え、高い難燃性を有し、かつ、コストの低減した無機系のソルダーレジスト塗料、該塗料からなる硬化物及び該塗料からなる被膜を備えたプリント配線板を提供する。【解決手段】アルコキシシラン化合物の部分加水分解物と有機溶剤とからなる第一液及びアルコキシチタンと有機溶剤とからなる第二液とから構成される二液タイプのソルダーレジスト塗料において、第一液及び/又は第二液にチタン酸カリウム繊維を含有せしめたものである。第一液及び/又は第二液に、カオリン粉末、アルミナ粉末、カップリング剤処理水酸化アルミニュウム粉末、表面疎水化処理をしたフュームドシリカ粉末、エチルセルロース粉末、顔料等を含有することができる。そして、該二液タイプのソルダーレジスト塗料から形成させた硬化物及び該ソルダーレジスト塗料から形成させた被膜を備えたプリント配線板である。【選択図】なし

4. 发明专利

JP2008024788A Nanofiber sheet, method for producing the same, and fiber-reinforced composite material reinforced therewith 有权
标题翻译：纳米纤维板及其制造方法及其增强纤维增强复合材料
公开(公告)号：JP2008024788A
公开(公告)日：2008-02-07
申请号：JP2006197106
申请日：2006-07-19
申请人： Hitachi Ltd , Kyoto Univ , Mitsubishi Chemicals Corp , Nippon Telegr & Teleph Corp , Pioneer Electronic Corp , Rohm Co Ltd , パイオニア株式会社 , ローム株式会社 , 三菱化学株式会社 , 国立大学法人京都大学 , 日本電信電話株式会社 , 株式会社日立製作所
发明人： YANO HIROYUKI , ATAGI MASAYA , IFUKU SHINSUKE , ABE KENTARO , HANDA KEISHIN
IPC分类号： C08J5/04
CPC分类号： H05K1/0366 , D21H11/08 , H05K2201/0251 , H05K2201/0284 , Y10T442/2869
摘要： PROBLEM TO BE SOLVED: To inexpensively obtain a nanofiber sheet in which the constituent cellulose fiber is made fine enough by fiber-opening and has a high crystallinity and which can realize a fiber-reinforced composite material having high transparency, high modulus of elasticity, a low coefficient of linear thermal expansion, high heat resistance, flatness, and smoothness. SOLUTION: The nanofiber sheet is a nanofiber sheet principally made of crystalline cellulose and has a lignin content of 10 ppm to 10 wt.% and is characterized in that a fiber/resin composite material obtained by impregnating the nanofiber sheet with tricyclodecane dimethacrylate, subjecting the impregnated product to UV-curing at 20J/cm 2 , and heat-treating the cured product in vacuum at 160°C for 2 h and having a cured tricyclodecane dimethacrylate content of 60 wt.% and a nanofiber content of 40 wt.% satisfies the following physical properties (1) to (3): (1) a parallel light transmittance ≥70% (to light of a wavelength of 600 nm at a sheet thickness of 100μm), (2) a Young's modulus ≥5.0 GPa, and (3) a coefficient of linear thermal expansion ≤20 ppm/K. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题：为了廉价地获得通过纤维开口使构成纤维素纤维细小的纳米纤维片材，并且具有高结晶度，并且可以实现具有高透明度，高模量的纤维增强复合材料弹性，线性热膨胀系数低，耐热性，平坦度和平滑度。解决方案：纳米纤维片是主要由结晶纤维素制成并且具有10ppm至10重量％的木质素含量的纳米纤维片，其特征在于通过用三环癸烷二甲基丙烯酸酯浸渍纳米纤维片而获得的纤维/树脂复合材料，浸渍产物以20J / cm 2紫外线固化，并在160℃真空中热固化固化产物2小时，并具有固化的三环癸烷二甲基丙烯酸酯含量为60重量％并且纳米纤维含量为40重量％，满足以下物理性质（1）〜（3）：（1）平行透光率≥70％（板厚为100μm时的波长600nm的光），（ 2）杨氏模量≥5.0GPa，（3）线性热膨胀系数≤20ppm/ K。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007332224A Sheetlike composite material and method for producing the same 有权
标题翻译：片材复合材料及其制造方法
公开(公告)号：JP2007332224A
公开(公告)日：2007-12-27
申请号：JP2006163909
申请日：2006-06-13
申请人： Kyoto Institute Of Technology , Nitto Denko Corp , 国立大学法人京都工芸繊維大学 , 日東電工株式会社
发明人： NAKATSUKA YASUO , KIYOHARA SUSUMU , TAN MICHIO , IKEDA KENICHI , TANAKA KATSUSHI , AKIYAMA RYUICHI
IPC分类号： C08L101/00 , C08K7/00 , H01B3/00 , H01B5/16 , H01R11/01
CPC分类号： B29C70/62 , B29C70/882 , B29K2105/18 , B29K2705/00 , B29K2709/02 , B29K2995/0006 , B29K2995/0013 , B29L2031/3061 , H01G4/206 , H05K1/0373 , H05K1/162 , H05K2201/0209 , H05K2201/0251 , H05K2203/105 , Y10T428/249994
摘要： PROBLEM TO BE SOLVED: To obtain a sheetlike composite material in which a filler is oriented in a fixed direction in an organic resin matrix by an electric field. SOLUTION: The sheetlike composite material 10 comprises a filler 1 and an organic resin 3. The filler 1 is aggregated in a dendritic state in the organic resin matrix and oriented in the thickness direction. Consequently the sheetlike composite material has greatly improved properties such as dielectric characteristics, conductivity, thermal conductivity, etc., in comparison with a conventional composite material in which a filler is simply dispersed. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：通过电场获得填料在有机树脂基体中沿固定方向取向的片状复合材料。解决方案：片状复合材料10包括填料1和有机树脂3.填料1在有机树脂基体中以枝状状聚集并在厚度方向上取向。因此，与其中填充剂简单分散的常规复合材料相比，片状复合材料具有诸如介电特性，导电性，导热性等的极大改善的性能。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP5117746B2 Methods relating aramid filled polyimide, and it has a favorable thermal expansion properties 有权
公开(公告)号：JP5117746B2
公开(公告)日：2013-01-16
申请号：JP2007071435
申请日：2007-03-19
申请人：イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company
发明人：カナカラジャンクップサミー
IPC分类号： C09J179/08 , B32B15/088 , B32B27/20 , C08L79/08 , C09J11/08 , H05K3/28
CPC分类号： C09J179/08 , C08L77/10 , C08L2205/16 , C08L2666/20 , H05K1/0373 , H05K3/281 , H05K3/386 , H05K2201/0154 , H05K2201/0251 , H05K2201/0278 , H05K2201/068 , Y10T428/1023 , Y10T428/24917 , Y10T428/28 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , Y10T442/2361
摘要： The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall adhesive in an amount from 25 to 95 weight percent. The polyimide base polymer has a glass transition temperature (“Tg”) in a range of from about 150 to about 300° C. and typically has a coefficient of thermal expansion above 50 ppm/° C. The polyimide based adhesives of the invention also contain an aramid micro fiber filler in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide based adhesive. The fiber filler can be used to lower CTE of the overall adhesive to match (or nearly match) the CTE of other materials like metal, silicon wafers, other polymers (including polyimide) and the like.

8. 发明专利

JP2010180416A Fiber-reinforced composite material and method of production thereof, and wiring substrate 有权
标题翻译：纤维增强复合材料及其生产方法和接线基板
公开(公告)号：JP2010180416A
公开(公告)日：2010-08-19
申请号：JP2010099366
申请日：2010-04-23
申请人： Hitachi Ltd , Kyoto Univ , Mitsubishi Chemicals Corp , Nippon Telegr & Teleph Corp , Pioneer Electronic Corp , Rohm Co Ltd , パイオニア株式会社 , ローム株式会社 , 三菱化学株式会社 , 国立大学法人京都大学 , 日本電信電話株式会社 , 株式会社日立製作所
发明人： YANO HIROYUKI , SUGIYAMA JUNJI , ATAGI MASAYA , IWAMOTO SHINICHIRO , KURIHARA TAKASHI , MATSUURA TORU , HANDA KEISHIN , NAGAI AKIRA , MIWA TAKAO , TAKEZAWA YOSHITAKA
IPC分类号： C08J5/04 , B29B11/16 , B29K105/12 , C08J5/00 , G02B6/10 , G02B6/12 , G02B6/122 , G02B6/42 , H05K1/03
CPC分类号： G02B6/122 , B82Y30/00 , C08J5/005 , C08J5/04 , C08L101/00 , G02B6/10 , G02B6/4214 , G02B2006/12104 , G02B2006/12107 , H05K1/0366 , H05K2201/0108 , H05K2201/0251 , Y10T428/249924 , Y10T428/249928 , Y10T428/24994 , Y10T428/2965 , Y10T428/31518 , Y10T428/31525 , C08L2666/26
摘要： PROBLEM TO BE SOLVED: To provide a fiber-reinforced composite material in which high transparency can be always maintained without no influence of temperature conditions or wavelengths, and to which various functionalities are given by a composite of the fibers and the matrix material. SOLUTION: A fiber-reinforced composite material comprising fibers having an average fiber diameter of 4 to 200 nm, and a matrix material, and 60% or above of light transmittance of a wavelength of 400 to 700 nm in 50 μm of thickness. Due to the fiber having an average fiber diameter smaller than the wavelength of a visual light (380 to 800 nm), little refraction of the visible light by the fibers may be generated, and further, scattering loss of the visible light at the interface between the fibers and the matrix material cannot easily occur even when the temperature or wavelength is changed. Therefore, high transparency of a visible transmittance of 60% or above in 50 μm of thickness can be stably maintained. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种纤维增强复合材料，其中可以始终保持高透明度，而不受温度条件或波长的影响，并且通过纤维和基质材料的复合材料给出各种功能性。解决方案：一种纤维增强复合材料，其包含平均纤维直径为4至200nm的纤维和基质材料，并且在50μm厚度中具有400至700nm波长的透光率的60％或更高。由于纤维的平均纤维直径小于视觉光（380〜800nm）的波长，可能会产生光纤的可见光的很小的折射，另外，可见光的界面处的散射损失即使当温度或波长改变时，纤维和基质材料也不容易发生。因此，可以稳定地保持50μm厚度的可见光透射率为60％以上的高透明度。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP3928136B2 Solder resist coating, a printed wiring board having a cured product and the coating 有权
公开(公告)号：JP3928136B2
公开(公告)日：2007-06-13
申请号：JP2005509258
申请日：2004-09-30
申请人：セラミッション株式会社
发明人：貴内藤 , 正和竹本 , 竜三金子
IPC分类号： C09D185/00 , H05K3/28
CPC分类号： H05K3/285 , H05K2201/0209 , H05K2201/0239 , H05K2201/0251 , H05K2203/161

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