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    • 7. 发明专利
    • PLASMA APPARATUS FOR FORMATION OF FILM
    • JPH0878333A
    • 1996-03-22
    • JP21357194
    • 1994-09-07
    • NIPPON TELEGRAPH & TELEPHONE
    • ONO TOSHIROWATANABE IWAOSHIMADA MASARUMATSUO SEITARO
    • H01L21/205C23C14/34H01L21/203H01L21/31
    • PURPOSE: To obtain a plasma apparatus by which a film is formed highly uniformly and with high efficiency in a large-area region when a sputtering operation is performed by using ions in a plasma. CONSTITUTION: A plasma chamber 1 and a film-formation chamber 2 are evacuated to produce a high vacuum by means of an evacuation system 12. Ar gas is introduced from a gas introduction system 10. An ECR plasma is generated in the plasma chamber 1 by a magnetic field which is formed of microwaves introduced from a microwave power supply 15 via a square waveguide 4 and a microwave introduction window 3 and of electric power supplied to a magnetic coil 9 by a coil power supply 14. A rotation device 16 by which a sample stand 7 is arranged on the rotation symmetric axis of a target 11, by which the rotation symmetric axis of the sample stand 7 is tilted with reference to the rotation symmetric axis of the target 11 and which is tilted and turned in such a way that the point of intersection of the rotation symmetric axis of the target 11 with the rotation central axis of the sample stand 7 is situated in the opposite direction of the target 11 with reference to a sample substrate 8 is installed.
    • 8. 发明专利
    • THIN FILM DEPOSITION APPARATUS
    • JP2003247065A
    • 2003-09-05
    • JP2002043629
    • 2002-02-20
    • NIPPON TELEGRAPH & TELEPHONENTT AFTY CORP
    • JIN YOSHITOSHIMADA MASARUMATSUO SEITAROONO TOSHIRO
    • C23C14/35H01L21/316H01L21/318
    • PROBLEM TO BE SOLVED: To provide a thin film deposition apparatus which can deposit a thin film of high quality in a highly uniform manner at a high speed by placing a plurality of materials for film deposition in one vacuum chamber. SOLUTION: In this thin film deposition apparatus to deposit a thin film on a substrate by sputtering particles of the materials for depositing the film from a plurality of sputtering sources by using ions of plasma flow, a plasma generating means generates plasma by the electronic cyclotron resonance discharge, the axes of rotational symmetry of a target are intersected with each other on the axis of rotation of a substrate sample table in the plurality of sputtering sources, and inclined with respect to the axis of rotation of a rotary sample table, and the substrate sample table comprises a rotating means which rotates the target in an inclined manner so that the intersection of the axis of rotational symmetry of the target with the axis of rotation of the substrate sample table is located in the direction opposite to the target with respect to the sample substrate for depositing the film, and a moving means to move the substrate sample table in the vertical direction. COPYRIGHT: (C)2003,JPO