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1. 发明专利

JPH0343782B2 失效
公开(公告)号：JPH0343782B2
公开(公告)日：1991-07-03
申请号：JP16628283
申请日：1983-09-08
申请人： NARUMI CHINA CORP
发明人： KITA KATSUHIKO , FUKUDA JUNZO
IPC分类号： B32B17/06 , C03C27/10 , C04B37/00 , H01L23/02 , H01L23/10

2. 发明专利

JPH0324437B2 失效
公开(公告)号：JPH0324437B2
公开(公告)日：1991-04-03
申请号：JP13871586
申请日：1986-06-13
申请人： NARUMI CHINA CORP
发明人： FUKUDA JUNZO , NODA KUNIHARU , NISHIGAKI SUSUMU , NAKAGAWA OSAMU
IPC分类号： C04B41/87 , C04B41/88 , H05K1/03

3. 发明专利

JPH0138076B2 失效
公开(公告)号：JPH0138076B2
公开(公告)日：1989-08-10
申请号：JP11097484
申请日：1984-06-01
申请人： NARUMI CHINA CORP
发明人： NISHIGAKI SUSUMU , FUKAYA MASASHI , FUKUDA JUNZO , YANO SHINSUKE , NAKAGAWA OSAMU
IPC分类号： C04B35/638 , C03C10/00 , C04B33/26 , C04B33/32 , C04B35/111 , C04B35/64

4. 发明专利

JPH01138792A CERAMIC MULTILAYER CIRCUIT SUBSTRATE 失效
公开(公告)号：JPH01138792A
公开(公告)日：1989-05-31
申请号：JP29714887
申请日：1987-11-25
申请人： NARUMI CHINA CORP
发明人： FUKUDA JUNZO , FUKAYA MASASHI , SUGIMOTO KAZUO , NISHIGAKI SUSUMU
IPC分类号： H01B1/16 , H05K3/46
摘要： PURPOSE:To prevent a crack from occurring between through-holes so as to make the substrate in the caption high in density by a method wherein the through-holes are filled with a paste composed of metal components Ag and Pd of a specified ratio of components and an organic vehicle, which are calcined at a prescribed temperature. CONSTITUTION:A paste, which has the same calcination shrinkage factor as a ceramic green sheet 1, is composed of metal components Ag and Pd of such a ratio that Ag/Pd ratio by weight is within the range of 92/8-70/30, and a Ag-Pd metal component which is less than 1.0% in oxidation weight gain can be obtained making use of an Ag-Pd coprecipitation powder, an Ag-Pd alloy powder, or the like. The metal powder is dissolved into an organic vehicle which is composed of, for example, terpineol and ethyl cellulose dissolved into it, then well mixed and kneaded, and is filled into a through-hole 2 to be calcined at a temperature of 800-1000 deg.C. By these processes, the volume expansion due to oxidation of Pd is small in the vicinity of a through-hole conductor, therefore a circuit substrate of this design can be obtained, which is protected against a crack or a delamination, excellent in reliability and productivity, and provided with through-holes small in space between them and circuits high in density.

5. 发明专利

JPS62117394A Low temperature sintered ceramics multilayer circuit substrate 失效
公开(公告)号：JPS62117394A
公开(公告)日：1987-05-28
申请号：JP25584585
申请日：1985-11-16
申请人： Narumi China Corp
发明人： FUKUDA JUNZO , FUKAYA MASASHI , NISHIGAKI SUSUMU
IPC分类号： C04B35/111 , C04B35/10 , H05K3/28 , H05K3/46

6. 发明专利

JPH02155294A MANUFACTURE OF LOW TEMPERATURE FIRED CERAMIC MULTILAYER BOARD 失效
公开(公告)号：JPH02155294A
公开(公告)日：1990-06-14
申请号：JP30942588
申请日：1988-12-07
申请人： NARUMI CHINA CORP
发明人： KAWAMURA MITSURU , NAKAGAWA AKIRA , FUKUDA JUNZO , OTOMO SHOZO
IPC分类号： H05K3/46
摘要： PURPOSE:To reduce baking time and cost of a multilayer ceramic circuit board in which copper is employed as a wiring material by introducing a firing step in the air atmosphere particularly in case of binder removing. CONSTITUTION:Paste containing copper power having 0.05-1.0m /g of BET specific surface area as main ingredient is printed on a green tape made of a ceramic material to be fired at a lower temperature than the melting point of copper and thermoplastic resin, laminated, thermally press-adhered, and integrated unfired material is fired. It is so fired to remove binder in the air atmosphere that carbon residue becomes 600-1500ppm at a temperature of buckling point or less of glass component in the unfired material. Then, it is so sintered in a nitrogen atmosphere that carbon residue becomes 300ppm or less at 800-1000 deg.C. An example of the ceramic material includes mixture powder of glass component of CaO-(MgO)-Al2O3-SiO2-(B2O3) and Al2O3 as low temperature fired ceramic material sintered at 800-1000 deg.C.

7. 发明专利

JPS62219997A LOW TEMPERATURE BAKED CERAMIC WIRING BOARD 失效
公开(公告)号：JPS62219997A
公开(公告)日：1987-09-28
申请号：JP6279686
申请日：1986-03-20
申请人： NARUMI CHINA CORP
发明人： FUKUDA JUNZO , KAWABE HIROSHI , NISHIGAKI SUSUMU
IPC分类号： C03C3/091 , C03C8/16 , H05K3/46

8. 发明专利

JPS62117393A Low temperature sintered ceramics multilayer circuit substrate 失效
标题翻译：低温烧结陶瓷多层电路基板
公开(公告)号：JPS62117393A
公开(公告)日：1987-05-28
申请号：JP25584485
申请日：1985-11-16
申请人： Narumi China Corp
发明人： FUKUDA JUNZO , KAWABE HIROSHI , NISHIGAKI SUSUMU
IPC分类号： H05K3/46

9. 发明专利

JPH04164870A COPPER CONDUCTOR PASTE 失效
公开(公告)号：JPH04164870A
公开(公告)日：1992-06-10
申请号：JP29267090
申请日：1990-10-30
申请人： NARUMI CHINA CORP , SUMITOMO METAL IND
发明人： FUKUDA JUNZO , NAKADA YOSHIKAZU
IPC分类号： H05K1/09 , C03C3/072 , C03C8/16 , C03C8/18 , C04B37/02
摘要： PURPOSE:To provide the title paste improved in adhesiveness, comprising Cu powder, inorganic binder containing glass frit comprising PbO, SiO2, B2O3, CuO and CdO and vehicle. CONSTITUTION:Firstly, respective stock powders are mixed at specified proportion followed by heating and melting, and the resulting melt is dripped into a large amount of water and quenched, the resulting solid is filtered and dried and then ground into a glass frit with a mean particle size of 0.5-10mum composed of (1) 70-50wt.% of PbO, (2) 5-10wt.% of SiO2, (3) 10-20wt.% of B2O3, (4) 3-25wt.% of CuO, and (5) 3-15wt.% of CdO. Thence, (A) 100 pts.wt. of Cu powder with a particle size of 0.5.-10mum, (B) an inorganic binder containing 1-5 pts.wt. of the glass frit and CuO powder

10. 发明专利

JPH03285385A MANUFACTURE OF CERAMIC ELECTRONIC CIRCUIT BOARD 失效
公开(公告)号：JPH03285385A
公开(公告)日：1991-12-16
申请号：JP8725390
申请日：1990-03-31
申请人： NARUMI CHINA CORP
发明人： FUKUDA JUNZO , YOSHIKAWA SHINJI , NODA KUNIHARU
IPC分类号： H05K3/12
摘要： PURPOSE:To improve a solder wet property by applying reduction processing to copper oxide generated in the copper conductor of a substrate by using the aqueous solution of one or more kinds of hydrazine, hydrazine hydrate, formic acid, alkorubin acid and oxalic acid. CONSTITUTION:The method of manufacturing a ceramic electronic circuit substrate is disclosed wherein reduction processing by one or more kinds of aqueous solutions of hydrazine, hydrazine hydrate, formic acid, alkorubin acid and oxalic acid is applied to copper oxide generated in the copper conductor of the ceramic electronic circuit board. Even when copper oxide is generated in baking, by performing reduction using a reducing agent as described above, a copper conductor with an excellent solder wet property can be provided on the ceramic electronic circuit board. Such a ceramic electronic circuit board provided with the surface copper conductor thereon can be easily industrially manufactured. The same effect can be obtained also from the ceramic electronic circuit board provided therein with an inner layer conductor, such as W, Ag or Ag/Pd.

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