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1. 发明专利

JPH0472696A CERAMIC MULTILAYER CIRCUIT BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0472696A
公开(公告)日：1992-03-06
申请号：JP18665490
申请日：1990-07-12
申请人： NARUMI CHINA CORP
发明人： KAWAMURA MITSURU , OTOMO SHOZO , NISHIGAKI SUSUMU
IPC分类号： H05K3/40 , H05K3/42 , H05K3/46
摘要： PURPOSE:To provide ceramics of high density and high reliability by enhancing a close contact density by using a mixture of a vitreous and alumina materials having 3-8 of permittivity as the ceramics. CONSTITUTION:A ceramic multilayer body is made of vitreous and alumina materials having 3-8 of permittivity, and a conductor circuit 8 formed by a plating method is a ceramic multilayer circuit board 4 having features in which the connecting side with an inner wiring circuit is made of an Ni layer and its upper layer is made of a Cu layer. Since the body is formed of a mixture of the vitreous and alumina materials having 3-8 of permittivity, it has lower permittivity than that of high alumina porcelain and has excellent operation for accelerating a semiconductor element. Since its surface structure is dense due to the presence of the vitreous material, plating solution at the time of plating is not immersed into the bores of the board, and hence high reliability is provided.

2. 发明专利

JPH0335593A CERAMIC MULTILAYER CIRCUIT SUBSTRATE 失效
公开(公告)号：JPH0335593A
公开(公告)日：1991-02-15
申请号：JP17068289
申请日：1989-06-30
申请人： NARUMI CHINA CORP
发明人： KAWAMURA MITSURU , NISHIGAKI SUSUMU , OTOMO SHOZO
IPC分类号： H05K3/46
摘要： PURPOSE:To eliminate defects, such as discontinuity of wire, of the fitting parts of input/output connection terminals by fastening the fitting parts of inner layer conductors and said input/output connection terminals fit into through holes with electroless Cu plating, electrolytic Cu plating, and soldering. CONSTITUTION:Ceramic substrates 1 are used as the inner layer conductors of low-melting-point conductors (Ag conductors) 2 of Ag, Au, Cu, Ag-Pd, or other metal of lower melting points than W and Mo used usually. Cu conductor plating is formed on the outer upper and lower surfaces 3 and 4 of said laminated substrates and electroless Cu plating 9 and electrolytic Cu plating 11 are formed on the inner faces of I/O terminal through holes 5 leading to an outer surface by the plating method. One sides of cross-peen-shaped I/O terminals 7 to which solder 8 is stuck are fit into the plated through holes 5 and fastened by melting the solder 8. That is, the through holes and the I/O terminals are fastened to each other with plating and solder. The Ag conductors 2 of the inner layers are connected through the solder and plating at the tips of the fit I/O terminals 7.

3. 发明专利

JPH02155294A MANUFACTURE OF LOW TEMPERATURE FIRED CERAMIC MULTILAYER BOARD 失效
公开(公告)号：JPH02155294A
公开(公告)日：1990-06-14
申请号：JP30942588
申请日：1988-12-07
申请人： NARUMI CHINA CORP
发明人： KAWAMURA MITSURU , NAKAGAWA AKIRA , FUKUDA JUNZO , OTOMO SHOZO
IPC分类号： H05K3/46
摘要： PURPOSE:To reduce baking time and cost of a multilayer ceramic circuit board in which copper is employed as a wiring material by introducing a firing step in the air atmosphere particularly in case of binder removing. CONSTITUTION:Paste containing copper power having 0.05-1.0m /g of BET specific surface area as main ingredient is printed on a green tape made of a ceramic material to be fired at a lower temperature than the melting point of copper and thermoplastic resin, laminated, thermally press-adhered, and integrated unfired material is fired. It is so fired to remove binder in the air atmosphere that carbon residue becomes 600-1500ppm at a temperature of buckling point or less of glass component in the unfired material. Then, it is so sintered in a nitrogen atmosphere that carbon residue becomes 300ppm or less at 800-1000 deg.C. An example of the ceramic material includes mixture powder of glass component of CaO-(MgO)-Al2O3-SiO2-(B2O3) and Al2O3 as low temperature fired ceramic material sintered at 800-1000 deg.C.

4. 发明专利

JPH04300259A JOINING MEMBER AND JOINING 失效
公开(公告)号：JPH04300259A
公开(公告)日：1992-10-23
申请号：JP8791591
申请日：1991-03-27
申请人： NARUMI CHINA CORP
发明人： KAWAMURA MITSURU , OTOMO SHOZO , NISHIGAKI SUSUMU , UMEMOTO MINORU
IPC分类号： C04B37/00 , C04B37/02 , H01R43/02
摘要： PURPOSE:To providing a joining member having a relatively low joining temperature and excellent joining strength. CONSTITUTION:A ceramic member 2 is joined to a metallic member 21 through a solid-phase sintered layer 1 composed of metal powder 11 formed between both the members. The metallic powder 11 is a ceramic substrate comprising mixed powder of borosilicate-based glass and alumina. The metallic member is made of covar alloy (54 % Fe, 29 % Ni and 17 % Co).

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